IPC - Association Connecting Electronics Industries
适用范围
This standard establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. All BGA terminals shall meet the designated standards detailed in this document and includes such diverse terminations as solder balls. The specific standards for different terminations will therefore be appropriately matched to the particular interconnection.PurposeThe purpose of this document is to establish for the manufacturer and user of ball grid array devices@ a set of designations and expectations for product performance. Included in the product performance will be the flexibility to implement the best commercial practices.IntentThe intent is to recognize a large variety of terminal structures for a wide range of applications ranging from highest reliability computer@ space and military applications to disposable commodity applications. Subsections in this document will provide for the flexibility to meet the cost and performance requirements of the variations.Terms and DefinitionsAppendices A and B are lists of terminology and acronyms related to this standard.