This standard establishes the procedures to characterize the capability of surface mount assembly equipment in specification documents@ as well as in documentation used to verify a specific machine's placement capability conformance to the specification@ while maintaining a placement accuracy to placement speed relationship. Purpose IPC-9850 has been developed to standardize the parameters@ measurement procedures@ and the methodologies used for the specification@ evaluation@ and continuing verification of assembly equipment characterization parameters. These standardized tools shall be used to develop and report the information called out in this standard.
9850-2002由IPC - Association Connecting Electronics Industries 发布于 2002-07-01,并于 2011-12-28 实施。
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