The Round Robin Test Program had the following objectives. Determine the effectiveness of different protective coatings@ and methods of coating application@ on printed wiring boards. Coatings were to be applied over a variety of conductor patterns@ land configurations@ plated and nonplated holes@ on PWBs with and without solder mask. Provide insight into PWB solderability after various time periods in typical storage conditions@ and correlate this data with the thickness and characteristics of the coating. Determine if various patterns of conductors@ lands@ spacing and configuration contributed to the soldering characteristics.