This standard establishes the requirements for a distinctive symbol and labels to be used to identify materials that are lead-free (Pb-free) and are capable of providing Pb-free 2nd level interconnects@ and for indicating certain types of Pb-free material and the maximum assembly temperature. It also establishes the requirements for labeling a bare board if the base resin is halogen free and the type of conformal coating used after assembly.?This standard shall apply to all electronic components including passives@ connectors@ solid-state components and other devices that use solder to attach the device/ component to the board or assembly. This standard shall not apply to: ? Lead as an alloying element in steel containing up to 0.35% lead by weight@ aluminum containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.? Lead in electronic ceramic parts (e.g.@ piezoelectronic devices).?