EIA-540GAAA-1993

Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment


 

 

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标准号
EIA-540GAAA-1993
发布日期
1993年10月01日
实施日期
1999年12月28日
废止日期
中国标准分类号
/
国际标准分类号
/
发布单位
ECIA - Electronic Components Industry Association
引用标准
20
适用范围
The Burn-In Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1. b) A working voltage not exceeding 125 volts (rms) c) Current not exceeding 1 ampere per pin OBJECT The object of this detail specification is to provide all information required for the identification and quality assessment of the Bum-In Sockets for Chip Carrier Packages that are defined by EIA/JEDEC Publication 95@ MO-094. The sockets have solder tail leads. The information contained herein or by reference@ is complete and sufficient for inspect ion purposes.




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