IEC 62751-2:2014+AMD1:2019+AMD2:2023 CSV

Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems — Part 2: Modular multilevel converters

IEC 62751-2:2014+AMD1:2019+AMD2:2023 CSV 发布历史

IEC 62751-2:2014+AMD1:2019+AMD2:2023 CSV由澳大利亚标准协会 AU-SA 发布于 2023-08-28，并于 2023-08-28 实施。

IEC 62751-2:2014+AMD1:2019+AMD2:2023 CSV的历代版本如下：

• 0000年 IEC 62751-2:2014+AMD1:2019+AMD2:2023 CSV
• 2019年 IEC 62751-2:2014/AMD1:2019 修改件1.高压直流（HVDC）系统用电压源换流器（VSC）阀的功率损耗.第2部分:模块化多电平换流器
• 2014年 IEC 62751-2:2014 高压直流(HVDC)系统用电压源换流器(VSC)阀门损耗的测定. 第2部分: 模块化多电平变流器

IEC 62751-2:2014+AMD1:2019+AMD2:2023 gives the detailed method to be adopted for calculating the power losses in the valves for an HVDC system based on the "modular multi-level converter", where each valve in the converter consists of a number of self-contained, two-terminal controllable voltage sources connected in series. It is applicable both for the cases where each modular cell uses only a single turn-off semiconductor device in each switch position, and the case where each switch position consists of a number of turn-off semiconductor devices in series (topology also referred to as "cascaded two-level converter"). The main formulae are given for the two-level "half-bridge" configuration but guidance is also given as to how to extend the results to certain other types of MMC building block configuration.

标准号

IEC 62751-2:2014+AMD1:2019+AMD2:2023 CSV

发布

2023年

发布单位

澳大利亚标准协会

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IEC 62751-2:2014+AMD1:2019+AMD2:2023 CSV

 

 

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