This standard is a collection of visual quality acceptability requirements for electronic assemblies. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically@ electronic assembly standards contained a more comprehensive tutorial addressing principles and techniques. For a more complete understanding of this document's recommendations and requirements@ one may use this document in conjunction with IPC-HDBK-001@ IPC-HDBK-610@ and IPC J-STD-001. The criteria in this standard are not intended to define processes to accomplish assembly operations nor is it intended to authorize repair/modification or change of the customer's product. For instance@ the presence of criteria for adhesive bonding of components does not imply/authorize equire the use of adhesive bonding@ and the depiction of a lead wrapped clockwise around a terminal does not imply/authorize equire that all leads/wires be wrapped in the clockwise direction. IPC-A-610 has criteria outside the scope of IPC J-STD-001 defining handling@ mechanical and other workmanship requirements. Table 1-1 is a summary of related documents. IPC-HDBK-610 is a supporting document that provides information regarding the intent of this specification content and explains or amplifies the technical rationale for transition of limits through Target to Defect condition criteria. In addition@ supporting information is provided to give a broader understanding of the process considerations that are related to performance but not commonly distinguishable through visual assessment methods. The explanations provided in this companion resource should be useful in determining disposition of conditions identified as Defect@ processes associated with Process Indicators@ as well as answering questions regarding clarification in use and application for defined content of this specification. Contractual reference to this standard does not additionally impose the content of IPC-HDBK-610 unless specifically referenced in contractual documentation.