This part of IEC 62878 describes the basics of device embedding substrate. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material@ which include for example active or passive devices@ discrete components formed in the fabrication process of electronic wiring board@ and sheet formed components. The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.