62951-5-2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 5: Test method for thermal characteristics of flexible materials (Edition 1.0)
Dispositifs à semiconducteurs – Dispositifs à semiconducteurs souples et extensibles – Partie 5: Méthode d’essai pour les caractéristiques thermiques des matériaux souples (Edition 1.0)
Semiconductor devices – Flexible and stretchable semiconductor devices – Part 5: Test method for thermal characteristics of flexible materials (Edition 1.0) 是非强制性国家标准，您可以免费下载前三页
This part of IEC 62951 specifies the test method for thermal characteristics of flexible materials. This document includes terms@ definitions@ symbols@ and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.