61191-4-1998
Printed Board Assemblies - Part 4: Sectional Specification - Requirements for Terminal Soldered Assemblies (Edition 1.0)

Ensembles De Cartes Imprimees - Partie 4: Specification Intermediaire - Exigences Relatives A L?Assemblage De Bornes Par Brasage (Edition 1.0)


 

 

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标准号
61191-4-1998
发布日期
1998年08月01日
实施日期
2017年07月29日
废止日期
中国标准分类号
/
国际标准分类号
/
发布单位
IEC - International Electrotechnical Commission
引用标准
42
适用范围
This standard prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are totally terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting@ through-hole mounting@ chip mounting). Classification This specification recognizes that electrical and electronic assemblies are subject to classifications by intended end-item use. Three general end-product levels have been established to reflect differences in producibility@ complexity@ functional performance requirements@ and verification (inspection/test) frequency. These are the following: Level A: General electronic products Level B: Dedicated service electronic products Level C: High-performance electronic products The user of the assemblies is responsible for determining the level to which his product belongs. The contract shall specify the level required and indicate any exceptions or additional requirements to the parameters@ where appropriate. It should be recognized that there may be overlaps of equipment between level where appropriate (see clause 4 in IEC 61191-1).




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