62258-6-2006

Semiconductor die products – Part 6: Requirements for information concerning thermal simulation (Edition 1.0)


 

 

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标准号
62258-6-2006
发布日期
2006年08月01日
实施日期
2006年08月29日
废止日期
中国标准分类号
/
国际标准分类号
/
发布单位
IEC - International Electrotechnical Commission
引用标准
16
适用范围
This part of IEC 62258 has been developed to facilitate the production@ supply and use of semiconductor die products@ including: ? wafers; ? singulated bare die; ? die and wafers with attached connection structures; ? minimally or partially encapsulated die and wafers. This part of IEC 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die@ with or without connection structures@ and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.?




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