This procedure is to determine the ability of connector materials to withstand solvents that may be used to clean components. NOTE??The test solutions indicated herein shall be considered as test mediums only. They shall not be considered as an indication@ approval@ recommendation or acknowledgment of industry usage.
EIA-364-11B-2005由ECIA - Electronic Components Industry Association 发布于 2005-06-01,并于 2014-06-27 实施。
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