The Burn-In Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure (maximum length@ width@ and height dimensions). b) A working voltage not exceeding_ volts (rms). c) Current not exceeding_ ampere per pin. OBJECT The object of this Detail Specification is to provide all information required for the identification and quality assessment of the Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings. The sockets have solder tail leads. The information contained herein or by reference@ is complete and sufficient for inspection purposes.