KS C IEC 61249-3-3-2003(2008) 包层和涂覆的柔性(用于柔性印刷电路板)的粘合剂的无包层的非增强陶瓷材料分规范 聚酯膜:印制板和其它互连结构3-3份材料
Materials for printed boards and other interconnecting structure-Part 3-3:Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)-Adhesive coa