EIA-540FAAD-1992

Detail Specification for Multi- Package 50 Mil Pitch@ Angled Mounting Format Module Sockets for Use in Electronic Equipment


 

 

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标准号
EIA-540FAAD-1992
发布日期
1992年06月01日
实施日期
2004年11月17日
废止日期
中国标准分类号
/
国际标准分类号
/
发布单位
ECIA - Electronic Components Industry Association
引用标准
24
适用范围
The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions (See Figure 1.) b) Working voltage not to exceed 250 volts (rms). c) Current not to exceed 1.0 amperes per pin. OBJECT The object of this Detail Specification is to provide all information required using Sectional Specification EIA-540F000 as a base@ for the identification and quality assessment of Multi- Package Module Sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.




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