This standard establishes a test? method for determining whether connectors can withstand the effects of the heating and/or environment that they will be subjected to during the soldering of their terminations by solder dip@ soldering iron@ solder wave@ or reflow soldering techniques.
EIA/ECA-364-56C-2006由ECIA - Electronic Components Industry Association 发布于 2006-08-01,并于 2006-12-07 实施。
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