TM-650 2.6.10A-1997

X-Ray (Radiography)@ Multilayer Printed Wiring Printed Board Test Methods


 

 

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标准号
TM-650 2.6.10A-1997
发布日期
1997年08月01日
实施日期
2004年06月01日
废止日期
中国标准分类号
/
国际标准分类号
/
发布单位
IPC - Association Connecting Electronics Industries
引用标准
2
适用范围
This non-destructive inspection method is needed to ascertain the following conditions: a. Innerlayer shift is within acceptable tolerances. b. One or more inner layers have not been reversed. c. Drilled holes are aligned with pads to the extent that any break-out is within acceptable tolerances. d. The minimum distance between a drilled hole and a ground plane clearance is within acceptable tolerances. The test method will entail passing X-rays through the test specimen and converting the transmitted X-ray image into a visual image through the use of either X-ray film or a flouro- scopic (real time) device.Cautionary notes: The construction of the multilayer with respect to; number of layers@ thickness of copper and presence other metals such as heat sinks (e.g. Invar)@ will determine the power and sensitivity of the X-ray apparatus which can be used. All X-ray apparatus should be registered with the appropriate state or regional Radiation Control agency. A radiation safety program should be implemented.




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