Environmental testing – Part 3-12: Supporting documentation and guidance – Method to evaluate a possible lead-free solder reflow temperature profile (Edition 1.0)
This part of IEC 60068 serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products@ including a large range of package sizes (molded active electronic components@ passive components and electromechanical components). Study A addresses requirements needed in the production of automotive electronic control units (ECU). These requirements include@ but are not limited to@ measurement and production tolerances. Study B represents consumer electronics products and includes reflow oven capability@ board design and package sizes.