This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats@ including die surface@ die terminals@ and interconnection balls/bumps/lands to the next level. Purpose The purpose of this standard is to establish a family of mechanical outlines and footprints for both the device and the interconnection scheme. Interconnection ball/bump/land size@ pitch@ configuration@ coplanarity@ and associated tolerances are included in this standard.