This procedure is to determine the ability of connector materials to withstand solvents that may be used to clean components. NOTE - The test solutions indicated herein shall be considered as test mediums only. They shall not be considered as an indication@ approval@ recommendation or acknowledgment of industry usage.
EIA/ECA-364-11B-2005由ECIA - Electronic Components Industry Association 发布于 2005-06-01,并于 2010-10-22 实施。
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