This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be homogeneous@ reinforced@ or used in combination with inorganic materials; the interconnections may be single@ double@ or multilayered.Purpose The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of a specific interconnecting structure sectional standard (see 1.2) to produce detailed designs intended to mount and attach passive and active components. This standard is not intended for use as a performance specification for finished boards nor as an acceptance document for electronic assemblies. For acceptability requirements of electronic assemblies@ see IPC/EIA-J-STD- 001 and IPC-A-610. The components may be through-hole@ surface mount@ fine pitch@ ultra-fine pitch@ array mounting or unpackaged bare die. The materials may be any combination able to perform the physical@ thermal@ environmental@ and electronic function.?