These requirements apply to flexible material printed wiring board constructions (FMIC's) for use as components in flexible@ flex-to-install@ rigid@ and multilayer rigid-flex composite applications with and without stiffener and adhesive materials in devices or appliances. Together with the Standards mentioned in the Supplementary Test Procedures@ 1.3@ these requirements provide data with respect to the physical@ electrical@ flammability@ thermal@ and other properties of the FMIC under consideration and are intended to provide guidance to the fabricator@ end product manufacturer@ safety engineers and other interested parties. Compliance with these requirements does not indicate the product is acceptable for use as a component of an end product without further investigation. The singlelayer and multilayer flexible@ flex-to-install@ and multilayer rigid-flex composite constructions addressed by these requirements consist of conductors affixed to base material@ with mid-board interconnections@ and cover materials. The suitability of additional stiffener and adhesive materials@ not evaluated in accordance with Stiffener and adhesive (external bonding) materials@ 2.9@ the Stiffener bond strength test@ 5.12@ and Flammability tests@ 5.15@ are subject to the applicable end-use product construction and performance requirements. See Additional stiffener and adhesive (external bonding) materials@ 7.12@ for marking requirements for FMIC's provided with additional stiffener and adhesive materials not investigated. The requirements for rigid printed wiring boards are in the Standard for Printed Wiring Boards@ UL 796.