IEC 60748-22-1-1997
半导体器件 集成电路 第22-1部分:实行能力批准程序的膜集成电路和混合膜集成电路空白详细规范

Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

标准号

IEC 60748-22-1-1997

发布日期

1997年04月

实施日期

废止日期

无

中国标准分类号

L56

国际标准分类号

31.200

发布单位

IX-IEC

被代替标准

IEC 47A/447/FDIS-1996 IEC 60748-22-1-1991

适用范围

Semiconductor devices -Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures Characteristics and conditions of use..................................................................... Recommended methods of mounting..................................................................... Marking................................................................................................................. Ordering information.............................................................................................. Certified records of released lots........................................................................... Additional information............................................................................................ Additional or increased severities or requirements to those specified in the generic and/or sectional specification................................................................................. Inspection requirements (see tables 2 and 3 or 4 and 5)......................................... Supplement -Tables of method B..........................................................................

IEC 60748-22-1-1997系列标准