This PAS specifies the terms, definitions, symbols, quality system, assessment and verification methods, and other requirements relevant to the operation of a printed board Assembly Facility in compliance with the general requirements of the CECC System for electronic components of assessed quality.
Whereas Thchnology Approval requires that constituent added electronic components shall be CECC-approved, under the Process Approval system, printed boards and the components attached to them need not necessarily be CECC-approved items.
The use of CECC-approved added components and printed boards is recommended and where all of them are so released by the Assembly Facility under a CECC Certificate of Conformity. However, it is impractical to make the use of CECC-approved components mandatory and the wishes of the customer are of primary consideration. Where one or more non CECC-approved components are used in a specific assembly, the approved specialist Assembly Facility may release it as having been assembled using a CECC-approved process using the following wording:" This soldered printed board assembly is (or" These soldered assemblies are) released by a CECC-approved facility as having been assembled and tested using processes, methods and tested using processes, mtheods and controls meeting the requirements of CECC 200025".