BS 4584 Sec.103.2-1990
印制电路板用覆箔板.第103部分:印刷电路连接专用材料.第2节:覆铜板制造用铜箔规范
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for copper foil for use in the manufacture of copper-clad base materials
哪些标准引用了BS 4584 Sec.103.2-1990
找不到引用BS 4584 Sec.103.2-1990 印制电路板用覆箔板.第103部分:印刷电路连接专用材料.第2节:覆铜板制造用铜箔规范 的标准
