BS 6221-25-2000
印制电路板.钎焊表面安装印制板组件的检修和再加工指南

Printed wiring boards - Guide to the rework and repair of soldered surface mounted printed board assemblies


 

 

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标准号
BS 6221-25-2000
发布日期
2000年11月15日
实施日期
2000年11月15日
废止日期
中国标准分类号
L30
国际标准分类号
31.180
发布单位
GB-BSI
被代替标准
99/203718 DC-1999
适用范围
This part of BS 6221 gives guidance on the procedures to be adopted in the rework of soldered surface mounted printed board assemblies. It is applicable to activities specific to the processes used to manufacture soldered surface mounted assemblies on printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. The guidance given in the standard on rework activities is also applicable to repair. This part of BS 6221 also contains guidance on design matters where they have relevance to rework. NOTE Typical in-process surface mount rework activities to which this standard applies are shown in Figure 1.

BS 6221-25-2000系列标准





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