ANSI/ASTM F542:2007
电子元件及微电子元件封装用密封化合物发热温度的试验方法

Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

非常抱歉，我们暂时无法提供预览，您可以试试： 免费下载 ANSI/ASTM F542:2007 前三页，或者稍后再访问。

如果您需要购买此标准的全文，请联系： 。

注意： 点击下载后，生成下载文件时间比较长，请耐心等待......

标准号

ANSI/ASTM F542:2007

发布

2007年

发布单位

美国国家标准学会

 

 

被代替标准

ANSI/ASTM F542-2002

适用范围

This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached. This test method provides a means to measure the peak exothermic temperature of an encapsulating compound. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8. Note 1There is no equivalent IEC standard.

ANSI/ASTM F542:2007相似标准

推荐