IPC TM-650 2.5.5.10-2005
确定嵌入式被动材料介电常数和损失正切的高频率测试
High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials
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- 适用范围
- This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the foliowing: flexible PWB-to-glass, flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.