IPC TM-650 2.5.5.10-2005
确定嵌入式被动材料介电常数和损失正切的高频率测试
High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials
IPC TM-650 2.5.5.10-2005 发布历史
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the foliowing: flexible PWB-to-glass, flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
IPC TM-650 2.5.5.10-2005由美国电子电路和电子互连行业协会 US-IPC 发布于 2005-07-01。
IPC TM-650 2.5.5.10-2005 在中国标准分类中归属于: L90 电子技术专用材料，在国际标准分类中归属于: 31.020 电子元器件综合。
IPC TM-650 2.5.5.10-2005的历代版本如下：
- 2005年07月01日 IPC TM-650 2.5.5.10-2005 确定嵌入式被动材料介电常数和损失正切的高频率测试
- 适用范围
- This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the foliowing: flexible PWB-to-glass, flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.