IPC TM-650 2.3.23-1988
治愈(永久性)热治愈焊料口罩 修订版B 1988年2月

Cure (Permanency) Thermally Cured Solder Masks; Revision B - February 1988

作废

标准号

IPC TM-650 2.3.23-1988

发布

1988年

发布单位

美国电子电路和电子互连行业协会

 

 

适用范围

This specification covers the requirements for high speedíhigh frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or multilayer printed boards for high speedhigh frequency electrical and electronic circuits. This specification applies to material thickness defined in the specification sheets as measured over the dielectric only

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