DS/EN 60749-9/Corr.1-2004

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

DS/EN 60749-9/Corr.1-2004 发布历史

The purpose of this part of IEC 60749 is to test and verify that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test should be considered non-destructive. Electrical or mechanical rejects may be used for the purpose of this test.

DS/EN 60749-9/Corr.1-2004由丹麦标准化协会 DK-DS 发布于 2004-02-12，并于 2003-12-23 实施。

DS/EN 60749-9/Corr.1-2004在国际标准分类中归属于: 31.080.01 半导体器分立件综合。

DS/EN 60749-9/Corr.1-2004的历代版本如下：

• 2004年02月12日 DS/EN 60749-9/Corr.1-2004

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标准号

DS/EN 60749-9/Corr.1-2004

发布日期

2004年02月12日

实施日期

2003年12月23日

废止日期

无

国际标准分类号

31.080.01

发布单位

DK-DS

适用范围

The purpose of this part of IEC 60749 is to test and verify that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test should be considered non-destructive. Electrical or mechanical rejects may be used for the purpose of this test.