31.080.01 半导体器分立件综合 标准查询与下载
共找到 1414 条与 半导体器分立件综合 相关的标准，共 95 页
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopic examination of plastically encapsulated electronic components
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- 31.080.01
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- L40
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- 2024-03-15
- 实施
- 2024-07-01
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
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- 31.080.01
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- L40
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- 2024-03-15
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- 2024-07-01
Semiconductor Devices Part 16-2: Microwave Integrated Circuit Prescalers
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- 31.080.01
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- L56
- 发布
- 2023-09-07
- 实施
- 2023-09-07
Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM)
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- 31.080.01
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- 2023-09-07
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- 2024-04-01
Semiconductor Devices Part 16-5: Microwave Integrated Circuit Oscillators
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- 31.080.01
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- L56
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- 2023-09-07
- 实施
- 2024-01-01
Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage
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- 31.080.01
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- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced)
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- 31.080.01
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- 发布
- 2023-05-23
- 实施
- 2023-12-01
Mechanical and Climatic Test Methods for Semiconductor Devices Part 27: Electrostatic Discharge (ESD) Susceptibility Test Machine Model (MM)
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- 31.080.01
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- 发布
- 2023-05-23
- 实施
- 2023-12-01
Mechanical and climatic test methods for semiconductor devices Part 32: Flammability of plastic encapsulated devices (externally induced)
- ICS
- 31.080.01
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- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
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- 31.080.01
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- 发布
- 2023-05-23
- 实施
- 2023-12-01
Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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- 31.080.01
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- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
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- 31.080.01
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- 发布
- 2018-09-17
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- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
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- 31.080.01
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- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
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- 31.080.01
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- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
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- 31.080.01
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- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
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- 31.080.01
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- 发布
- 2018-09-17
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- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
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- 31.080.01
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- 发布
- 2018-09-17
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- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
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- 31.080.01
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- 发布
- 2018-09-17
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- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
- ICS
- 31.080.01
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- 发布
- 2018-09-17
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- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- ICS
- 31.080.01
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- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
