DS/EN 60749-9:2003
半导体器件 机械和气候试验方法 第9部分：标记的持久性

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

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标准号

DS/EN 60749-9:2003

发布

2003年

发布单位

丹麦标准化协会

替代标准

DS/EN 60749-9/Corr.1:2004

当前最新

DS/EN 60749-9/Corr.1:2004

 

 

适用范围

The purpose of this part of IEC 60749 is to test and verify that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test should be considered non-destructive. Electrical or mechanical rejects may be used for the purpose of this test.

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