DIN EN 62047-13:2012 半导体装置.微机电装置.第13部分:测量MEMS结构粘接强度的折弯和剪切试验方法(IEC 62047-13-2012).德文版本EN 62047-13-2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012