IEC 62047-22:2014
半导体器件. 微型机电装置. 第22部分: 柔性基板上导电薄膜机电拉伸试验方法

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

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标准号

IEC 62047-22:2014

发布

2014年

发布单位

国际电工委员会

当前最新

IEC 62047-22:2014

 

 

引用标准

IEC 62047-2:2006 IEC 62047-3:2006 IEC 62047-8:2011 ISO 527-3:1995

被代替标准

IEC 47F/186/FDIS:2014

适用范围

This part of IEC 62047 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS@ consumer products@ and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate@ whereas all other dimensions are similar to each other.

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