IEC 60191-6-13:2016
半导体装置的机械标准化.第6-13部分:小间距球栅阵列(FBGA)和小间距盘栅阵列(FLGA)用顶部开口型插座的设计指南

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

标准号

IEC 60191-6-13:2016

发布

2016年

发布单位

国际电工委员会

当前最新

IEC 60191-6-13:2016

 

 

引用标准

IEC 60191-2:1966 IEC 60191-6:2009

被代替标准

IEC 47D/878/FDIS:2016 IEC 60191-6-13:2007

适用范围

This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA.

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