GB/T 39159-2020
High purity copper alloy target for integrated circuit
- Standard No.
- GB/T 39159-2020
- Language
- Chinese
- Release Date
- 2020
- Published By
- 国家市场监督管理总局、中国国家标准化管理委员会
- Lastest
- GB/T 39159-2020
- Scope
- This standard specifies the classification, technical requirements, test methods, inspection rules and signs, `packaging, transportation, storage` quality certificates and order sheets (or contracts) for high-purity copper alloy targets for integrated circuits (hereinafter referred to as screed materials). content. This standard applies to high-purity copper-aluminum (CuAl) alloy targets and high-purity copper-manganese (CuMn) alloy targets for integrated circuit manufacturing.
GB/T 39159-2020 Referenced Document
- GB/T 14265 General rule of chemical analysis for hydrogen,oxygen,nitrogen,carbon and sulfur in metallic materials
- GB/T 36165 Determination of average grain size of metal.Electron backscatter diffraction (EBSD)method
- GB/T 8170 Rules of rounding off for numerical values & expression and judgement of limiting values
- GB/T 8651 Flaw detection method by the ultrasonic plate wave for metal plates
- YS/T 482 *， 2022-09-30 Update
- YS/T 837 Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies
GB/T 39159-2020 history
- 2020 GB/T 39159-2020 High purity copper alloy target for integrated circuit