This part specifies the standard process conditions and corresponding test conditions to be adopted for component specifications. The purpose of this standard is to enable various active or passive surface mount components that comply with this standard and comply with the corresponding component standards to be mounted on substrates and assembled using a common soldering process. Therefore, components should be classified according to the process severity level for which they are designed. This standard applies to various electronic components included in the IEC system for which surface mount applications need to be assessed.
GB/T 19405.1-2003 history
2003GB/T 19405.1-2003 Surface mounting technology-Part 1:Standard method for the specification of surface mounting components(SMDs)