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Semiconductor devices. Microelectromechanical devices. Bending test methods for thin film materials

Semiconductor devices. Microelectromechanical devices. Bending test methods for thin film materials, Total:1 items.

In the international standard classification, Semiconductor devices. Microelectromechanical devices. Bending test methods for thin film materials involves: Semiconductor devices, Electromechanical components for electronic and telecommunications equipment.

British Standards Institution (BSI), Semiconductor devices. Microelectromechanical devices. Bending test methods for thin film materials

• BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials

Others:   Semiconductor devices. Microelectromechanical devices. Bending test methods for thin film materials.