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Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices, Total:34 items.
In the international standard classification, Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices involves: Semiconductor devices, Electromechanical components for electronic and telecommunications equipment, Graphical symbols, Semiconducting materials.
International Electrotechnical Commission (IEC), Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
- IEC 62047-3:2006 Semiconductor devices - Micro electromechanical devices - Part 3: Thin film standard test piece for tensile-testing
- IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
- IEC 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Association Francaise de Normalisation, Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
- NF C96-050-3*NF EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3 : thin film standard test piece for tensile testing
- NF EN 62047-3:2006 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 3 : éprouvettes d'essai normalisée en couche mince pour l'essai de traction
- NF EN 62047-22:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 22 : méthode d'essai de traction électromécanique pour les couches minces conductrices sur des substrats souples
- NF C96-050-22*NF EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates
- NF EN 62047-8:2011 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 8 : méthode d'essai de la flexion de bandes en vue de la mesure des propriétés de traction des couches minces
German Institute for Standardization, Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
- DIN EN 62047-3:2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
- DIN EN 62047-3:2007-02 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
- DIN EN 62047-8:2011-12 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
- DIN EN 62047-22:2015-04 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
- DIN EN 62047-22:2015 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
- DIN EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
- DIN EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
European Committee for Electrotechnical Standardization(CENELEC), Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
- EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
- EN 62047-2:2006 Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials
- EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
British Standards Institution (BSI), Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
- BS EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Thin film standard test piece for tensile testing
- BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
- BS EN 62047-22:2014 Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates
- BS EN 62047-16:2015 Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films Wafer curvature and cantilever beam deflection methods
Danish Standards Foundation, Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
- DS/EN 62047-3:2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
- DS/EN 62047-2:2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
- DS/EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Lithuanian Standards Office , Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
- LST EN 62047-3-2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing (IEC 62047-3:2006)
- LST EN 62047-2-2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006)
- LST EN 62047-8-2011 Semiconductor devices - Micro-electromechanical devices -- Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
ES-UNE, Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
- UNE-EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices -- Part 3: Thin film standard test piece for tensile testing (IEC 62047-3:2006) (Endorsed by AENOR in January of 2007.)
- UNE-EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (Endorsed by AENOR in September of 2011.)
Japanese Industrial Standards Committee (JISC), Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
- JIS C 5630-3:2009 Semiconductor devices -- Micro-electromechanical devices-- Part 3: Thin film standard test piece for tensile testing
Korean Agency for Technology and Standards (KATS), Semiconductor devices - Thin film standard test pieces for tensile testing of microelectromechanical devices
- KS C IEC 62047-8:2015 Semiconductor devices ― Micro-electromechanical devices ― Part 8: Strip bending test method for tensile property measurement of thin films