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A printed circuit board

A printed circuit board, Total:403 items.

In the international standard classification, A printed circuit board involves: Printed circuits and boards, Standardization. General rules, Electrical and electronic testing, Technical drawings, Vocabularies, Graphic technology, Electronic component assemblies, Photography, Products of the chemical industry, Electrical accessories, Welding, brazing and soldering, Paints and varnishes, Insulating fluids, Electromechanical components for electronic and telecommunications equipment, Space systems and operations, Technical product documentation, Components for electrical equipment, Mechanical structures for electronic equipment, Valves, Electronic components in general, Protection against fire, Structure and structure elements, Company organization and management, Transformers. Reactors, Analytical chemistry, Rubber and plastics products.

SE-SIS, A printed circuit board

SIS SS-IEC 326:1991 Printed circuits - Printed boards
SIS SS-IEC 326-3:1991 Pnntedboards — Part 3: Design anduse of printed boards
SIS SS 401 04 91-1991 Printed circuits -Terminology
SIS SS-IEC 326-2:1991 Printed boards — Part 2: Test methods

Korean Agency for Technology and Standards (KATS), A printed circuit board

KS C 6065-1990(2000) GLOSSARY OF TERMS RELATING TO PRINTED WIRING BOARD
KS C 6485-1990(2000) GENERAL RULES FOR PRINTED WIRING BOARDS
KS C 6065-1990 GLOSSARY OF TERMS RELATING TO PRINTED WIRING BOARD
KS C 6485-1986 GENERAL RULES FOR PRINTED WIRING BOARDS
KS C 6510-1996(2001) RIGID-FLEX PRINTED BOARDS
KS C 6457-2013 Rolled copper foil for printed wiring boards
KS C 6066-1997(2012) Single and double sided printed wiring boards
KS C IEC 61188-7-2012(2022) Printed boards and printed board assemblies－Design and use－Part 7：Electronic component zero orientation for CAD library construction
KS C IEC 61188-7:2012 Printed boards and printed board assemblies－Design and use－Part 7：Electronic component zero orientation for CAD library construction
KS C 6452-1995(2000) ELECTRODEPOSITED COPPER FOIL FOR PRINTED WIRING BOARDS
KS C 6457-1997(2012) Rolled copper foil for printed wiring boards
KS C IEC 61188-5-1-2007(2022) Printed boards and printed board assemblies－Design and use－Part 5－1：Attachment(land/joint) considerations－Generic requirements
KS C 6453-1995(2000) TEST METHODS COPPER FOIL FOR PRINTED WIRING BOARDS
KS C 6471-1999(2009) Test methods for flexible printed wiring boards
KS C 6480-1990(2000) GENERAL RULES OF COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS
KS C 6512-1996(2001) MASS LAMINATION FOR MULTILAYER PRINTED WIRING BOARDS
KS C 6480-1986 GENERAL RULES OF COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS
KS C 6589-1992(1997) GENERAL RULES OF ONE-PART CONNECTORS FOR PRINTED WIRING BOARD
KS C 6589-1992 GENERAL RULES OF ONE-PART CONNECTORS FOR PRINTED WIRING BOARD
KS C 6589-1982 GENERAL RULES OF ONE-PART CONNECTORS FOR PRINTED WIRING BOARD
KS C 6473-1996(2001) TEST METHODS OF COPPER-CLAD LAMINATES FOR FLEXIBLE PRINTED WIRING BOARDS
KS C 6473-1996 TEST METHODS OF COPPER-CLAD LAMINATES FOR FLEXIBLE PRINTED WIRING BOARDS
KS C 6488-1997 FLEXIBLE PRINTED WIRING BOARDS - SINGLE-SIDED, DOUBLE-SIDED
KS C 6481-1996(2001) TEST METHODS OF COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS
KS C 6481-1986 TEST METHODS OF COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS
KS C IEC 60326-10-2003(2019)
KS C 6454-1995(2000) GENERAL RULES OF PREPREG FOR MULTILAYER PRINTED WIRING BOARDS
KS C 6459-1997(2012) TEST METHODS OF PREPREG FOR MULTILAYER PRINTED WIRING BOARDS
KS C IEC 61249-2-23-2006(2020)
KS C IEC 60603-10:2020 Connectors for frequencies below 3 MHz for use with printed boards —Part 10: Two-part connectors for printed boards for basic grid of 2.54 mm (0.1 in), inverted type
KS C IEC 61249-3-5:2003 Material for printed boards and other interconnecting structures-Part 3-5:Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)-Transfer adhesive films
KS C IEC 60603-5-2014(2019) Connectors for frequencies below 3 MHz for use with printed boards — Part 5: Edge-socket connectors and two-part connectors for double-sided printed boards with 2.54 mm(0.1 in) spacing
KS C IEC 61249-3-5:2013 Material for printed boards and other interconnecting structures－Part 3-5：Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)－Transfer adhesive films
KS C IEC 61191-4:2007 Printed board assemblies-Part 4:Sectional specification-Requirements for terminal soldered assemblies
KS C IEC 62326-14:2012 Printed boards－Part 14：Device embedded substrate－Terminology/reliability/design guide
KS C IEC 61249-3-3:2003 Materials for printed boards and other interconnecting structure-Part 3-3:Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)-Adhesive coated flexible polyester film
KS C IEC 61249-3-3:2013 Materials for printed boards and other interconnecting structure－Part 3－3：Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)－Adhesive coated flexible polyester film
KS C IEC 61191-3:2006 Printed board assemblies－Part 3：Sectional specification－Requirements for through-hole mount soldered assemblies
KS C IEC 61191-2:2006 Printed board assemblies－Part 2：Sectional specification－Requirements for surface mount soldered assemblies
KS C 6513-1997 PREPREG FOR MULTILAYER PRINTED WIRING BOARDS - MODIFIED OR UNMODIFIED POLYIMIDE RESIN - IMPREGNATED GLASS CLOTH
KS C 6455-1995(2000) COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS-GLASS FABRIC BASE, MODIFIED AND UNMODIFIED POLYIMIDE RESIN
KS C 6475-1996(2001) COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS - GLASS CLOTH SURFACES, CELLULOSE PAPER CORE, EPOXY RESIN
KS C IEC 61249-3-4:2003 Materials for printed boards and other interconnecting structure-Part 3-4:Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)-Adhesive coated flexible polyimide film
KS C IEC 61249-3-4:2013 Materials for printed boards and other interconnecting structure－Part 3－4：Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)－Adhesive coated flexible polyimide film
KS C IEC 60603-6-2014(2019) Connectors for frequencies below 3 MHz for use with printed boards — Part 6: Edge-socket connectors and printed-board connectors with 2.54 mm(0.1 in) contact spacing for single or double-sided printed
KS C IEC 60603-2-2014(2019) Connectors for frequencies below 3 MHz for use with printed boards — Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2.54 mm(0.1 in) w
KS C 6456-1995(2000) COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS-GLASS FABRIC BASE, BISMALEIMIDE/TRIAZINE/EPOXIDE
KS C IEC 61182-7-2003(2008) Printed boards－Electronic data description and transfer－Part 7：Bare board electrical test information in digital form
KS C 6474-1991(2001) COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS ( GLASS CLOTH SURFACES, NONWOVEN GLASS CORE, EPOXY RESIN )

Taiwan Provincial Standard of the People's Republic of China, A printed circuit board

CNS 10851-2000 Multilayer printed wiring boards
CNS 10850-2000 General Rules for Printed Wiring Boards
CNS 10852-2000 Methods of Test for Pinted Wiring Boards
CNS 10562-2000 Single and double side printed wiring boards
CNS 14735.3-2003 Design and use of printed boards
CNS 14735-3-2003 Design and use of printed boards
CNS 8427-1982 Glass Fiber Mat for Printed Circuit Board
CNS 14735.9-2003 Specification for flexible multilayer printed boards with through connections
CNS 14735-9-2003 Specification for flexible multilayer printed boards with through connections
CNS 14735-8-2003 Specification for single and double sided flexible printed boards with through connections
CNS 14735.8-2003 Specification for single and double sided flexible printed boards with through connections
CNS 14735-7-2003 Specification for single and double sided flexible printed boards without through connections
CNS 14735.7-2003 Specification for single and double sided flexible printed boards without through connections
CNS 12711-1990 Pin Allocations for Microprocessor Systems Using the Connector for Frequencies Below 3 MHz for Use with Printed Boards

Defense Logistics Agency, A printed circuit board

DLA QML-31032-18 NOTICE 1-2008 Printed Circuit Board/Printed Wiring Board, General Specification for
DLA MIL PRF 31032B SUPP 1-2010 PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
DLA QML-31032-QPD-2011 Printed Circuit Board/Printed Wiring Board, General Specification for
DLA QML-31032-2011 Printed Circuit Board/Printed Wiring Board, General Specification for
DLA QML-31032-QPD-2012 Printed Circuit Board/Printed Wiring Board, General Specification for
DLA QML-31032-2012 Printed Circuit Board/Printed Wiring Board, General Specification for
DLA QML-31032-18-2006 PRINTED CIRCUIT BOARD / PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
DLA QPL-55110-QPD-2010 PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
DLA QPL-55110-2010 Printed Wiring Board, Rigid, General Specification for
DLA QPL-55110-QPD-2011 PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
DLA QPL-55110-2011 Printed Wiring Board, Rigid, General Specification for
DLA QPL-55110-QPD-2012 Printed Wiring Board, Rigid, General Specification for
DLA DSCC-DWG-10012-2012 PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
DLA QPL-55110-2012 Printed Wiring Board, Rigid, General Specification for
DLA QPL-55110-QPD-2013 PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
DLA A-A-55096-1993 TRANSFORMER, PRINTED CIRCUIT POWER, 6 PIN
DLA A-A-55097 VALID NOTICE 1-2001 TRANSFORMER, PRINTED CIRCUIT POWER, 8 PIN
DLA A-A-55097-1993 TRANSFORMER, PRINTED CIRCUIT POWER, 8 PIN
DLA QPL-55110-67 NOTICE 1-2008 PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
DLA QPL-55302-105-2006 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES
DLA MIL-DTL-55302 F-2003 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES
DLA QPL-46058-87-2006 INSULATING COMPOUND, ELECTRICAL (FOR COATING PRINTED CIRCUIT ASSEMBLIES)
DLA A-A-55160 VALID NOTICE 1-2001 TRANSFORMER, PRINTED CIRCUIT POWER, 6 PIN TOP LUG TYPE
DLA A-A-55160-1993 TRANSFORMER, PRINTED CIRCUIT POWER, 6 PIN TOP LUG TYPE
DLA QPL-21097-49-2006 CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD, GENERAL PURPOSE GENERAL SPECIFICATION FOR
DLA MIL-DTL-55302/26 G-2008 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PLUG, 30 thru 140 CONTACT POSITIONS, FOR PRINTED WIRING BOARDS (.100 SQ. GRID)
DLA DSCC-DWG-89065 REV B-2003 GENERAL SPECIFICATION FOR HIGH PERFORMANCE, HIGH DENSITY, TWO PIECE PRINTED CIRCUIT BOARD CONNECTOR
DLA DSCC-DWG-86006 REV F-2002 CONNECTOR, RECEPTACLE, ELECTRICAL, COAXIAL, RADIO FREQUENCY, SERIES S-SMB, PRINTED CIRCUIT BOARD MOUNT
DLA MIL-PRF-39012/141 B VALID NOTICE 2-2012 Connectors, Receptacle, Electrical, Coaxial, Radio Frequency, Series SSMB, Printed Circuit Board Mount, Straight
DLA MIL-PRF-39012/135 C-2012 CONNECTORS, RECEPTACLE, ELECTRICAL, COAXIAL, RADIO FREQUENCY, SERIES SSMB, PRINTED CIRCUIT BOARD MOUNT, RIGHT ANGLE
DLA QPL-22710-27-2005 SWITCHES, CODE, INDICATING WHEEL (PRINTED CIRCUIT), THUMBWHEEL AND PUSH-BUTTON, GENERAL SPECIFICATION FOR
DLA MS21434 REV C-2011 SWITCHES, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, DOUBLE POLE, PRINTED CIRCUIT BOARD TERMINALS, RIGHT ANGLE MOUNT
DLA DSCC-DWG-85139 REV D-2001 CONNECTOR, RECEPTACLE, ELECTRICAL, COAXIAL, RADIO FREQUENCY, SERIES SMC, PRINTED CIRCUIT BOARD MOUNT, STRAIGHT
DLA DSCC-DWG-85140 REV E-2001 CONNECTOR, RECEPTACLE, ELECTRICAL, COAXIAL, RADIO FREQUENCY, SERIES SMC, PRINTED CIRCUIT BOARD MOUNT, RIGHT ANGLE
DLA MS21433 REV E VALID NOTICE 2-2005 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, SINGLE POLE, PRINTED CIRCUIT BOARD TERMINALS, RIGHT ANGLE MOUNT
DLA MS21433 REV E VALID NOTICE 1-2000 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, SINGLE POLE, PRINTED CIRCUIT BOARD TERMINALS, RIGHT ANGLE MOUNT
DLA MS21433 REV E-1991 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, SINGLE POLE, PRINTED CIRCUIT BOARD TERMINALS, RIGHT ANGLE MOUNT
DLA MS21434 REV B VALID NOTICE 3-2005 SWITCHES, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, DOUBLE POLE, PRINTED CIRCUIT BOARD TERMINALS, RIGHT ANGLE MOUNT
DLA MS21434 REV B VALID NOTICE 2-2000 SWITCHES, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, DOUBLE POLE, PRINTED CIRCUIT BOARD TERMINALS, RIGHT ANGLE MOUNT
DLA MS21434 REV B VALID NOTICE 1-1988 SWITCHES, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, DOUBLE POLE, PRINTED CIRCUIT BOARD TERMINALS, RIGHT ANGLE MOUNT
DLA MS21434 REV B-1981 SWITCHES, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, DOUBLE POLE, PRINTED CIRCUIT BOARD TERMINALS, RIGHT ANGLE MOUNT
DLA MIL-DTL-21097/4 G-2008 CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD COMPOSITE, RECEPTACLE, CONTACT SPACING (.200) ALTERNATE DUAL ROW, TYPE CR
DLA MS21433 REV F-2011 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, SINGLE POLE, PRINTED CIRCUIT BOARD TERMINALS, RIGHT ANGLE MOUNT
DLA MS21354 REV L VALID NOTICE 2-2005 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, SINGLE POLE, .250 MOUNTING BUSHING
DLA MS21354 REV L VALID NOTICE 1-2000 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, SINGLE POLE, .250 MOUNTING BUSHING
DLA MS21354 REV L-1991 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, SINGLE POLE, .250 MOUNTING BUSHING
DLA MS21355 REV J VALID NOTICE 2-2005 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, DOUBLE POLE, .250 MOUNTING BUSHING
DLA MS21355 REV J VALID NOTICE 1-2000 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, DOUBLE POLE, .250 MOUNTING BUSHING
DLA MS21355 REV J-1991 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, DOUBLE POLE, .250 MOUNTING BUSHING
DLA MS21356 REV H VALID NOTICE 2-2005 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, SINGLE POLE, .469 MOUNTING BUSHING
DLA MS21356 REV H VALID NOTICE 1-2000 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, SINGLE POLE, .469 MOUNTING BUSHING
DLA MS21356 REV H-1991 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, SINGLE POLE, .469 MOUNTING BUSHING
DLA MS21357 REV H VALID NOTICE 2-2005 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, DOUBLE POLE, .469 MOUNTING BUSHING
DLA MS21357 REV H VALID NOTICE 1-2000 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, DOUBLE POLE, .469 MOUNTING BUSHING
DLA MS21357 REV H-1991 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, DOUBLE POLE, .469 MOUNTING BUSHING
DLA MS21354 REV M-2011 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, SINGLE POLE, .250 MOUNTING BUSHING
DLA MS21356 REV J-2011 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, SINGLE POLE, .469 MOUNTING BUSHING
DLA MS21357 REV J-2011 SWITCH, TOGGLE, POSITIVE BREAK, MINIATURE, TOGGLE SEALED, PRINTED CIRCUIT BOARD TERMINALS, DOUBLE POLE, .469 MOUNTING BUSHING
DLA MIL-DTL-32385 SUPP 1-2011 CONNECTOR, RECEPTACLES, PLUGS, ADAPTER, USED ON ELECTROLUMINESCENT, EMBEDDED, AND PRINTED CIRCUIT BOARD LAMP LIGHTING PANELS
DLA QPL-32385-2011 Connector, Receptacles, Plugs, Adapter, used on Electroluminescent, Embedded, and Printed Circuit Board Lamp Lighting Panels
DLA QPL-32385-2013 Connector, Receptacles, Plugs, Adapter, Used on Electroluminescent, Embedded, and Printed Circuit Board Lamp Lighting Panels

U.S. Military Regulations and Norms, A printed circuit board

ARMY MIL-P-55326 A-1978 PRINTED CIRCUIT BOARD PL-1208/VRC
ARMY MIL-C-63371/7A (1)-1991 P.C. BOARD 9290652 (LOAD AND UNLOAD LEFT& RIGHT)
ARMY MIL-C-63371/7A-1981 P.C. BOARD 9290652 (LOAD AND UNLOAD LEFT& RIGHT)

Association Francaise de Normalisation, A printed circuit board

NF C93-718:1984 Electronic components. Printed wiring. Design and use of printed boards. Design of solder mask coating.
NF EN 60097:1994 Systèmes de grille pour circuits imprimés
NF C93-711-1-2*NF EN 61188-1-2:2000 Printed boards and printed board assemblies - Design and use - Part 1-2 : generic requirements - Controlled impedance
NF C93-708*NF EN 62326-4:1998 Printed boards. Part 4 : rigid multilayer printed boards with interlayer connections. Sectional specification.
NF C93-713:1989 Electronic components. Printed boards. General requirements.
NF C93-702:1991 Electronic components. Printed boards. Test methods.
NF C93-707*NF EN 62326-1:2002 Printed boards - Part 1 : generic specification
NF EN 62326-20:2016 Cartes imprimées - Partie 20 : cartes de circuits imprimés destinées aux LED à haute luminosité
NF C93-700:1982 Printed boards of assessed quality. Generic specification.
NF C93-714:1975 Components for electronic equipment. Printed circuits. Woven glass fabric impregnated with expoxid resin for printed boards.
NF C93-740:1987 Printed boards. Mass lamination panels. General requirements.
NF L90-200-70-12*NF EN 16602-70-12:2018 Space product assurance - Design rules for printed circuit boards
NF EN IEC 61188-6-2:2021 Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-2 : conception de la zone de report - Description de la zone de report pour les composants montés en surface (CMS) les plus courants
NF C93-708-1*NF EN 62326-4-1:1998 Printed boards. Part 4 : rigid multilayer printed boards with interlayer connections. Sectional specification. Section 1 : capability detail specification performance levels A, B and C.
NF EN 60603-6:1998 Connecteurs pour fréquences inférieures à 3 MHz pour utilisation avec cartes imprimées - Partie 6 : connecteurs encartables et pour cartes imprimées à écartement des contacts de 2,54 mm (0,1 in) pour cartes imprimées simple ou double face, ayan...
NF EN 16602-70-12:2018 Assurance produit des projets spatiaux - Règles de conception des circuits imprimés
NF C93-706:1983 Electronic components. Printed boards of assessed quality. Multilayer printed boards. Sectional specification.
NF C93-733*NF EN 61189-3:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3 : test methods for interconnection structures (printed boards)
NF C83-401:1987 Electronic Components Two parts and edge socket connectors for printed board application
NF C93-791-2-2*NF EN 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2 : sectional requirements for implementation of printed board fabrication data description
NF EN 16602-70-60:2019 Assurance produit des projets spatiaux - Qualification et approvisionnement des circuits imprimés
NF C93-406-4-100*NF EN 61076-4-100:2002 Connectors for electronic equipment - Part 4-100 : printed board connectors with assessed quality - Detail specification for two-part connector modules having a grid of 2,5 mm for printed boards and backplanes.
NF EN 60603-13:1998 Connecteurs pour fréquences inférieures à 3 MHz pour utilisation avec cartes imprimées - Partie 13 : spécification particulière pour les connecteurs en deux parties, sous assurance de la qualité pour cartes imprimées pour grille de base de 2,54...
NF C93-715:1981 Electronic components printed boards. Characteristics and acceptance inspection of a production master.
NF C93-430-8*NF EN 60603-8:1998 Connectors for frequencies below 3 MHz for use with printed boards. . Part 8 : two-parts connectors for printed boards, for basic grid of 2,54 mm (0,1 in) with square male contacts of 0,63 mm X 0,63 mm.
NF L90-200-70-28*NF EN 16602-70-28:2016 Space product assurance - Repair and modification of printed circuit board assemblies for space use
NF C93-716:1983 Electronic components. Printed boards. Conductors continuity and short circuit. Automatic testing. General requirements.
NF C93-430-3*NF EN 60603-3:1998 Connectors for frequencies below 3 MHz for use with printed boards. . Part 3 : two-part connectors for printed boards, having contacts spaced at 2,54 mm (0,1 in) centres and staggered terminations at that same spacing.
NF C93-770-3-5*NF EN 61249-3-5:2002 Materials for printed boards and other interconnecting structures - Part 3-5 : sectional specification set for unreinforced base materials, clad and unclad (intented for flexible printed boards) - Transfer adhesive films.
NF C93-722:1980 Circuits imprimés - Réparation des cartes imprimées équipées
NF C90-706*NF EN 61191-4:1999 Printed board assemblies - Part 4 : sectional specification - Requirements for terminal soldered assemblies
NF EN 61076-4-101:2002 Connecteurs pour équipements électroniques - Partie 4-101 : Connecteurs pour cartes imprimées sous assurance de la qualité - Spécification particulière pour modules de connecteurs en deux parties au pas de base de 2,0 mm, pour cartes imprimées e...
NF C93-406-4-101*NF EN 61076-4-101:2002 Connectors for electronic equipment - Part 4-101 : printed board connectors with assessed quality - Detail specification for two-part connector modules, having a basic grid of 2,0 mm for printed boards and blackplanes in accordance with IEC 60917
NF C90-712-1*NF EN 61193-1:2002 Quality assessment systems - Part 1 : registration and analysis of defects on printed board assemblies.
NF C90-705:2000 Printed board assemblies - Part 3 : sectional specification - Requirements for through-hole mount soldered assemblies.
NF C90-704:2000 Printed board assemblies - Part 2 : sectional specification - Requirements for surface mount soldered assemblies.
NF C90-704:2014 Printed board assemblies - Part 2 : sectional specification - Requirements for surface mount soldered assemblies
NF EN 61191-3:2017 Ensembles de cartes imprimées - Partie 3 : spécification intermédiaire - Exigences relatives à l'assemblage par brasage de trous traversants
NF EN 61191-2:2020 Ensembles de cartes imprimées - Partie 2 : spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface
NF C93-430-2*NF EN 60603-2:1999 Connectors for frequencies below 3 MHz for use with printed boards. Part 2 : detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0.1 in) with common mounting features.
NF EN 60603-3:1998 Connecteurs pour fréquences inférieures à 3 MHz pour utilisation avec cartes imprimées - Partie 3 : connecteurs enfichables à deux rangées pour cartes imprimées dont les contacts sont au pas de 2,54 mm (0,1 in) et les sorties décalées du même...
NF EN 61191-6:2010 Ensembles de cartes imprimées - Partie 6 : critères d'évaluation des vides dans les joints brasés des boîtiers BGA et LGA et méthode de mesure
NF C93-429-1:1986 Electronic Components Connecting devices Multicontact board mounted connectors for printed boards with 2,54 mm spacing Type HE 11

RU-GOST R, A printed circuit board

GOST R 51040-1997 Printed boards. Grid systems
GOST R 56251-2014 Printed circuit boards. Classification of defects
GOST 23752.1-1992 Printed circuit boards. Test methods
GOST 10317-1979 Printed circuit boards. Basic dimensions
GOST 27200-1987 Printed circuit boards. Rules of repair work
GOST 2.417-1991 Unified system for design documentation. Printed circuit boards. Rules for making drawings
GOST 20406-1975 Printed boards. Terms and definitions
GOST R 53386-2009 Printed circuit boards. Terms and definitions
GOST 23752-1979 Printed circuit boards. General specifications
GOST R 51039-1997 Printed boards. Requirements for rework and repair
GOST R 53429-2009 Printed circuit boards. Basic parameters of structure
GOST 23751-1986 Printed circuit boards. Basic parameters of structure
GOST 26246.14-1991 Foil-clad electrical insulating materials for manufacture of printed plates. Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards. Specifications
GOST R 50626-1993 Printed boards. Basic rules for composition of specifications
GOST R 53432-2009 Printed circuit boards. General technical requirements for manufacture
GOST R 55744-2013 Printed circuit boards. Physical parameters test methods
GOST R 50622-1993 Double sided printed boards with plated-through holes. General specifications
GOST 27716-1988 Masks for printed boards. General specifications
GOST 26164-1984 Printed boards for item export delivery. Grid pitches
GOST 26246.0-1989 Foil-clad electrical insulating materials for manufacture of printed plates. Test methods
GOST 26246.8-1989 Foil-clad polyester film for flexible printed plates. Specifications
GOST R 50621-1993 Single and double sided printed boards with plain holes. General specifications
GOST R 56252-2014 Printed circuit boards. Test Methods for Influence of chemical factors and environment
GOST R 59630-2021 Installation of surface-mounted products on printed circuit boards. Design methods
GOST R 50562-1993 Originals and marks of printed circuit boards. General requirements for unit manufacturing methods
GOST 22318-1977 Printed circuit junction wires. Types, construction and dimensions, technical requirements
GOST R IEC 61191-2-2017 Printed board assemblies. Part 2. Surface mount assemblies. Technical requirements
GOST 3.1428-1991 Unified system for technological documentation. Rules of making documents on technological processes (operations) for production of printing plates
GOST IEC 62326-4-2013 Printed boards. Part 4. Rigid multilayer printed boards with interlayer connections. Sectional specification
GOST 26246.13-1989 Polyimide foil-clad film of rated combustibility for flexible printed plates. Specifications
GOST R IEC 61191-1-2017 Printed board assemblies. Part 1. Surface mount and related assembly technologies. Generic specification
GOST 29137-1991 Lead forming and electronic component insertion onto PC boards. General requirements and design specifications

RO-ASRO, A printed circuit board

STAS SR EN 60097-1996 Grid systems for printed circuits
STAS SR EN 60249-1+A1-1996 Base materials for printed circuits. Part 1: Test methods
SR CEI 326-1-1996 Printed boards. Part 1: General information for the specification writer
STAS 12487-1986 Connectors for frequencies below 3 MHz for use with printed boards TWO-PART CONNECTORS FOR PRINTED BOARDS, FOR BASIC GRID OF 2,54 mm, "WITH COM- MON MOUNTING FEATURES General technical requirements for quality
STAS SR EN 60249-2-8+A1-1995 Base materials for printed circuits. Part 2: Specifications. Specification No.8: Flexible copper-clad polyester (PETP) film

Indonesia Standards, A printed circuit board

SNI 04-1633-1989 Printed circuit board - Basic dimension
SNI 04-6252.6-2001 Printed boards - Part 6: Specification for single and multilayer printed boards
SNI 04-6252.9-2000 Printed boards - Part 9: Specification for flexible multilayer printed boards through connections
SNI 04-6252.10-2002 Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with though-connections
SNI 04-6252.11-2002 Printed boards - Part 11: Printed boards specification for rigid-flexible double-sided printed boards with direct connections
SNI 04-6252.12-2001 Printed boards - Part 12: Specification for mass lamination panels (semi-manufactured multiplayer printed boards)
SNI 04-6252.7-2001 Printed boards - Part 7: Specification for single and double sided flexible printed boards without through connections
SNI 04-6252.8-2001 Printed boards - Part 8: Specification for single and double sided flexible printed boards with through connections
SNI 04-6252.4-2000 Printed boards - Part 4: Printed boards specification for single and double sided printed boards with plain hole
SNI 04-6252.5-2001 Printed boards - Part 5: Specification for single and double sided printed boards with plated-through holes

CZ-CSN, A printed circuit board

CSN 35 9004-1982 Printed circuit boards Test methods
CSN 35 9011-1984 Printed boards. Grid spancings
CSN 35 9003-1982 Printed circuit boards General technical requirements

Institute of Interconnecting and Packaging Electronic Circuits (IPC), A printed circuit board

IPC TA-724 SECTION 1 Clean Rooms for Printed Circuit Boards
IPC 4553-2005 Specification for Immersion Silver Plating for Printed Circuit Boards
IPC 4554-2007 Specification for Immersion Tin Plating for Printed Circuit Boards
IPC 7912A-2004 End-Item DPMO for Printed Circuit Board Assemblies
IPC 4554-2012 Specification for Immersion Tin Plating for Printed Circuit Boards
IPC 2221A-2003 Generic Standard on Printed Board Design [Superseded: IPC D-275]
IPC TM-650 2.4.40-1987 Inner Layer Bond Strength of Multilayer Printed Circuit Boards
IPC IPC ENVIRONMENT-1999 Printed Circuit Board Industry an Environmental Best Practice Guide
IPC 4552-2002 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
IPC TM-650 2.5.7.2-2007 Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Circuit Boards (PCBs)
IPC TM-650 2.5.5.2-1987 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material - Clip Method
IPC TM-650 2.5.5.4-1985 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material-Micrometer Method
IPC 2547-2002 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework
IPC WP/TR-584-2003 IPC White Paper and Technical Report on Halogen-Free Materials Used for Printed Circuit Boards and Assemblies

Society of Automotive Engineers (SAE), A printed circuit board

SAE ARP1612-1979 POLYIMIDE PRINTED CIRCUIT BOARDS
SAE ARP1612A-2022 Polyimide Printed Circuit Boards Fabrication of
SAE AS90335A-2012 Connector, Receptacles, Plugs, Adaptor, El, Embedded, Printed Circuit Board Lamp Lighting Panels

Professional Standard - Aerospace, A printed circuit board

QJ/Z 76-1980 Printed Circuit Board Design Specification

Professional Standard - Chemical Industry, A printed circuit board

HG/T 4239-2011 Silver film for printed circuit board(PCB)
HG/T 4396-2012 Diazo film for printed circuit board (PCB)

IPC - Association Connecting Electronics Industries, A printed circuit board

IPC 4553A CHINESE-2009 SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC 7912A CD-2004 End-Item DPMO for Printed Circuit Board Assemblies
IPC 4552 AMD 1-2012 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
IPC 4552 AMD 2-2012 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
IPC 4552 CD-2002 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
IPC ENVIRONMENT-1999 Printed Circuit Board Industry an Environmental Best Practice Guide
IPC TM-650 2.5.7.2A-2009 Dielectric Withstanding Voltage (Hipot Method) - Thin Dielectric Layers for Printed Boards
IPC 4556-2013 Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
IPC 4556 AMD 1-2016 Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
IPC 4556 CD-2013 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
IPC A-142 CD-1990 Specification for Finished Fabric Woven from Aramid for Printed Boards
IPC QL-653A CD-1997 Certification of Facilities That Inspect/Test Printed Boards@ Components and Materials
IPC 4554 CHINESE-2007 Specification for Immersion Tin Plating for Printed Circuit Boards (Incorporates Amendment 1: January 2012)
IPC 4554 CD-2007 Specification for Immersion Tin Plating for Printed Circuit Boards (Incorporates Amendment 1: January 2012)
IPC 2546 AMD 2-2005 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly
IPC 2546-2001 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly
IPC 4110 CD-1998 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
IPC 4552-2012 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards (Incorporates Amendments 1 & 2)
IPC 4552 CD-2012 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards (Incorporates Amendments 1 & 2)
IPC 7721-1998 Repair and Modification of Printed Boards and Electronic Assemblies (Change 1: 3/2000; Change 2: 4/2001 Incorporated)
IPC WP/TR-584A CD-2007 IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies
IPC HDBK-850-2012 Guidelines for Design@ Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly

PL-PKN, A printed circuit board

PN T01026-1991 Terms and definitions for printed circuits
PN T80150-1975 Electronic e?uipment Printed boards Dimensions of reference grids

SAE - SAE International, A printed circuit board

SAE ARP1612A-1990 Polyimide Printed Circuit Boards Fabrication of
SAE AS7119-2005 Nadcap Aerospace Standard for Electronics Printed Circuit Boards
SAE AS7119B-2015 Nadcap Aerospace Standard for Electronics Printed Circuit Boards
SAE AS90335-2002 CONNECTOR@ RECEPTACLES@ PLUGS@ ADAPTOR@ EL@ EMBEDDED@ PRINTED CIRCUIT BOARD LAMP LIGHTING PANELS

未注明发布机构, A printed circuit board

IPC 7912A Printed circuit board assembly final product
DIN EN IEC 61188-6-4:2020 Printed circuit boards and printed circuit boards – Construction and application – Part 6 4: Construction of the connection area pattern – General requirements for SMD dimensional drawings regarding the construction of the connection area image

Danish Standards Foundation, A printed circuit board

DS/IEC 326-3:1992 Printed boards. Part 3: Design and use of printed boards
DS/IEC 326-9:1992 Printed boards. Part 9: Specification for flexible multilayer printed boards with through connections
DS/IEC 326-6/Till 1+2:1991 International Electrotechnical Commission IEC Publication No. 326-6:1980 + Amd. 1:1983 + Amd. 2:1990 Printed boards - Part 6: Specification for multilayer printed boards
DS/IEC 326-10:1992 Printed boards. Part 10: Specification for flex rigid double-sided printed boards with through connections
DS/EN 61086-2:2004 Coatings for loaded printed wire boards (conformal coatings) - Part 2: Methods of test
DS/EN 60603-10:1998 Connectors for frequencies below 3 MHz for use with printed boards - Part 10: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), inverted type
DS/EN 60603-8:1998 Connectors for frequencies below 3 MHz for use with printed boards - Part 8: Two-part connectors for printed boards, for basic grid of 2,54 mm (0,1 in), with square male contacts of 0,63 mm x 0,63 mm
DS/EN 60603-2:1999 Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0.1 in) with common mounting features

Group Standards of the People's Republic of China, A printed circuit board

T/QZZN 017-2020 Multilayer PCB Laminating Production Line

Aerospace Industries Association/ANSI Aerospace Standards, A printed circuit board

AIA/NAS NAS 980-1975 Printed Circuit Board Soldering Machine Automatically Controlled (Rev. 1)
AIA/NAS NAS 1453-1965 Eyelet, Metallic, Electrical, Printed Circuit Board, Funnel Type
AIA/NAS NAS 948-1975 Printed Circuit Board Drilling Machine Numerically Controlled (Rev. 1)
AIA/NAS NAS 975-1966 Component Lead Cutting and Forming Equipment; Electronic Printed Circuit Board
AIA/NAS NAS1453-2012 EYELET, METALLIC, ELECTRICAL, PRINTED CIRCUIT BOARD, FUNNEL TYPE (Rev 1)
AIA/NAS NAS975-2012 COMPONENT LEAD CUTTING AND FORMING EQUIPMENT ELECTRONIC PRNTED CIRCUIT BOARD Rev 1

German Institute for Standardization, A printed circuit board

DIN EN 62326-20:2016-12 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (IEC 62326-20:2016); German version EN 62326-20:2016
DIN EN 16602-70-12:2016-12 Space product assurance - Design rules for printed circuit boards; English version EN 16602-70-12:2016
DIN EN 16602-70-60:2019-10 Space product assurance - Qualification and Procurement of printed circuit boards; English version EN 16602-70-60:2019, only on CD-ROM / Note: CD-ROM
DIN EN 16602-70-11:2015 Space product assurance - Procurement of printed circuit boards; English version EN 16602-70-11:2015
DIN EN 16602-70-28:2015-06 Space product assurance - Repair and modification of printed circuit board assemblies for space use; English version EN 16602-70-28:2014
DIN EN 16602-70-10:2015 Space product assurance - Qualification of printed circuit boards; English version EN 16602-70-10:2015
DIN EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards; English version EN 16602-70-12:2016
DIN IEC/TS 62326-16:2013 Printed boards - Part 16: Device Embedded Substrate Technology - Generics (IEC 91/1081/CD:2013)
DIN EN 61191-4:1999 Printed board assemblies - Part 4: Sectional specification: Requirements for terminal soldered assemblies (IEC 61191-4:1998); German version EN 61191-4:1998
DIN EN 61191-3:1999 Printed board assemblies - Part 3: Sectional specification: Requirements for through-hole mount soldered assemblies (IEC 61191-3:1998); German version EN 61191-3:1998
DIN IEC/TS 62326-19:2013 Printed boards - Part 19: Device Embedded Substrate - Design Guide (IEC 91/1084/CD:2013)
DIN IEC/TS 62326-17:2013 Printed boards - Part 17: Device embedded substrates - TEG (test element group) (IEC 91/1082/CD:2013)
DIN EN 61189-5-1:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5
DIN EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 6
DIN EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN
DIN EN 16602-70-60:2019 Space product assurance - Qualification and Procurement of printed circuit boards; English version EN 16602-70-60:2019, only on CD-ROM
DIN EN 16602-70-28:2015 Space product assurance - Repair and modification of printed circuit board assemblies for space use; English version EN 16602-70-28:2014

ES-UNE, A printed circuit board

UNE-EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (Endorsed by AENOR in June of 2016.)
UNE-EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards (Endorsed by AENOR in November of 2016.)
IEEE 2716-2022 IEEE Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
UNE-EN 16602-70-60:2019 Space product assurance - Qualification and Procurement of printed circuit boards (Endorsed by Asociación Española de Normalización in August of 2019.)
UNE-EN 16602-70-28:2014 Space product assurance - Repair and modification of printed circuit board assemblies for space use (Endorsed by AENOR in December of 2014.)
UNE-EN 160100:1997 SECTIONAL SPECIFICATION: CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OF ASSESSED QUALITY. (Endorsed by AENOR in July of 1998.)

AIA/NAS - Aerospace Industries Association of America Inc., A printed circuit board

NAS1453-1965 Eyelet@ Metallic@ Electrical@ Printed Circuit Board@ Funnel Type
NAS980-1975 Printed Circuit Board Soldering Machine Automatically Controlled (Rev 1)
NAS948-1975 Printed Circuit Board Drilling Machine Numerically Controlled (Rev 1)
NAS975-1966 Component Lead Cutting and Forming Equipment; Electronic Printed Circuit Board
NAS1453-2012 EYELET@ METALLIC@ ELECTRICAL@ PRINTED CIRCUIT BOARD@ FUNNEL TYPE (Rev 1)
NAS975-2012 COMPONENT LEAD CUTTING AND FORMING EQUIPMENT ELECTRONIC PRNTED CIRCUIT BOARD (Rev 1)

(U.S.) Ford Automotive Standards, A printed circuit board

FORD WSF-M22P3-A1-2014 PRINTED CIRCUIT BOARDS, DOUBLE SIDED ***TO BE USED WITH FORD WSS-M99P1111-A***
FORD WSF-M22P4-A1-2014 PRINTED CIRCUIT BOARDS, SINGLE SIDED ***TO BE USED WITH FORD WSS-M99P1111-A***
FORD WSF-M22P2-A1-2014 PRINTED CIRCUIT BOARDS, MULTILAYER ***TO BE USED WITH FORD WSS-M99P1111-A***
FORD WSF-M22P1-A1-2014 PRINTED CIRCUIT BOARDS, SOLDERABILITY ***TO BE USED WITH FORD WSS-M99P1111-A***
FORD WSF-M22P5-A1-2014 PRINTED CIRCUIT BOARDS, PTF, DOUBLE SIDED, FLEXIBLE ***TO BE USED WITH FORD WSS-M99P1111-A***
FORD ESF-M3L84-A-2003 PRINTED CIRCUIT BOARD SUBSTRATE, POLYIMIDE (PI) FILM ***TO BE USED WITH FORD WSS-M99P1111-A***

ESD - ESD ASSOCIATION, A printed circuit board

EP119-2000 Printed Circuit Board Design Techniques for EMC Compliance

British Standards Institution (BSI), A printed circuit board

BS EN 61182-2-2:2012 Printed board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description
BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
BS PD IEC/TS 61189-3-301:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB
PD IEC/TR 63017:2015 Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
BS EN 16602-70-60:2019 Space product assurance. Qualification and Procurement of printed circuit boards
BS PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies
BS EN 61191-2:2013 Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies
BS DD IEC/PAS 62326-14:2010 Printed boards. Device embedded substrate. Terminology / reliability / design guide
BS EN 16602-70-28:2014 Space product assurance. Repair and modification of printed circuit board assemblies for space use
BS EN 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cy
PD IEC/TR 63018:2015 Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
BS CECC 23300-801:1998 Harmonized system of quality assessment for electronic components - Capability detail specification: multi-layer printed boards
BS EN 175100:1993 Harmonized system of quality assessment for electronic components. Sectional specification. Two part and edge socket connectors for printed board applications
BS EN 50225:1997 Code of practice for the safe use of fully enclosed oil-filled electrical equipment which may be contaminated with PCBs
BS CECC 200025:1998 Harmonized system of quality assessment for electronic components - Process assessment schedule: printed board assembly facilities
BS CECC 23100-801:1998 Harmonized system of quality assessment for electronic components - Capability detail specification: single and double-sided printed boards with plain holes
BS PD IEC TR 61191-8:2021 Printed board assemblies. Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
BS 4584-103.2:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for copper foil for use in the manufacture of copper-clad base materials
BS CECC 23200-801:1998 Harmonized system of quality assessment for electronic components - Capability detail specification: single and double-sided printed boards with plated through holes
BS EN 61193-3:2013 Quality assessment systems. Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

Aerospace Industries Association, A printed circuit board

AIA NAS 1453-1965 Eyelet, Metallic, Electrical, Printed Circuit Board, Funnel Type R(1989)
AIA NAS 948-1975 (Inactive)Printed Circuit Board Drilling Machine Numerically Controlled (Rev. 1)
AIA NAS 975-1966 Component Lead Cutting and Forming Equipment; Electronic Printed Circuit Board
AIA NAS 980-1975 (Inactive)Printed Circuit Board Soldering Machine Automatically Controlled (Rev. 1)

CEN - European Committee for Standardization, A printed circuit board

PREN 16602-70-60-2017 Space product assurance - Qualification and Procurement of printed circuit boards

International Electrotechnical Commission (IEC), A printed circuit board

IEC TR 63017:2015 Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board ass
IEC 61191-4:1998 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 603-8:1990 Connectors for frequencies below 3 MHz for use with printed boards; part 8: two-part connectors for printed boards for basic grid of 2, 54 mm (0, 1 in), with square male contacts of 0, 63 mm * 0, 63 mm
IEC 60603-8:1991 Connectors for frequencies below 3 MHz for use with printed boards. Part 8: Two-part connectors for printed boards, for basic grid of 2.54 mm (0.1 in), with square male contacts of 0.63 mm x 0.63 mm
IEC 61191-2:1998 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-3:1998 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC PAS 62326-14:2010 Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-2:2013 Printed board assemblies.Part 2: Sectional specification.Requirements for surface mount soldered assemblies
IEC TR 63018:2015 Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
IEC 91/1084/CD:2013 IEC/TS 62326-19, Ed. 1: Printed boards - Part 19: Device Embedded Substrate - Design Guide
IEC 91/1082/CD:2013 IEC/TS 62326-17, Ed. 1: Printed boards - Part 17: Device embedded substrates - TEG (test element group)
IEC 60194-2:2017 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
IEC 91/1081/CD:2013 IEC/TS 62326-16, Ed. 1: Printed boards - Part 16: Device Embedded Substrate Technology - Generics
IEC 61191-2:2017/COR1:2019 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61076-4-100:1994 Connectors with assessed quality for use in d.c. and low frequency analogue applications and in digital applications with high speed data rates - Part 4: Printed board connectors; section 100: Detail specification for two-part connector modules having a g
IEC 61076-4-101:1995 Connectors with assessed quality, for use in d.c. low-frequency analogue and in digital high speed data applications - Part 4: Printed boards connectors - Section 101: Detail specification for two-part connector modules having a basic grid of 2,0 mm for p

American National Standards Institute （ANSI), A printed circuit board

PD IEC TR 61191-9:2023 Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications. Best practices (British Standard)

IX-IX-IEC, A printed circuit board

IEC TR 61191-9:2023 Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices

Institute of Electrical and Electronics Engineers (IEEE), A printed circuit board

IEEE P2716/D1, April 2022 IEEE Draft Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
IEEE P2716/D2, April 2022 IEEE Draft Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
IEEE P2716 IEEE Approved Draft Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
IEEE 370-2020 IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
IEEE P370/D5, May 2019 IEEE Draft Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz.
IEEE P370/D6, December 2019 IEEE Draft Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz.
P370/D8, July 2020 IEEE Draft Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50GHz.
IEEE P370/D8, July 2020 IEEE Draft Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50GHz.
IEEE P370/D7, April 2020 IEEE Draft Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50GHz.

ECSS - European Cooperation for Space Standardization, A printed circuit board

Q-ST-70-28C-2008 Repair and modification of printed circuit board assemblies for space use (Second Issue)

KR-KS, A printed circuit board

KS C IEC 60603-10-2020 Connectors for frequencies below 3 MHz for use with printed boards —Part 10: Two-part connectors for printed boards for basic grid of 2.54 mm (0.1 in), inverted type
KS C IEC TR 61189-3-914-2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies — Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightne

Association of German Mechanical Engineers, A printed circuit board

VDI/VDE 3715-1995 SMD - Surface Mount Devices - Process measurement and testing for printed circuit boards (PCB)

European Committee for Electrotechnical Standardization（CENELEC）, A printed circuit board

EN 61076-4-113:2003 Connectors for electronic equipment - Printed board connectors Part 4-113: Detail specification for two-part connectors having 5 rows with grid of 2,54 mm for printed boards and backplans in bus applications
EN 61086-1:1994 Coatings for loaded printed wire boards (conformal coatings) Part 1: Definitions, classification and general requirements

IEEE - The Institute of Electrical and Electronics Engineers@ Inc., A printed circuit board

IEEE P370/D5-2019 Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz

AENOR, A printed circuit board

UNE-EN 60603-4:1999 CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS. PART 4: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACT SPACED AT1,91 MM (0,075 IN) CENTRES AND STAGGED TERMINATIONS AT THAT SAME SPACING.
UNE-EN 60603-3:1999 CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS. PART 3:TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACTS SPACED AT 2,54 MM (0,100 IN) CENTRES AND STAGGERED TERMINATIONS AT THAT SAME SPACING.
UNE-EN 60603-8:2001 Connectors for frequencies below 3 MHz for use with printed boards -- Part 8: Two-part connectors for printed boards, for basic grid of 2,54 mm (0,1 in), with square male contacts of 0,63 mm x 0,63 mm.

Japanese Industrial Standards Committee (JISC), A printed circuit board

JIS C 61191-4:2006 Printed board assemblies -- Part 4: Sectional specification -- Requirements for terminal soldered assemblies
JIS C 61191-2:2006 Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies
JIS C 61191-3:2006 Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies
JIS C 61191-2:2015 Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies

BELST, A printed circuit board

STB 2208-2011 Elements for fixing electronic products on printed circuit boards. General technical requirements

US-ACEI, A printed circuit board

IPC 2546-2003 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly with Amendment 1

United States Navy, A printed circuit board

NAVY MIL-STD-2119 A-1990 DESIGN REQUIREMENTS FOR PRINTED-WIRING ELECTRICAL BACKPLANE ASSEMBLIES
NAVY MS90335 REV D-1996 CONNECTOR, RECEPTACLES, PLUGS, ADAPTOR, EL, EMBEDDED, PRINTED CIRCUIT BOARD LAMP LIGHTING PANELS

Guangdong Provincial Standard of the People's Republic of China, A printed circuit board

DB44/T 1138-2013 Air conditioner printed circuit board assembly (PCBA) lead-free solder joint reliability test method and quality requirements

海关总署, A printed circuit board

HS/T 62-2019 "Method for Determination of Copper Content in Printed Circuit Board (PCB) Waste and Scrap - Wavelength Dispersive X-ray Fluorescence Spectrometry"

Underwriters Laboratories (UL), A printed circuit board

UL 746F-2012 Polymeric materials - Flexible dielectric film materials for use in printed-wiring boards and flexible materials interconnect constructions