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Component pind

Component pind, Total:497 items.

In the international standard classification, Component pind involves: Acoustics and acoustic measurements, Semiconductor devices, Electronic component assemblies, Electronic components in general, Mechanical structures for electronic equipment, Metrology and measurement in general, Piezoelectric and dielectric devices, Measurement of force, weight and pressure, Aerospace fluid systems and components, Environmental testing, Equipment for the chemical industry, Structure and structure elements, Electrical accessories, Resistors, Internal combustion engines for road vehicles, Vocabularies, Fibre optic communications, Electrical and electronic testing, Components and accessories for telecommunications equipment, Aerospace electric equipment and systems, Road vehicle systems, On-board equipment and instruments, Valves, Materials and components for railway engineering, Ceramics, Capacitors, Integrated circuits. Microelectronics, Components for electrical equipment, Graphical symbols, Applications of information technology, Burners. Boilers, Interface and interconnection equipment, Solar energy engineering, Ventilators. Fans. Air-conditioners, Air quality, Welding, brazing and soldering, Shafts and couplings, Optoelectronics. Laser equipment, Farm buildings, structures and installations, Lamps and related equipment, Machine tool systems, Protective equipment, Shipbuilding and marine structures in general, Adhesives, Railway rolling stock, Rails and railway components, TESTING, Insulation, Products of non-ferrous metals, Fruits. Vegetables, Quality, Fluid storage devices, Nuclear energy engineering, Optical equipment, Electromechanical components for electronic and telecommunications equipment, Seals, glands, Medical equipment, Company organization and management, Semiconducting materials, Power transmission and distribution networks, Switchgear and controlgear, Electrical engineering in general, Electronic display devices.


Professional Standard - Aerospace, Component pind

  • QJ 2863-1996 Particle impact noise detection (PIND) requirements and methods for aerospace electronic components
  • QJ 2782-1995 Terminology for Microwave Components
  • QJ 3058-1998 Component review management requirements
  • QJ 3065.1-1998 Component selection management requirements
  • QJ 3065.2-1998 Component procurement management requirements
  • QJ 2733-1995 Graphical symbols for microwave components
  • QJ 10003-2008 Screening Guide for Imported Components
  • QJ 1693-1989 Anti-static requirements for electronic components
  • QJ 10002-2008 Screening Guide for Aerospace Components
  • QJ 3048-1998 Component testing station test software development specification
  • QJ 3065.5-1998 Component Failure Analysis Management Requirements
  • QJ 3172-2003 Microwave components installation technical requirements
  • QJ/Z 147-1985 Detailed Rules for Enamel Tin Process of Electronic Components
  • QJ 1317-1987 Electronic component failure classification and code
  • QJ 3065.3-1998 Component supervision and acceptance management requirements
  • QJ 3065.4-1998 Component screening and re-inspection management requirements
  • QJ 2535.1-1993 Component Locator for Small Combined Bending Die
  • QJ 1317A-2005 Electronic component failure classification and code
  • QJ 3152-2002 Management requirements for new electronic components of aerospace application
  • QJ 2671-1994 Quality management requirements for imported electronic components
  • QJ 3267-2006 Technical requirements for tinning process of electronic components
  • QJ 2333-1992 Technical specifications for 42-element lead sulphide infrared detectors
  • QJ 2145-1991 Regulations on Quality and Reliability Management of Electronic Components
  • QJ 3179-2003 Management requirements for destructive physical analysis of components

British Standards Institution (BSI), Component pind

  • BS EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Particle impact noise detection (PIND)
  • DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
  • BS EN 2591-605:2002 Elements of electrical and optical connection - Test methods - Optical elements - Return loss
  • BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices
  • BS EN 62005-9-1:2015 Fibre optic interconnecting devices and passive components. Reliability. Qualification of passive optical components
  • BS EN IEC 62435-6:2018 Electronic components. Long-term storage of electronic semiconductor devices - Packaged or finished devices
  • BS 1745:1951 Specification for alternating-current relays for railway signalling: track relays (double-element, 2-position), line relays (single-element, 2-position)
  • BS EN 61810-1:2008 Electromechanical elementary relays. General requirements
  • BS EN 61202-1:2009 Fibre optic interconnecting devices and passive components - Fibre optic isolators - Generic specification
  • BS EN 61202-1:2017 Fibre optic interconnecting devices and passive components. Fibre optic isolators. Generic specification
  • BS EN 2591-7301:2001 Elements of electrical and optical connection. Test methods - Electrical elements. Temperature endurance of couplers
  • PD IEC/TS 62878-2-4:2015 Device embedded substrate. Guidelines. Test element groups (TEG)
  • BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
  • BS QC 720100:1991 Harmonized system of quality assessment for electronic components. Semiconductor devices. Sectional specification for optoelectronic devices
  • BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
  • BS 5190:1985 Specification for pipeline filters, filter bodies and filter elements for milking installations
  • BS EN 2591-703:2001 Elements of electrical and optical connection - Test methods - Electrical elements - Common mode rejection of couplers
  • BS EN 2591-709:2001 Elements of electrical and optical connection - Test methods - Electrical elements - Tensile strength of couplers
  • BS DD IEC/PAS 60747-17:2011 Semiconductor devices. Discrete devices. Magnetic and capacitive coupler for basic and reinforced isolation
  • BS PD IEC/TR 62627-01:2016 Fibre optic interconnecting devices and passive components. Fibre optic connector cleaning methods
  • BS EN 62148-2:2011 Fibre optic active components and devices. Package and interface standards. SFF 10-pin transceivers
  • BS EN 62150-2:2011 Fibre optic active components and devices. Test and measurement procedures. ATM-PON transceivers
  • BS EN 2591:7301:2001 Elements of electrical and optical connection - Test methods - Electrical elements - Temperature endurance of couplers
  • BS EN 61754-15:2009 Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Type LSH connector family
  • BS EN 61754-30:2014 Fibre optic interconnecting devices and passive components. Fibre optic connector interfaces. Type CLIK connector series
  • BS EN 61754-29:2012 Fibre optic interconnecting devices and passive components. Fibre optic connector interfaces. Type BLINK connector series
  • BS EN 2591-704:2001 Elements of electrical and optical connection - Test methods - Electrical elements - Measurement of turns ratio on a transformer used in a coupler
  • BS EN 2591-702:2001 Elements of electrical and optical connection - Test methods - Electrical elements - Measurement of signal distortion of couplers
  • BS EN 2591-614:2002 Aerospace series - Elements of electrical and optical connection - Test methods - Optical elements - Connector radial compression
  • BS EN 2591-607:2002 Elements of electrical and optical connection - Test methods - Optical elements - Immunity to ambient light coupling
  • BS EN 100012:1996 Harmonized system of quality assessment for electronic components - Basic specification - X-ray inspection of electronic components
  • BS EN 2591-701:2001 Elements of electrical and optical connection - Test methods - Electrical elements - Measurement of open circuit impedance of couplers
  • BS CECC 00804:1996 Harmonized system of quality assessment for electronic components - Interpretation of 'EN ISO 9000:1994': Reliability aspects for electronic components
  • BS EN IEC 62435-4:2018 Electronic components. Long-term storage of electronic semiconductor devices. Storage
  • BS EN 61810-1:2015 Electromechanical elementary relays. General and safety requirements
  • BS ISO 27427:2014 Anaesthetic and respiratory equipment. Nebulizing systems and components
  • BS EN 2591-410:1998 Elements of electrical and optical connection - Test methods - Insert retention in housing (axial)
  • PD IEC/TS 62627-09:2016 Fibre optic interconnecting devices and passive components. Vocabulary for passive optical devices. Terminology of passive optical devices
  • BS EN 61754-34:2016 Fibre optic interconnecting devices and passive components. Fibre optic connector interfaces. Type URM connector family
  • BS EN 61754-32:2016 Fibre optic interconnecting devices and passive components. Fibre optic connector interfaces. Type DiaLink connector family
  • BS PD IEC/TS 62965:2016 Fibre optic interconnecting devices and passive components. Ferrule assembly and fusion splicer interface dimensions for a fusion splice on connector
  • BS EN 62148-16:2010 Fibre optic active components and devices. Package and interface standards. Transmitter and receiver components for use with LC connector interface
  • BS EN 62148-16:2009 Fibre optic active components and devices - Package and interface standards - Transmitter and receiver components for use with LC connector interface
  • BS EN 62148-3:2011 Fibre optic active components and devices. Package and interface standards. SFF 20-pin transceivers
  • BS EN 61754-28:2012 Fibre optic interconnecting devices and passive components. Fibre optic connector interfaces. Type LF3 connector family
  • BS EN 62074-1:2009 Fibre optic interconnecting devices and passive components - Fibre optic WDM devices - Generic specification
  • BS EN 62074-1:2010 Fibre optic interconnecting devices and passive components. Fibre optic WDM devices. Generic specification
  • BS EN 2591-411:1998 Elements of electrical and optical connection - Test methods - Insert retention in housing (torsional)
  • BS EN 2591-705:2001 Elements of electrical and optical connection - Test methods - Electrical elements - Measurement of stub input impedance of couplers
  • BS EN 2591-708:2001 Elements of electrical and optical connection - Test methods - Electrical elements - Measurement of surface transfer impedance of couplers
  • BS EN 61274-1-1:2012 Fibre optic interconnecting devices and passive components. Adaptors for fibre optic connectors. Blank detail specification
  • BS EN 60869-1:2013 Fibre optic interconnecting devices and passive components. Fibre optic passive power control devices. Generic specification

Korean Agency for Technology and Standards (KATS), Component pind

  • KS C IEC 60749-16:2006 Semiconductor devices-Mechanical and climatic test methods-Part 16:Particle impact noise detection(PIND)
  • KS C IEC 60749-16-2006(2021) Semiconductor devices-Mechanical and climatic test methods-Part 16:Particle impact noise detection(PIND)
  • KS C IEC 60749-16-2006(2016) Semiconductor devices-Mechanical and climatic test methods-Part 16:Particle impact noise detection(PIND)
  • KS C 5529-1987 Piezoelectric Element unit
  • KS C 5109-1988 General Rules for Electronic Components
  • KS C 5109-1988(2018)
  • KS C 5109-1986 General Rules for Electronic Components
  • KS C 6018-1971 Environmental Requirements for Electronic Components
  • KS C 6018-1971(2017) Environmental Requirements for Electronic Components
  • KS C 6018-1982 Environmental Requirements for Electronic Components
  • KS C 6013-1982 Testing method of endurance(electrical) for electronic component
  • KS C 6013-1982(2017) Testing method of endurance(electrical) for electronic component
  • KS C IEC 61360-4:2003 Standard data element types with associated classification scheme for electric components-Part 4:IEC reference collection of standard data element types, component classes and terms
  • KS C 6900-2004 General rules of passive devices for fiber optic transmission
  • KS C 6012-1982 Testing method of sealing(immersion cyclic) for electronic components
  • KS C 6032-1981 General test procedure of failure rate for electronic components
  • KS C 6012-1960 Testing method of sealing(immersion cyclic) for electronic components
  • KS C 6430-2004 General rules for reliability assured electronic components
  • KS C 6901-1989 Test Methods of Passive Devices for Fiber Optic Transmission
  • KS C 6021-1977 Endurance(mechanical) testing method for electronic components
  • KS R 9229-2005(2015) Railway rolling stock-Radiator element-Inspection methods
  • KS C 6021-1982 Endurance(mechanical) testing method for electronic components
  • KS C 6563-1996 Principal measuring methods for semiconductor pressure sensor elements
  • KS C 6562-1996 Essential ratings and characteristics for semiconductor pressure sensor elements
  • KS B ISO 5247-3:2003 Textile machinery and accessories-Weaving machines-Part 3:Parts of machine-Vocabulary
  • KS C IEC TS 62878-2-4:2022 Device embedded substrate — Part 2-4: Guidelines — Test element groups(TEG)
  • KS C 7110-2007(2017) Liquid crystal display devices-Measurement methods of backlight unit for liquid crystal displays

Danish Standards Foundation, Component pind

  • DS/EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND)
  • DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
  • DS/EN ISO 11151-2:2000 Lasers and laser-related equipment - Standard optical components - Part 2: Components for the infrared spectral range
  • DS/EN 62148-11:2010 Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin active device modules

AENOR, Component pind

  • UNE-EN 60749-16:2003 Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
  • UNE 18203:1983 FLEXIBLE COUPLINGS. TRANSMISSION BY RUBBER ELEMENTS WORKING COMPRESSION. TRANSMISSOR ELEMENT IN IDEPENDENTS BLOCKS.
  • UNE 18202:1983 FLEXIBLE COUPLINGS. TRANSMISSION BY RUBBER ELEMENTS WORKING BY COMPRESSION. UNITARY TRANSMISOR ELEMENT.

German Institute for Standardization, Component pind

  • DIN EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
  • DIN EN 60749-16:2003-09 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
  • DIN 58356-12:2000 Filter elements - Membrane filter elements - Part 12: Integrity test of hydrophobic membrane filters with water
  • DIN EN 12806:2003 Automotive liquefied petroleum gas components - Other than containers; German version EN 12806:2003
  • DIN EN 61291 Bb.1:1999 Fibre optics - Parameters of amplifier components (Technical Report IEC 61292-1:1998)
  • DIN EN 61360-4:2005 Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes (IEC 61360-4:2005); German version EN 61360-4:2005, text in English
  • DIN ISO 3323:1985 Aircraft; hydraulic components; marking to indicate fluid for which component is approved
  • DIN 115-2:1973 Driving components, ring for clamp couplings, dimensions
  • DIN 115-1:1973 Driving components; clamp couplings, dimensions, twisting
  • DIN 58356-2:2000 Membrane filter elements - Part 2: Pressure holder tests
  • DIN 71459:1987 Air filter elements for commercial vehicles; dimensions
  • DIN 42537-2:1983 Transformers; outdoor bushings U<(Index)m> 36 kV, for 12,5 to 25 kA; components
  • DIN EN 62148-17:2014-09 Fiber optic active components and devices - Package and interface standards - Part 17: Transmitter and receiver components with dual coaxial RF connectors (IEC 62148-17:2013); German version EN 62148-17:2014 / Note: Applies in conjunction with DIN EN 6...
  • DIN EN 62148-16:2010-07 Fibre optic active components and devices - Package and interface standards - Part 16: Transmitter and receiver components for use with LC connector interface (IEC 62148-16:2009); German version EN 62148-16:2009 / Note: Applies in conjunction with DIN ...
  • DIN EN ISO 11151-2:2015-12 Lasers and laser-related equipment - Standard optical components - Part 2: Components for the infrared spectral range (ISO 11151-2:2015); German version EN ISO 11151-2:2015

International Electrotechnical Commission (IEC), Component pind

  • IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
  • IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
  • IEC TS 62627-09:2016 Fibre optic interconnecting devices and passive components - Vocabulary for passive optical devices
  • IEC TR 61292-1:1998 Fibre optics - Parameters of amplifier components
  • IEC 61360-4:2005 Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes
  • IEC 61360-4-DB:2005 Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes
  • IEC TR 61292-1:2009 Optical amplifiers - Part 1: Parameters of amplifier components
  • IEC 61977:2010 Fibre optic interconnecting devices and passive components - Fibre optic filters - Generic specification
  • IEC 61977:2015 Fibre optic interconnecting devices and passive components - Fibre optic filters - Generic specification
  • IEC 62077:2015 Fibre optic interconnecting devices and passive components - Fibre optic circulators - Generic specification
  • IEC 62005-9-1:2015 Fibre optic interconnecting devices and passive components - Reliability - Part 9-1: Qualification of passive optical components
  • IEC 60319:1978 Presentation of reliability data on electronic components (or parts)
  • IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
  • IECQ OD 3801-2015 IEC Quality Assessment System for Electronic Components (IECQ System) - Procedures for the issuing of IECQ LED Component Product Certificates of Conformity for Component Product(s) associated with LED lighting
  • IEC 61754-28:2012 Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 28: Type LF3 connector family
  • IEC TR 61292-1:2022 Optical amplifiers - Part 1: Parameters of optical fibre amplifier components
  • IEC PAS 62005-9-2:2003 Fibre optic interconnecting devices and passive components - Reliability of fibre optic interconnecting devices and passive optical components - Part 9-2: Reliability qualification for fibre optic connectors
  • IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
  • IEC 62077:2022 RLV Fibre optic interconnecting devices and passive components - Fibre optic circulators - Generic specification
  • IEC 63032:2018 Fibre optic interconnecting devices and passive components - Fibre optic tuneable bandpass filters - Generic specification
  • IEC 62077:2022 Fibre optic interconnecting devices and passive components - Fibre optic circulators - Generic specification
  • IEC 60120:2020 Ball and socket couplings of string insulator units - Dimensions
  • IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
  • IECQ OD 3802-2015 IEC Quality Assessment System for Electronic Components (IECQ System) - Quality system requirements for manufacturers seeking IECQ LED Component Product Certificates of Conformity for Component Product(s) associated with LED lighting
  • IEC TR 62627-01:2023 RLV Fibre optic interconnecting devices and passive components - Part 01: Fibre optic connector cleaning methods
  • IEC TR 62627-01:2023 Fibre optic interconnecting devices and passive components - Part 01: Fibre optic connector cleaning methods
  • IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
  • QC 080000-2005 IEC quality assessment system for electronic components (IECQ) - Electrical and electronic components and products hazardous substance free standard and requirements
  • IEC 62148-11:2009 Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin active device modules

Association Francaise de Normalisation, Component pind

  • NF EN 60749-16:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 16 : détection de bruit d'impact de particules (PIND)
  • NF C93-601/AM1:1976 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. CRYSTAL HOLDERS.
  • NF C93-611:1975 Components for electronic equipment. Piezoelectric devices. Quartz crystal units for oscillators.
  • NF C93-265/A1:1984 Composants électroniques. Potentiomètres bobines de précision.
  • NF UTE C93-265/A1:1975 COMPOSANTS ELECTRONIQUES. POTENTIOMETRES BOBINES DE PRECISION.
  • NF C93-265/A2:1984 Composants électroniques. Potentiomètres bobines de précision.
  • NF C93-612:1979 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. PIEZOELECTRIC FILTERS. GENERAL REQUIREMENTS.
  • NF C96-001:1984 Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 1 : general.
  • NF C96-011:1989 Electronic Components Semiconductor devices Part 11:Sectional specification for discrete devices
  • NF C96-005-5*NF EN 60747-5-5:2012 Semiconductor devices - Discrete devices - Part 5-5 : optoelectronic devices - Photocouplers
  • NF C83-220/A4:1989 Electronic Components Fixed precision resistors
  • NF C93-171:1985 Components for electronic equipment. Trimmer capacitors.
  • NF C83-240/A1:1987 Electronic Components surface mounting resistors
  • UTE C93-715U*UTE C93-715:1994 Electronic components. Guidelines for artwork.
  • NF C03-504:2005 Standard data element types with associated classification sheme for electric components - Part 4 : IEC reference collection of standard data element types and component classes.
  • NF C96-002:1984 ELECTRONIC COMPONENTS. SEMICONDUCTOR DEVICES. DISCRETE DEVICES AND INTEGRATED CIRCUITS. PART 2 : RECTIFIER DIODES.
  • NF C57-325:1996 Photovoltaic devices. Part 5 : determination of the equivalent cell temperature (ect) of photovoltaic (pv) devices by the open-circuit voltage method.
  • UTE C80-804U*UTE C80-804:1995 Electronic components. Guidance document. Interpretation of "EN 29000". Reliability aspects for electronic components. (specification CECC 00 804).
  • UTE C93-680U*UTE C93-680:1989 Electronic components. Signal organs. Indicator lights. Detail specifications.
  • NF E48-704:1995 Transmissions hydrauliques - Éléments filtrants pour filtres incorporés sur retour - Dimensions.
  • NF C83-282/A1:1988 Electronic Components Surge suppression varistors
  • UTE C93-002U*UTE C93-002:1966 Electronic components. General. Inspection by attributes.
  • NF EN 13802:2014 Applications ferroviaires - Eléments de suspension - Amortisseurs hydrauliques
  • NF EN IEC 62435-7:2021 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 7 : dispositifs microélectromécaniques
  • NF C93-613:1979 Components for Electric Equipment Piezoelectric devices Piezoelectric filters Guide to the Use of Crystal Filters
  • NF C93-915:2011 Fibre optic interconnecting devices and passive components - Fibre optic circulators - Generic spécification.
  • NF C86-010:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Generic specification.
  • NF C96-435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7 : micro-electromechanical devices
  • NF C96-435-8*NF EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8 : passive electronic devices
  • NF EN IEC 62435-8:2020 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 8 : dispositifs électroniques passifs
  • NF C93-884-8*NF EN 62149-8:2014 Fibre optic active components and devices - Performance standard - Part 8 : seeded reflective semiconductor optical amplifier devices
  • NF C93-010:1968 Components for electronic equipment. Preferred number series for resistors and capacitors.
  • NF F01-422:2004 Railway applications - Suspension components - Hydraulic dampers.
  • NF C93-800:1991 SEMICONDUCTOR DEVICES. GENERIC SPECIFICATION FOR OPTICAL FIBRE SENSOR.
  • UTE C93-591U*UTE C93-591:1994 Electronic components. Semi-flexible waveguides with flanges.
  • UTE C93-723U*UTE C93-723:1979 Electronic components. Printed wiring. Rework of printed boards.
  • UTE C93-717U*UTE C93-717:1994 Electronic components. Characteristics and control of thermal drains.
  • UTE C93-719U*UTE C93-719:1994 Electronic components. Specification for interconnection multiwire printed boards.
  • NF C93-425:1981 Electronic components - Connecting devices - Multipole connectors with shell for racks and panels - General requirements.
  • NF C96-006:1984 Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 6 : thyristors.
  • NF C96-010:1989 Electronic Components Semiconductor devices Part 10:Generic specification for discrete devices and integrated circuits
  • NF C96-435-5*NF EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
  • NF EN IEC 62435-6:2018 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs Partie 6 : dispositifs encapsulés ou finis
  • NF EN 62435-5:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5 - dispositifs de puces et plaquettes
  • UTE C93-426U*UTE C93-426:1977 Electronic components. Connecting devices. Multipole rectangular connectors without shell.
  • UTE C93-422 L15U*UTE C93-422 L15:1985 ELECTRONIC COMPONENTS. CONNECTING DEVICES. CIRCULAR MULTIPOLE CONNECTORS. BOOK 15.
  • NF EN ISO 11151-2:2015 Lasers et équipements associés aux lasers - Composants optiques standards - Partie 2 : composants pour la plage spectrale infrarouge
  • NF EN 62148-11:2010 Composants et dispositifs actifs en fibres optiques - Normes de boîtier et d'interface - Partie 11 : modules de dispositifs actifs de 14 broches

European Committee for Electrotechnical Standardization(CENELEC), Component pind

  • EN 60749-16:2003 Semiconductor devices Mechanical and climatic test methods Part 16: Particle impact noise detection (PIND)
  • EN 62339-1:2007 Modular component interfaces for surface-mount fluid distribution components - Part 1: Elastomeric seals
  • EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
  • EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
  • EN 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
  • EN 62148-17:2014 Fiber optic active components and devices - Package and interface standards - Part 17: Transmitter and receiver components with dual coaxial RF connectors
  • EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
  • EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
  • EN 61360-4:2005 Standard data element types with associated classification scheme for electric components Part 4: IEC reference collection of standard data element types and component classes (Incorporating Corrigendum December 2005)

Lithuanian Standards Office , Component pind

  • LST EN 60749-16-2003 Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003)
  • LST EN 60286-3-2014 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2013)
  • LST EN 60286-3-2014/AC-2014 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2013)
  • LST EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (IEC 62435-8:2020)
  • LST EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (IEC 62435-7:2020)

Military Standard of the People's Republic of China-General Armament Department, Component pind

  • GJB/Z 83-1996 Selection Guide for Aerospace Electronic Components Microwave Components
  • GJB 1437-1992 Electronic component leads
  • GJB 546B-2011 Quality assurance program for electronic parts
  • GJB 3243A-2021 Surface mounting requirements for electronic components
  • GJB 3404-1998 Electronic component selection and management requirements
  • GJB 2650-1996 Microwave component performance testing methods
  • GJB 2607-1996 Specification for tinned nickel wire for electronic components
  • GJB/Z 55-1994 Selection Guide for Aerospace Electronic Components Semiconductor Discrete Devices
  • GJB/Z 112-1998 Selection Guide for Aerospace Electronic Components Capacitors
  • GJB 8118-2013 Classification and code for military electronic component
  • GJB 546-1988 Reliability Guarantee Outline for Electronic Components
  • GJB/Z 45.1-1993 Military piezoelectric device series spectrum quartz crystal components
  • GJB/Z 48.1A-2011 Series programmes for military electronic components and devices Optical fibres
  • GJB 7243-2011 Screening technical requirement for military electronic components
  • GJB/Z 49.1A-2013 Military electronic components series type spectrum optical cable
  • GJB 2445-1995 General specification for lead terminal sockets of electronic components
  • GJB/Z 59.1-1994 Military magnetic component series spectrum inductor
  • GJB/Z 60.6A-2021 Military Waveguide, Waveguide Component and Coaxial Component Series Type Spectrum Part 6: RF Isolator
  • GJB/Z 60.7A-2021 Military Waveguides, Waveguide Components and Coaxial Components Series Type Spectrum Part 7: Radio Frequency Circulator
  • GJB/Z 44.2-1993 Military sensitive components and sensor series spectral infrared detectors
  • GJB/Z 44.1-1993 Military sensitive components and sensor series spectral thermistors
  • GJB 1218-1991 General specification for sockets and accessories for plug-in electronic components

Japanese Industrial Standards Committee (JISC), Component pind

  • JIS C 0805:1989 Packaging of electronic components on continuous tapes (components with axial type and radial wire lead terminals)
  • JIS C 5001:1987 General rules for electronic components
  • JIS B 7612-2:2008 Load Cells for Weighing Instruments -- Part 2: Digital Load Cells
  • JIS W 2922:1996 Aircraft -- Hydraulic components -- Marking to indicate fluid for which component is approved
  • JIS K 3804:1990 Size of membrane filter elements
  • JIS C 5002:1968 Environmental requirements for electronic components
  • JIS C 5021:1978 Cold testing procedures for electronic components
  • JIS C 5022:1978 Dry heat testing procedures for electronic components
  • JIS C 5028:1975 Salt mist testing method for electronic components
  • JIS C 0806-3:1999 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
  • JIS C 5029:1975 Low air pressure testing method for electronic components
  • JIS C 0801:1964 Color code for electronic parts
  • JIS C 5953-7:2017 Fiber optic active components and devices -- Performance standards -- Part 7: GPON transceivers
  • JIS E 5301:1994 Railway rolling stock -- Radiator element -- Inspection methods
  • JIS C 5023:1978 Damp heat (steady state) testing procedures for electronic componets
  • JIS C 5024:1978 Damp heat (cyclic) testing procedures for electronic components
  • JIS C 5027:1975 Storage (low temperature) testing method for electronic components
  • JIS C 5030:1978 Change of temperature testing procedures for electronic components
  • JIS C 5031:1975 Sealing testing methods for electronic components
  • JIS C 5036:1975 Endurance (electrical) testing method for electronic components
  • JIS C 5037:1975 Endurance (mechanical) testing method for electronic components
  • JIS C 5954-4:2017 Fiber optic active components and devices -- Test and measurement procedures -- Part 4: GPON transceivers
  • JIS C 0806-1 AMD 1:2022 Packaging of components for automatic handling -- Part 1: Tape packaging of components with axial leads on continuous tapes (Amendment 1)

Professional Standard - Electron, Component pind

  • SJ/T 10225-1991 Graphic base of electronic.Components-graphic of electro-mechanical components
  • SJ/T 10554-1994 Letter symbols for sensitive components
  • SJ/Z 9034-1987 Packaging of components for automatic assembly Part 1: Tape packaging of components with axial lead
  • SJ/T 10718-1996 Examples for preparation of design documents of electronic equipment
  • SJ/T 10149-1991 Graphic base of electronic components graphics of semiconductor discrete device
  • SJ 2422-1983 Tined copper wire for electronic components
  • SJ/T 11167-1998 Type designation system for sensing elements and sensing devices and transducers/sensors
  • SJ/T 10150-1991 Graphic base of electronic components.graphics for resistor capacitor and inductor
  • SJ/T 2421-1996 Tinned copper clad wire for electronic components
  • SJ/T 10669-1995 Solderability tests for surface mounted devices
  • SJ/T 10555-1994 Graphic symbols for electrical diagrams - Sensitive components
  • SJ/T 11125-1997 Encapsulation materials of expoy series for use in electronic components
  • SJ/T 11091-1996 General specifications for lead-tinned for electronic components
  • SJ 20715-1998 Specification for copper-beryllium alloy plate and strip for use in electronic components
  • SJ 20716-1998 Specification for copper-beryllium alloy wire and bor for use in electronic components
  • SJ/T 10630-1995 Antistatic requirments for manufacturing electronic element and device
  • SJ/T 9167.2-1993 Thermal cutoffs for use in electrical appliances and components
  • SJ/T 10611-1994 Detail specification of electronic Components type cd17 fixed aluminium electrolyte capacitors

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Component pind

  • GB/T 13965-2010 Instrument components.Vocabulary
  • GB/T 13965-1992 Instrument components-vocabulary
  • GB/T 4475-1995 Terms of sensor
  • GB/T 29074-2012 Requirements for qualification of space components
  • GB/T 5593-2015 Structure ceramic materials used in electronic component and device
  • GB/T 5593-1996 Structure ceramic materials used in electronic components
  • GB/T 28858-2012 Encapsulating material of phenolic for electronic components
  • GB/T 42969-2023 Component displacement damage test method
  • GB/T 17564.4-2009 Standard data element types with associated classification scheme for electric components.Part 4:IEC reference collection of standard data element types and component classes
  • GB/T 27698.3-2023 Performance test methods for heat exchangers and heat transfer elements Part 3: Heat transfer elements
  • GB/T 28162.3-2011 Packaging of components for automatic handing.Part 3:Packaging of surface mount components on continuous tapes
  • GB/T 17564.4-2001 Standard data element types with associated classification scheme for electric components--Part 4: IEC reference collection of standard data element types,component classes and terms
  • GB/T 42706.1-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 1:General
  • GB/T 1772-1979 Determination of failure rate of electronic elements and components
  • GB/T 15141-1994 Test method for friction element of wet clutch
  • GB/T 11279-1989 Guide to the application of environmental tests to electronic components
  • GB/T 15141-2009 Test method for friction element of wet clutch
  • GB/T 28859-2012 Encapsulating material of powdered epoxy for electronic components
  • GB/T 12273-1996 Quartz crystal units--A specification in the Quality Assessment System for Electronic Components--Part 1: Generic specification
  • GB/T 13947-1992 General specification for electronic components plastic packaging equipments
  • GB/T 2900.12-2008 Electrotechnical terminology.Surge arresters,low-voltage surge protective devices and components
  • GB/T 42706.2-2023 Long-term storage of electronic components and semiconductor devices Part 2: Degradation mechanisms
  • GB/T 42706.5-2023 Long-term storage of electronic components and semiconductor devices - Part 5: Chips and wafers
  • GB/T 15176-1994 Generic specification for sockets and accessories for electronic plug-in devices
  • GB 9539-1988 Detail specification for electronic components, type DC2 ribbon cable connectors

Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence, Component pind

  • GJB/Z 35-1993 Derating criteria for electrical,electronic and electromechanical parts
  • GJB/Z 128-2000 Guideline for selection and application of spaceborne electronic parts Relays
  • GJB 3243-1998 Surface Mounting Requirements for Electronic Components
  • GJB 546A-1996 Quality Assurance Program for Electronic Components
  • GJB 2118-1994 Marking of military electrical and electronic components

Society of Automotive Engineers (SAE), Component pind

SAE - SAE International, Component pind

RU-GOST R, Component pind

KR-KS, Component pind

CZ-CSN, Component pind

HU-MSZT, Component pind

United States Navy, Component pind

Canadian Standards Association (CSA), Component pind

Defense Logistics Agency, Component pind

U.S. Military Regulations and Norms, Component pind

PL-PKN, Component pind

Underwriters Laboratories (UL), Component pind

  • UL 1020-1994 Thermal cutoffs for use in electrical appliances and components
  • UL 586-1990 High-efficiency, particulate, air filter units
  • UL 586-1996 High-efficiency, particulate, air filter units

AIA/NAS - Aerospace Industries Association of America Inc., Component pind

  • NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
  • NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
  • NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
  • NAS4119-2011 HEAT SINK@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ PRESS-ON TYPE (Rev 1)
  • NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
  • NAS4122-2013 HEAT SINK@ ELECTRICAL-ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ EXTRUDED (REV 1)
  • NAS4124-2012 HEAT SINK@ ELECTRICAL/ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ DUAL LINK (Rev 1)
  • NAS4118-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ RETAINER CLIP TYPE (Rev 1)
  • NAS4123-1995 Heat Sink@ Electrical-Electronic Component@ Semiconductor Devices@ for Dual Inline Packages (DIP)
  • NAS4120-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ ENCAPSULATING TYPE@ TO-5 (Rev 1)
  • NAS4120-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Encapsulating Type@ TO-5

European Committee for Standardization (CEN), Component pind

  • EN 12806:2003 Automative liquefied petroleum gas components - Other than containers
  • EN 134:1998 Respiratory protective devices - Nomenclature of components

Aerospace Industries Association, Component pind

  • AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
  • AIA NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
  • AIA NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
  • AIA NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
  • AIA NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Component pind

  • JEDEC JESD51-1995 Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
  • JEDEC EIA-323-1966 Air-Convection-Cooled Life Test Environment for Lead-Mounted Semiconductor Devices
  • JEDEC EIA-321-C-1987 Numbering of Like-Named Terminal Functions in Semiconductor Devices and Designation of Units in Multiple-Unit Semiconductor Devices

ECIA - Electronic Components Industry Association, Component pind

  • 396-1971 Resistors@ Fixed Film Microelement

SE-SIS, Component pind

CU-NC, Component pind

  • NC 59-04-09-1984 National Electrotechnical Vocabulary. Electronic Elements and Components. Resistors
  • NC 59-03-08-1987 National Electrotechnical Vocabulary. Electrical Elements and Components Relays
  • NC 59-03-09-1985 National Electrotechnical Vocabulary. Electrical Components and Cells. Arresters
  • NC 59-03-02-1987 National Electrotechnical Vocabulary. Electrical Components and Elements Power Transforme

未注明发布机构, Component pind

  • GJB/Z 60.6-1994 Military waveguide, waveguide component and coaxial component series spectrum RF isolator
  • GJB/Z 60.7-1994 Military waveguide, waveguide element and coaxial element series spectrum RF circulator
  • GJB/Z 60.3-1994 Military waveguides, waveguide components and coaxial components series spectrum coaxial waveguide converters
  • GJB 3014-1997 Statistical process control system for electronic components
  • DIN EN IEC 63032:2019 Fiber optic cable connecting elements and passive components – tunable fiber optic bandpass filters – basic specification
  • BS EN 130800:2001(2003) Harmonized system of quality assessment for electronic components assessment for electronic components — Sectional specification : Tantalum surface mounting capacitors

American National Standards Institute (ANSI), Component pind

Professional Standard - Building Materials, Component pind

IX-UIC, Component pind

Institute of Electrical and Electronics Engineers (IEEE), Component pind

  • IEEE 1499-1998 Interface for hardware description models of electronic components
  • IEEE Std 1499-1998 IEEE Standard Interface for Hardware Description Models of Electronic Components

IEEE - The Institute of Electrical and Electronics Engineers@ Inc., Component pind

  • IEEE C62.37.1-2012 Guide for the Application of Thyristor Surge Protective Device Components
  • IEEE C57.143-2012 Guide for Application for Monitoring Equipment to Liquid-Immersed Transformers and Components

电子工业部, Component pind

国家市场监督管理总局、中国国家标准化管理委员会, Component pind

  • GB/T 41041-2021 Control requirements of forbidden and restricted components for space applications
  • GB/T 37252-2018 Zirconia ceramics element for planar oxygen sensor
  • GB/T 41032-2021 General guidelines for construction analysis components for space applications

RO-ASRO, Component pind

  • STAS 4702-1988 Technical drawings DBAWINGS FOR OPTICAI. COMPONENTS, SUBASSEMBUKS AND DIAGRAMS

Professional Standard - Aviation, Component pind

  • HB 7026.26-1994 Fixture Universal Component Locator Spring Pin Locator
  • HB 7028.26-1994 General components of clamps Compression parts Tie rods Quick clamps
  • HB 4535.30-1991 K type hole series combined clamp elements Localizer
  • HB 4535.39-1991 K type hole series combined clamp elements Kin remover
  • HB 7031.2-1994 Fixture General Component Locator High Precision Steel Ball Indexer
  • HB 7028.27-1994 General components of fixtures, pressing parts, movable sleeve type quick clamps
  • HB 7030.13-1994 Fixture Universal Components Locating Clamps Circular Locating Clamps
  • HB 7030.16-1994 Fixture Universal Components Positioning Clamps V-shaped Positioning Clamps
  • HB 6187-1989 Mounting and welding of printed board components for aviation
  • HB 7030.14-1994 Fixture universal element positioning clamp large circular positioning clamp
  • HB 7030.17-1994 Fixture Universal Components Positioning Clamps Double V-shaped Positioning Clamps

Aerospace Industries Association/ANSI Aerospace Standards, Component pind

  • AIA/NAS NAS4118-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, RETAINER CLIP TYPE (Rev 1)
  • AIA/NAS NAS4123-2012 HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
  • AIA/NAS NAS4120-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5

BE-NBN, Component pind

Government Electronic & Information Technology Association, Component pind

FI-SFS, Component pind

ES-AENOR, Component pind

Group Standards of the People's Republic of China, Component pind

  • T/CECA 50-2021 Electrically conductive adhesives for quartz crystal devices
  • T/ZPP 042-2023 Overall technical conditions of electronic component reliability test equipment
  • T/CAEE 021-2020 Inspection standard for AC charging pile and its components
  • T/EQTA 002-2021 Complete set of equipment components installation and wiring process

工业和信息化部, Component pind

  • JB/T 6175-2020 Electronic component lead forming process specifications
  • HG/T 6101-2022 Upper and lower adhesive tapes for packaging electronic components
  • SJ/T 11697-2018 Specification for adaptability of soldering processes for lead-free components

IECQ - IEC: Quality Assessment System for Electronic Components, Component pind

IEC - International Electrotechnical Commission, Component pind

  • PAS 62005-9-2-2003 Fibre optic interconnecting devices and passive components Reliability of fibre optic interconnecting devices and passive optical components Part 9-2: Reliability qualification for fibre optic connectors (Edition 1.0)

PH-BPS, Component pind

  • PNS IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
  • PNS IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

ES-UNE, Component pind

  • UNE-EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (Endorsed by Asociación Española de Normalización in April of 2021.)
  • UNE-EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (Endorsed by Asociación Española de Normalización in October of 2020.)
  • UNE-EN 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices (Endorsed by AENOR in August of 2014.)
  • UNE-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)
  • UNE-EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (Endorsed by Asociación Española de Normalización in December of 2018.)
  • UNE-EN 9145:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (Endorsed by Asociación Española de Normalización in December of 2018.)
  • UNE-EN 62148-16:2009 Fibre optic active components and devices - Package and interface standards -- Part 16: Transmitter and receiver components for use with LC connector interface (Endorsed by AENOR in April of 2010.)
  • UNE-EN 62148-17:2014 Fiber optic active components and devices - Package and interface standards - Part 17: Transmitter and receiver components with dual coaxial RF connectors (Endorsed by AENOR in May of 2014.)
  • UNE-EN ISO 11151-2:2015 Lasers and laser-related equipment - Standard optical components - Part 2: Components for the infrared spectral range (ISO 11151-2:2015)

International Organization for Standardization (ISO), Component pind

  • ISO 4548-2:1982 Methods of test for full-flow lubricating oil filters for internal combustion engines; Part 2 : Element by-pass component characteristics

European Association of Aerospace Industries, Component pind

  • AECMA PREN 2591-G9-1993 Aerospace Series Elements of Electrical and Optical Connection Test Methods Part G9 - Electrical Elements Tensile Strength of Couplers Edition P 1
  • AECMA PREN 2591-GC1-1993 Aerospace Series Elements of Electrical and Optical Connection Test Methods Part GC1 - Electrical Elements Endurance at Temperature for Couplers Edition P 1

American Society of Mechanical Engineers (ASME), Component pind

ESD - ESD ASSOCIATION, Component pind

  • SP5.2-2019 Electrostatic Discharge Sensitivity Testing – Machine Model (MM) – Component Level
  • S5.3.1-2009 Electrostatic Discharge Sensitivity Testing – Charged Device Model (CDM) – Component Level

CN-QIYE, Component pind

  • Q/GDW 11179.3-2014 Technical specifications for components used in energy meters Part 3: Resistors
  • Q/GDW 11179.13-2015 Technical Specifications for Components for Energy Meters Part 13: Microcontrollers

PT-IPQ, Component pind

Professional Standard - Military and Civilian Products, Component pind

  • WJ 2652-2005 Technical requirement for screening of electronic elements for fuses

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Component pind

IN-BIS, Component pind

Shaanxi Provincial Standard of the People's Republic of China, Component pind

CENELEC - European Committee for Electrotechnical Standardization, Component pind

  • EN 61360-4:1997 Standard Data Element Types with Associated Classification Scheme for Electric Components Part 4: IEC Reference Collection of Standard Data Element Types@ Component Classes and Terms




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