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The future of chip technology
The future of chip technology, Total:166 items.
In the international standard classification, The future of chip technology involves: Telecommunication systems, Semiconductor devices, Information technology (IT) in general, Integrated circuits. Microelectronics, Open systems interconnection (OSI), Microprocessor systems, Electronic components in general, Biology. Botany. Zoology, Industrial automation systems, Rubber and plastics products, IT terminal and other peripheral equipment, Cinematography, Applications of information technology, Analytical chemistry, Road vehicle systems, Networking, Optoelectronics. Laser equipment, Transformers. Reactors, Medical equipment, Miscellaneous domestic and commercial equipment, Mobile services, Fibre optic communications, Photography, Character sets and information coding, Farming and forestry, Insulating materials, Radiocommunications, Road vehicles in general, Occupational safety. Industrial hygiene, Vocabularies.
AGMA - American Gear Manufacturers Association, The future of chip technology
- 11FTM19-2011 Convoloid Gearing Technology - The Shape Of The Future
IPC - Association Connecting Electronics Industries, The future of chip technology
SAE - SAE International, The future of chip technology
- SAE T-135-2018 Electric Flight Technology: The Unfolding of a New Future
- SAE R-444-2015 Wireless Charging Technology and The Future of Electric Transportation
- SAE T-114-2003 Fuel Cell Powered Vehicles Automotive Technology of the Future-Update
- SAE AIR6056-2014 Gas Turbine Engine Lubricant Specifications: Current Technical Review and Future Direction
Institute of Interconnecting and Packaging Electronic Circuits (IPC), The future of chip technology
Professional Standard - Post and Telecommunication, The future of chip technology
- YD/T 2328-2011 Fundamental characteristics and requirements of future packet based networks
- YD/T 1886-2009 Security Requirements and Test Specification for SoC in Mobile Terminal
ACI - American Concrete Institute, The future of chip technology
- ACI SP-144-1994 Concrete Technology Past@ Present@ and Future (Out of Print)
- ACI SP-254-2008 Nanotechnology of Concrete: Recent Developments and Future Perspectives
IEC - International Electrotechnical Commission, The future of chip technology
- PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)
Professional Standard - Electron, The future of chip technology
- SJ/T 11486-2015 Technical specification for low power light-emitting diode chips
- SJ/T 11398-2009 Technical specification for power light-emitting diode chips
- SJ/T 11402-2009 Technical specification of semiconductor laser chip used in optical fiber communication
- SJ/T 11856.3-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 3: Electric Absorption Modulated Semiconductor Laser Chips for Light Sources
- SJ/T 11856.2-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 2: Vertical Cavity Surface Emitting Semiconductor Laser Chips for Light Sources
- SJ/T 11856.1-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 1: Fabry-Perot Type and Distributed Feedback Type Semiconductor Laser Chips for Light Sources
ITU-R - International Telecommunication Union/ITU Radiocommunication Sector, The future of chip technology
- RESOLUTION 47-2000 Future submission of satellite radio transmission technologies for IMT-2000
- RESOLUTION 47-1-2007 Future submission of satellite radio transmission technologies for IMT-2000
- RESOLUCIÓN 47 SPANISH-2000 Futura presentación de tecnologías de transmisión radioeléctrica de satélite para las IMT-2000
- RESOLUCIÓN 47-1 SPANISH-2007 Futura presentación de tecnologías de transmisión radioeléctrica de satélite para las IMT-2000
- REPORT M.2079-2006 Technical and operational information for identifying Spectrum for the terrestrial component of future development of IMT-2000 and IMT-Advanced
- ITU-R M.539-2-1986 Technical and Operational Characteristics of Future International Radio-Paging Systems - Section 8A - Land Mobile Service and Related Subjects
International Telecommunication Union (ITU), The future of chip technology
IET - Institution of Engineering and Technology, The future of chip technology
- MOB WIRL COMM-2004 Mobile and Wireless Communications: Key Technologies and Future Applications
British Standards Institution (BSI), The future of chip technology
- PD ISO/IEC TR 29181-5:2014 Information technology. Future Network. Problem statement and requirements. Security
- PD ISO/IEC TR 29181-4:2013 Information technology. Future Network. Problem statement and requirements. Mobility
- BS PD ISO/IEC TR 29181-5:2014 Information technology. Future Network. Problem statement and requirements. Security
- PD ISO/IEC TR 29181-8:2017 Information technology. Future Network. Problem statement and requirements. Quality of Service
- BS PD ISO/IEC TR 29181-8:2017 Information technology. Future Network. Problem statement and requirements. Quality of Service
- BS PD ISO/IEC TR 29181-9:2017 Information technology. Future Network. Problem statement and requirements. Networking of everything
- PD ISO/IEC TR 29181-9:2017 Information technology. Future Network. Problem statement and requirements. Networking of everything
- PD ISO/TR 21190:2018 Electronic fee collection. Investigation of charging policies and technologies for future standardization
- PD ISO/IEC TR 29181-2:2014 Information technology. Future Network. Problem statement and requirements. Naming and addressing
- BS ISO 1039:1995 Cinematography - Cores for motion-picture and magnetic film rolls - Dimensions
- BS ISO 1039:1996 Cinematography. Cores for motion-picture and magnetic film rolls. Dimensions
- PD 6598-1996 Measurement techniques for the characterization of the European mini test chip
- BS PD ISO/IEC TR 29181-2:2014 Information technology. Future Network. Problem statement and requirements. Naming and addressing
- PD 6595-1996 Parameter extraction techniques for the European mini test chip
- BS 5550-5.1.2:1993 Cinematography - Common to more than one film gauge - Raw stock - Specification for the minimum information for the labelling of containers for raw stock motion-picture films and magnetic fil
- BS ISO 3023:1995 Cinematography - 65 mm and 70 mm unexposed motion-picture film - Cutting and perforating dimensions
Group Standards of the People's Republic of China, The future of chip technology
- T/CSSTI 0001-2023 Classification and Coding of Technologies for Future Technology Monitoring Information Part 1: Biotechnology
- T/CESA 1248-2023 Technical requirement for chiplet interface bus
- T/SHMHZQ 031-2022 Requirements for chip security of mobile terminals
- T/QGCML 733-2023 Technical specification for automatic chip programming machine
- T/CSSTI 0002-2023 Classification and Coding of Technologies for Future Technology Monitoring Information Part2:Intelligent Manufacturing
- T/CSSTI 0003-2023 Classification and Coding of Technologies for Future Technology Monitoring Information Part 3: Artificial Intelligence
- T/GDEIIA 17-2021 Microwave Oven Special Chip Integrated Design Standard
- T/CTS 11-2023 Technical requirements of data security chip for data recorder of vehicle
- T/SHMHZQ 092-2021 Technical specification for digital chip back-end physical design services
- T/EGAG 017-2022 Specification of technical evaluation for Brain-like chip developing tool software
- T/GDRA 011-2019 Technical requirements for transformer core robot stacking
- T/BFIA 007-2021 Security technical specification of CPU for financial security chip
- T/SZROBOT 0005-2023 Technical requirements for AI-chip enhanced edge vision module
- T/ZSA 169-2023 Technical specification of dual-band global satellite navigation chip for automobile
- T/ZAII 046-2023 General technical requirements for micro-processor of single-phase smart meter
- T/ZJGS 02-2018 Technical Specifications for Padlock Accessories Part 1: Lock Cylinders, Keys, Pins, Blades
- T/CESA 1150-2021 Application of artificial intelligence chip—Technical requirements to system of Chinese-Braille translation
- T/EMCG 001.5-2019 Technical framework of cryptographic module in mobile smart terminal Part 5: Based on security chip
- T/ZSA 67.5-2019 Technical framework of cryptographic module in mobile smart terminal Part 5: Based on security chip
- T/SICA 003-2022 Technical specification for dual-frequency multi-interface temperature and humidity detection tag chip based on RFID transmission and storage technology
- T/CCSA 360-2022 Mobile internet and smart home system—Technical requirements for secure chipset interface of terminal equipment
- T/CSAE 260-2022 Technical specification and test method for visual perception computing chip of intelligent and connected vehicle
- T/ZJGS 16-2022 Technical Specifications for Padlock Accessories Part 5: Polymer Composite Blade Lock Cylinder
- T/CESA 1247-2023 Artificial intelligence—Specifications of cloud side deep learning chips for computer vision inference
- T/CESA 1246-2022 Artificial intelligence —Specifications of cloud side deep learning chips for computer vision training
- T/CESA 9461.2-2020 Information technology application innovation—Evaluation criteria for information products maturity—Part 2：Chip
- T/SICA 002-2022 General 5G terminal chip and module enhancement technical requirements for typical industrial scenarios
- T/GDPCIA 006-2022 Information technology — Office equipment — General specification for toner cartridges with separated chip for laser printers
- T/CESA 1149-2021 Application of artificial intelligence chip - Technical requirements to the auxiliary diagnostic system of pathological image analysis
Institute of Electrical and Electronics Engineers (IEEE), The future of chip technology
- IEEE 896.1-1994 Information technology - Microprocessor systems - Futurebus+ - Logical protocol specification
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, The future of chip technology
- GB/T 28639-2012 General technical requirement for DNA microarray
- GB/T 28641-2012 General technical requirement for protein microarray
- GB/T 36356-2018 Technical specification for power light-emitting diode chips
- GB/T 36357-2018 Technical specification for middle power light-emitting diode chips
- GB/T 22186-2016 Information security techniques.Security technical requirements for IC card chip with CPU
- GB/T 41521-2022 General technical requirement of microfluidic chip for multi-index nucleic acid isothermal amplification and detection
- GB/T 22186-2008 Information security techniques.Security technical requirements for IC card chip with CPU(EAL4+)
CZ-CSN, The future of chip technology
- CSN 64 6210-1989 Plastics. Unplasticized polyvinylchloride foils. Technical requirements
International Organization for Standardization (ISO), The future of chip technology
- ISO/IEC TR 15440:2016 Information technology - Future keyboards and other input devices and entry methods
- ISO 1039:1988 Cinematography; cores for motion-picture and magnetic film rolls; dimensions
- ISO/IEC 14536:1995 Information technology - Microprocessor systems - Futurebus+<(hoch)TM>, Profile M (military)
- ISO/IEC 10857:1994 Information technology - Microprocessor systems - Futurebus+ - Logical protocol specification
- ISO 1039:1975 Cinematography — Cores for motion-picture and magnetic film rolls — Dimensions
- ISO/IEC TR 29181-5:2014 Information technology - Future Network - Problem statement and requirements - Part 5: Security
- ISO/IEC TR 29181-4:2013 Information technology.Future Network.Problem statement and requirements.Part 4: Mobility
- ISO/IEC TR 29181-8:2017 Information technology — Future Network — Problem statement and requirements — Part 8: Quality of Service
- ISO/TR 29181-8:2017 Information technology - Future Network - Problem statement and requirements - Part 8: Quality of Service
- ISO/TR 29181-9:2017 Information technology - Future Network - Problem statement and requirements - Part 9: Networking of everything
- ISO/IEC TR 15440:2005 Information technology - Future keyboards and other associated input devices and related entry methods
- ISO/IEC TR 29181-1:2012 Information technology - Future Network - Problem statement and requirements - Part 1: Overall aspects
- ISO/IEC TR 29181-6:2013 Information technology - Future Network - Problem statement and requirements - Part 6: Media transport
- ISO/IEC TR 29181-7:2013 Information technology - Future Network - Problem statement and requirements - Part 7: Service composition
- ISO/IEC TR 29181-2:2014 Information technology - Future Network - Problem statement and requirements - Part 2: Naming and addressing
- ISO/IEC TR 29181-3:2013 Information technology - Future Network - Problem statement and requirements - Part 3: Switching and routing
- ISO 10331:1991 Photography; unprocessed photographic films and papers; storage practices
- ISO 3042:1983 Cinematography — Labelling of containers for unexposed motion-picture films and magnetic films — Minimum information specifications
- ISO 3023:1988 Cinematography — 65 mm and 70 mm unexposed motion-picture film — Cutting and perforating dimensions
- ISO 3023:1984 Cinematography — 65 and 70 mm unexposed motion-picture film — Cutting and perforating dimensions
- ISO 8980-2:2004/cor 1:2006 Ophthalmic optics - Uncut finished spectacle lenses - Part 2: Specifications for progressive power lenses; Technical Corrigendum 1
- ISO 5759:1980 Cinematography; Sound motion-picture camera cartridge, 8 mm Type S, Model 1; Cartridge-camera interface and take-up core drive; Dimensions and specifications
- ISO 8980-1:2004/cor 1:2006 Ophthalmic optics - Uncut finished spectacle lenses - Part 1: Specifications for single-vision and multifocal lenses; Technical Corrigendum 1
国家市场监督管理总局、中国国家标准化管理委员会, The future of chip technology
- GB/T 37720-2019 Identification cards—Chip technical requirements for financial IC card
- GB/T 37045-2018 Information technology — Biometrics—Fingerprint processing chip technical requirements
- GB/T 41407-2022 Technical requirement of nucleic acid isothermal amplification analyzer based on microfluidic chips
American National Standards Institute （ANSI), The future of chip technology
- ANSI/IEEE Std896.1:1994 Information technology - Microprocessor systems - futurebus+- logical protocol specification
GOSTR, The future of chip technology
- GOST R 58210-2018 Information technology. Future Network. Problem statement and requirements. Part 1. Overall aspects
- GOST 34284-2017 Food products, feed, food raw materials, biological objects of animal origin. Method for the detection of anabolic growth promoters by the hemiluminescence immunoenzymatic assay with the use of biochip technology
- GOST 34285-2017 Food products, food raw materials. Method for the detection of chemotherapeutic drugs by the hemiluminescence immunoenzymatic assay with the use of biochip technology
Korean Agency for Technology and Standards (KATS), The future of chip technology
- KS X 5018-1997(2007) INFORMATION TECHNOLOGY - MICROPROCESSOR SYSTEMS - FUTUREBUS＋ - LOGICAL PROTOCOL SPECIFICATION
- KS G 9006-2013 Cinematography — Spools, daylight loading type for 16 mm motion-picture cameras — Dimensions
- KS G 9006-2003 Cinematography-Spools, daylight loading type for 16 mm motion-picture cameras-Dimensions
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, The future of chip technology
RU-GOST R, The future of chip technology
European Telecommunications Standards Institute (ETSI), The future of chip technology
- ETSI TS 103 194-2014 Network Technologies (NTECH); Autonomic network engineering for the self-managing Future Internet (AFI); Scenarios, Use Cases and Requirements for Autonomic/Self-Managing Future Internet (V1.1.1)
- ETSI TS 103 371-2015 Network Technologies (NTECH); Autonomic network engineering for the self-managing Future Internet (AFI); Proofs of Concept Framework (V1.1.1)
- ETSI TR 102 849-2010 Human Factors (HF); Inclusive eServices for all; Background analysis of future interaction technologies and supporting information (V1.1.1)
ETSI - European Telecommunications Standards Institute, The future of chip technology
- TS 103 194-2014 Network Technologies (NTECH); Autonomic network engineering for the self-managing Future Internet (AFI); Scenarios@ Use Cases and Requirements for Autonomic/Self-Managing Future Internet (V1.1.1)
- TS 103 371-2015 Network Technologies (NTECH); Autonomic network engineering for the self-managing Future Internet (AFI); Proofs of Concept Framework (V1.1.1)
- TR 102 849-2010 Human Factors (HF); Inclusive eServices for all; Background analysis of future interaction technologies and supporting information (V1.1.1)
- TR 103 473-2018 Network Technologies (NTECH); Autonomic network engineering for the self-managing Future Internet (AFI); Autonomicity and Self-Management in the Broadband Forum (BBF) Architectures (V1.1.1)
Professional Standard - Urban Construction, The future of chip technology
- CJ/T 306-2009 Requirement for chip technology of contactless CPU card in construction case
International Electrotechnical Commission (IEC), The future of chip technology
- ISO/IEC TR 29181-9:2017 Information technology - Future Network - Problem statement and requirements - Part 9: Networking of everything
RTCA - RTCA@ Inc., The future of chip technology
- RTCA DO-193-1986 User Requirements for Future Communications@ Navigation@ and Surveillance Systems@ Including Space Technology Applications (***ONLY AVAILABLE IN HARDCOPY***)
工业和信息化部, The future of chip technology
- YD/T 1886-2015 Mobile terminal chip security technical requirements and testing methods
Ningxia Provincial Standard of the People's Republic of China, The future of chip technology
- DB64/T 1252-2016 Technical regulations for biochip detection of potato seedling (seedling) virus disease
CN-QIYE, The future of chip technology
- Q/GDW 11179.12-2015 Technical Specifications for Components Used in Energy Meters Part 12: Clock Chips
- Q/GDW 11179.14-2015 Technical Specifications for Components for Electric Energy Meters Part 14: Metering Chips
- Q/GDW 11179.11-2015 Part 11 of technical specifications for components used in electric energy meters: serial port communication protocol RS-485 chip
Association of German Mechanical Engineers, The future of chip technology
Professional Standard - Public Safety Standards, The future of chip technology
KR-KS, The future of chip technology
- KS A ISO 8001-2003(2023) Cinematography - Underexposed motion-picture film requiring forced development - Dimension method
- KS A ISO 3023-2003(2023) Cinematography -- 65 mm and 70 mm unexposed motion-picture film -- Cutting and perforating dimensions (available in English only)
(U.S.) Telecommunications Industries Association , The future of chip technology
- TIA-5041-2016 Future Advanced SATCOM Technologies (FAST) Open Standard Digital- If Interface (OSDI) for SATCOM Systems
Jiangsu Provincial Standard of the People's Republic of China, The future of chip technology
- DB3202/T 1033-2022 Technical specifications for the prevention and control of occupational hazards in silicon integrated circuit chip manufacturing enterprises
Association Francaise de Normalisation, The future of chip technology
- NF EN ISO 10808:2011 Nanotechnologies - Caractérisation des nanoparticules dans les chambres d'inhalation par exposition pour les essais de toxicité par inhalation
Professional Standard - Password Professional Standards, The future of chip technology
- GM/T 0035.2-2014 Specifications of cryptographic application for RFID systems.Part 2: Specification of cryptographic application for RFID tag chip
Professional Standard - Commodity Inspection, The future of chip technology
- SN/T 4283.1-2015 Test method of microplate gene chip at frontier port.Part 1:General technical procedure
Professional Standard - Agriculture, The future of chip technology
- 339药典 四部-2020 9000 Guiding Principles 9106 Guiding Principles of Gene Chip-Based Drug Evaluation Technology and Methods
- 322药典 四部-2015 9000 Guiding Principles 9106 Guiding Principles of Gene Chip-Based Drug Evaluation Technology and Methods
国家质量监督检验检疫总局, The future of chip technology
- SN/T 4351-2015 Technical specifications for liquid phase chip testing of diethylstilbestrol and medroxyprogesterone in aquatic animals and their products
中国人民银行, The future of chip technology
- JR/T 0025.18-2018 China Financial Integrated Circuit (IC) Card Specifications Part 18: Technical Specifications for Online Payments Based on Security Chips