ZH

RU

ES

imaging collector

imaging collector, Total:496 items.

In the international standard classification, imaging collector involves: Integrated circuits. Microelectronics, Fibre optic communications, Optical equipment, Non-destructive testing, Protection against crime, Electronic components in general, Optoelectronics. Laser equipment, Vocabularies, Astronomy. Geodesy. Geography, Data storage devices, Photography, Technical drawings, Optics and optical measurements, Medical equipment, Surface treatment and coating, Cereals, pulses and derived products, Semiconducting materials, Graphic technology, Accident and disaster control, Electronic display devices, Protection against fire, Semiconductor devices, Lamps and related equipment, Audio, video and audiovisual engineering, Automatic controls for household use, Farming and forestry, Mechanical testing, Glass, Paints and varnishes, Linear and angular measurements, Vibrations, shock and vibration measurements, Character sets and information coding, Software development and system documentation, Shafts and couplings, Road engineering, Solar energy engineering, Installations in buildings, Applications of information technology, Kitchen equipment, Lighting, Electronic tubes, Air quality, Industrial automation systems, Aircraft and space vehicles in general, Analytical chemistry, Welding, brazing and soldering, Transformers. Reactors, Electromechanical components for electronic and telecommunications equipment.


General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, imaging collector

  • GB/T 43063-2023 Integrated circuit CMOS image sensor testing method
  • GB/T 28511.1-2012 Integrated optical path devices based on planar lightwave circuit.Part 1:Optical power splitter based on PLC technology
  • GB/T 29846-2013 Photoimageable plating and etching resist paste of printed circuit board
  • GB/T 28511.2-2012 Integrated optical path devices based on planar lightwave circuit.Part 2:DWDM filter based on AWG technology
  • GB/T 15651-1995 Semiconductor devices. Discrete devices and integrated circuits. Part 5: Optoelectronic devices
  • GB/T 17574-1998 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
  • GB/T 17940-2000 Semiconductor devices Integrated circuits Part 3:Analogue integrated circuits
  • GB/T 17574.9-2006 Semiconductor devices.Integrated circuits.Part 2-9:Digital integrated circuits.Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
  • GB/T 17574.20-2006 Semiconductor devices Integrated circuits Part 2-20: Digital integrated circuits Family specification Low voltage integrated circuits
  • GB/T 20515-2006 Semiconductor devices. Integrated circuits. Part 5: Semicustom integrated circuits
  • GB/T 17574.10-2003 Semiconductor devices-Integrated circuits-Part 2-10:Digital integrated circuits-Blank detail specification for integrated circuit dynamic read/write memories
  • GB/T 24791.3-2009 Photography.Sensitometry of screen/film system for medical radiography.Part 3:Determination of sensitometric curve shape,speed and average gradient for mammography
  • GB/T 15651.3-2003 Discrete semiconductor devices and integrated circuits Part 5-3:Optoelectronic devices Measuring methods

工业和信息化部, imaging collector

  • YD/T 3540-2019 Integrated Optical Power Detector (IPM)
  • YD/T 2000.2-2018 Planar optical waveguide integrated optical circuit device Part 2: Dense wavelength division multiplexing (DWDM) filter based on arrayed waveguide grating (AWG) technology
  • YD/T 2799.1-2015 Technical conditions for integrated coherent optical receivers Part 1: 40Gb/s
  • YD/T 2799.2-2015 Technical specifications for integrated coherent optical receivers Part 2: 100Gb/s
  • YD/T 2799.4-2021 Technical conditions for integrated coherent optical receivers Part 4: 400Gb/s
  • YD/T 2904.2-2018 Integrated Tunable Laser Components Part 2: Miniaturized Components
  • YD/T 2904.3-2019 Integrated Tunable Laser Components Part 3: Dual Channel Components
  • YD/T 2799.3-2018 Technical conditions for integrated coherent optical receivers Part 3: 100Gbit/s miniaturization
  • YD/T 3831.1-2021 Integrated Coherent Transceiver and Light Components Part 1: 100Gb/s
  • YD/T 3831.2-2022 Integrated Coherent Transceiver and Light Components Part 2: 400Gb/s
  • YD/T 3126.1-2016 Integrated Tunable Light Source Module Part 1: Interface

U.S. Military Regulations and Norms, imaging collector

Korean Agency for Technology and Standards (KATS), imaging collector

  • KS B ISO 9358:2006 Optics and optical instruments Veiling glare of image-forming systems - Definitions and methods of measurement
  • KS B ISO 9358-2006(2016) Optics and optical instruments -- Veiling glare of image forming systems -- Definitions and methods of measurement
  • KS B ISO 9358-2006(2021) Optics and optical instruments -- Veiling glare of image forming systems -- Definitions and methods of measurement
  • KS A ISO 18925:2006 Imaging materials-Optical disc media-Storage practices
  • KS A ISO 18925-2016(2021) Imaging materials-Optical disc media-Storage practices
  • KS A ISO 18925:2016 Imaging materials-Optical disc media-Storage practices
  • KS C IEC 60747-5:2004 Semiconductor devices-Discrete devices-Part 5:Optoelectronic devices
  • KS C IEC 60747-5-1:2020 Discrete semiconductor devices and integrated circuits —Part 5-1: Optoelectronic devices — General
  • KS C IEC 60748-3-1:2002 Semiconductor devices-Integrated circuits-Part 3:Analogue integrated circuits-Section 1:Blank detail specification for monolithic integrated operational amplifiers
  • KS C IEC 60748-2-8:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories
  • KS A ISO 12234-2-2006(2021) Electronic still-picture imaging-Removable memory-Part 2:TIFF/EP image data format
  • KS A ISO 12234-2-2006(2016) Electronic still-picture imaging-Removable memory-Part 2:TIFF/EP image data format
  • KS C IEC 60748-4:2004 Semiconductor devices-Integrated circuits-Part 4:Interface integrated circuits
  • KS C IEC 60748-3:2002 Semiconductor devices-Integrated circuits Part 3:Analogue integrated circuits
  • KS C IEC 60748-2:2001 Semiconductor devices-integrated circuits-Part 2:Digital integrated circuits
  • KS C IEC 60748-2-2001(2021) Semiconductor devices-integrated circuits-Part 2:Digital integrated circuits
  • KS C IEC 60748-2-2001(2016) Semiconductor devices-integrated circuits-Part 2:Digital integrated circuits
  • KS C IEC 60748-4-2004(2020) Semiconductor devices-Integrated circuits-Part 4:Interface integrated circuits
  • KS C IEC 60748-3-2002(2017) Semiconductor devices-Integrated circuits Part 3:Analogue integrated circuits
  • KS C IEC 60748-3-2002(2022) Semiconductor devices-Integrated circuits Part 3:Analogue integrated circuits
  • KS G ISO 11380-2001(2016) Optics and optical instruments-Ophthalmic optics-Formers
  • KS C IEC 62149-3-2005(2020) Fibre optic active components and devices-Performance standards-Part 3:2.5 Gbit/s modulator-integrated laser diode transmitters
  • KS B ISO 9345-1-2016(2021) Optics and optical instruments Microscopes - Imaging distances related to mechanical reference planes - Part 1 Tube length 160 mm
  • KS B ISO 9345-2-2016(2021) Optics and optical instruments-Microscopes:Imaging distances related to mechanical reference planes-Part 2:Infinity-corrected optical systems
  • KS C IEC 60748-2-6-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 6:Blank detail specification for microprocessor integrated circuits
  • KS C IEC 60748-2-6-2002(2017) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 6:Blank detail specification for microprocessor integrated circuits
  • KS C IEC 60748-5:2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
  • KS C IEC 60748-5:2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
  • KS C IEC 60747-5-1:2004 Discrete semiconductor devices and integrated circuits-Part 5-1:Optoelectronic devices-General
  • KS C IEC 60747-5-3:2020 Discrete semiconductor devices and integrated circuits —Part 5-3: Optoelectronic devices — Measuring methods
  • KS C IEC 60748-2-20:2002 Semiconductor devices-Integrated circuits-Part 2-20:Digital integrated circuits-Family specification-Low voltage integrated circuits
  • KS C IEC 60748-2-20:2021 Semiconductor devices — Integrated circuits — Part 2-20: Digital integrated circuits — Family specification — Low voltage integrated circuits
  • KS C IEC 60748-3-1-2002(2017) Semiconductor devices-Integrated circuits-Part 3:Analogue integrated circuits-Section 1:Blank detail specification for monolithic integrated operational amplifiers
  • KS C IEC 60748-3-1-2002(2022) Semiconductor devices-Integrated circuits-Part 3:Analogue integrated circuits-Section 1:Blank detail specification for monolithic integrated operational amplifiers
  • KS C IEC 60748-5:2003 Semiconductor devices-Integrated circuits-Part 5:Semicustom integrated circuits
  • KS C IEC 60748-20:2021 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
  • KS C IEC 60747-5-3:2004 Semiconductor devices-Discrete devices-Part 5-3:optoelectronic devices-Measuring method
  • KS C IEC 60050-521-2002(2022) Semiconductor devices and integrated circuits
  • KS C IEC 60050-521-2002(2017) Semiconductor devices and integrated circuits
  • KS C IEC 60748-20-1:2003 Semiconductor devices-Integrated circuits-Part 20:Generic specification for film integrated circuits and hybrid film integrated circuits-Section 1:Requirements for internal visual examination
  • KS C IEC 60748-20:2003 Semiconductor devices-Integrated circuits-Part 20:Generic specification for film integrated circuits and hybrid film integrated circuits
  • KS C IEC 60748-2-10:2001 Semiconductor integrated circuits-Part 2:Digital integrated circuits Section 10-Blank detail specification for integrated circuit dynamic read/write memories(excluding uncommitted logic arrays)
  • KS C IEC 60748-2-8-2002(2017) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories
  • KS C IEC 60748-2-8-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories
  • KS A ISO 12234-1-2016(2021) Electronic still-picture imaging-Removable memory-Part 1:Basic removable-memory model
  • KS B ISO 11807-2-2017(2022) Integrated optics — Vocabulary — Part 2: Terms used in classification
  • KS C IEC 60748-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
  • KS C IEC 60748-2-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
  • KS C IEC 60748-2-12-2002(2017) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 12:Digital integrated circuits-Blank detail specification for programmable logic devices(PLDs)
  • KS C IEC 60748-2-9:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
  • KS C IEC 60748-2-9-2002(2017) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
  • KS C IEC 60748-2-9-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
  • KS C IEC 60748-2-7:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 7:Blank detail specification for integrated circuits fusible-link programmable bipolar read-only memories
  • KS A 4730-1997(2007) Mono-tank X-ray units for diagnostic use
  • KS C ISO 10656-2001(2006) Electric resistance welding-Integrated transformers for welding guns
  • KS A ISO 18929:2007 Imaging materials-Wet-processed silver-gelatin type black-and-white photographic reflection prints- Specifications for dark storage
  • KS G ISO 11380-2001(2021) Optics and optical instruments-Ophthalmic optics-Formers
  • KS C IEC 60748-2-12-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 12:Digital integrated circuits-Blank detail specification for programmable logic devices(PLDs)
  • KS C IEC 60748-2-3-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 3:Blank detail specification for HCMOS digital integrated circuits(series 54/74 HC, 54/74 HCT, 54/74 HCU)
  • KS B ISO 14881:2006 Integrated optics-Interfaces-Parameters relevant to coupling properties
  • KS B ISO 11807-2:2007 Integrated optics-Vocabulary-Part 2:Terms used in classification
  • KS C 8577-2022 Building integrated photovoltaic(BIPV) modules — The requirement of performance evaluation
  • KS C 8577-2016(2021) Building integrated photovoltaics(BIPV) modules — The requirement of performance evaluation
  • KS C IEC 60748-2-11:2002 Semiconductor devices-Integrated circuits-Part 2-11:Digital integrated circuits-Blank detail specification for single supply integrated circuit,electrically erasable, and programmable read-only memory
  • KS C IEC 60747-5-2:2020 Discrete semiconductor devices and integrated circuits —Part 5-2: Optoelectronic devices — Essential ratings and characteristics

International Organization for Standardization (ISO), imaging collector

  • ISO 9358:1994 Optics and optical instruments - Veiling glare of image-forming systems - Definitions and methods of measurement
  • ISO 18925:2008 Imaging materials - Optical disc media - Storage practices
  • ISO 15529:1999 Optics and optical instruments - Optical transfer function - Principles of measurement of modulation transfer function (MTF) of sampled imaging systems
  • ISO 18925:2013 Imaging materials - Optical disc media - Storage practices
  • ISO 18938:2008 Imaging materials - Optical discs - Care and handling for extended storage
  • ISO 18938:2014 Imaging materials - Optical discs - Care and handling for extended storage
  • ISO 11380:1994 Optics and optical instruments - Ophthalmic optics - Formers
  • ISO/CD 18221:2023 Microscopes — Microscopes with digital imaging displays — Information provided to the user regarding imaging performance
  • ISO 18943:2014 Imaging materials - Magnetic hard drives used for image storage - Care and handling
  • ISO 18221:2016 Microscopes - Microscopes with digital imaging displays - Information provided to the user regarding imaging performance
  • ISO/CIE TR 21783:2022 Light and lighting — Integrative lighting — Non-visual effects
  • ISO 12234-3:2016 Electronic still picture imaging - Removable memory - Part 3: XMP for digital photography
  • ISO 18920:2000 Imaging materials - Processed photographic reflection prints - Storage practices
  • ISO 18929:2012 Imaging materials - Wet-processed silver-gelatin type black-and-white photographic reflection prints - Specifications for dark storage
  • ISO 18929:2003 Imaging materials - Wet-processed silver-gelatin type black-and-white photographic reflection prints - Specifications for dark storage
  • ISO 21073:2019 Microscopes — Confocal microscopes — Optical data of fluorescence confocal microscopes for biological imaging
  • ISO/CD 18937-3:2014 Imaging materials — Methods for measuring indoor light stability of photographic prints — Part 3: LED lamp exposure
  • ISO 19962:2019 Optics and photonics — Spectroscopic measurement methods for integrated scattering by plane parallel optical elements
  • ISO 11807-2:2001 Integrated optics - Vocabulary - Part 2: Terms used in classification
  • ISO 14881:2001 Integrated optics - Interfaces - Parameters relevant to coupling properties
  • ISO 14881:2021 Integrated optics - Interfaces - Parameters relevant to coupling properties
  • ISO 11807-2:2021 Integrated optics - Vocabulary - Part 2: Terms used in classification
  • ISO/TR 12037:1998 Electronic imaging - Recommendations for the expungement of information recorded on write-once optical media
  • ISO 18937:2014 Imaging materials - Photographic reflection prints - Methods for measuring indoor light stability
  • ISO 11807-1:2021 Integrated optics — Vocabulary — Part 1: Optical waveguide basic terms and symbols
  • ISO 14535:2001 Photography - Room-light loading packages for electronic scanners and image-setting film and paper rolls - Dimensions and related requirements
  • ISO 18902:2001 Imaging materials - Processed photographic films, plates and papers - Filing enclosures and storage containers
  • ISO 18434-2:2019 Condition monitoring and diagnostics of machine systems — Thermography — Part 2: Image interpretation and diagnostics
  • ISO/CD 18937-3.2 Imaging materials — Methods for measuring indoor light stability of photographic prints — Part 3: LED lamp exposure
  • ISO 1073-1:1976/Amd 1:1978 Alphanumeric character sets for optical recognition; Part 1: Character set OCR-A; Shapes and dimensions of the printed image
  • ISO 1073-1:1976 Alphanumeric character sets for optical recognition; Part 1: Character set OCR-A; Shapes and dimensions of the printed image
  • ISO 1073-2:1976 Alphanumeric character sets for optical recognition; Part 2: Character set OCR-B; Shapes and dimensions of the printed image
  • ISO 1073-2:1976/Amd 1:1978 Alphanumeric character sets for optical recognition; Part 2: Character set OCR-B; Shapes and dimensions of the printed image

未注明发布机构, imaging collector

  • BS ISO 9358:1994(2000) Optics and optical instruments — Veiling glare of image - forming systems — Definitions and methods of measurement
  • BS EN 60747-5-1:2001(2003) Discretesemiconductor devices and integrated circuits — Part 5 - 1 : Optoelectronic devices — General
  • BS EN 60747-5-3:2001(2003) Discretesemiconductor devices and integrated circuits — Part 5 - 3 : Optoelectronic devices — Measuring methods
  • GJB 6916-2009 Design and finalization test procedures for individual soldier imaging mine detectors
  • BS EN 60747-5-2:2001(2003) Discretesemiconductor devices and integrated circuits — Part 5 - 2 : Optoelectronic devices — Essential ratings and characteristics

German Institute for Standardization, imaging collector

  • DIN ISO 9358:2021-08 Optics and optical instruments - Veiling glare of image-forming systems - Definitions and methods of measurement (ISO 9358:1994)
  • DIN EN 17501:2020 Non-destructive testing - Thermographic testing - Active thermography with laser excitation; German and English version prEN 17501:2020
  • DIN EN 17501:2022-08 Non-destructive testing - Thermographic testing - Active thermography with laser excitation; German version EN 17501:2022
  • DIN 54185:2021-06 Non-destructive testing - Thermographic testing - Lock-In thermography using optical excitation
  • DIN ISO 9358:2021 Optics and optical instruments - Veiling glare of image-forming systems - Definitions and methods of measurement (ISO 9358:1994)
  • DIN ISO 9358:2020 Optics and optical instruments - Veiling glare of image forming systems - Definitions and methods of measurement (ISO 9358:1994); Text in German and English
  • DIN 54184:2017-10 Non-destructive testing - Pulse thermography using optical excitation
  • DIN EN ISO 24157:2020-06 Ophthalmic optics and instruments - Reporting aberrations of the human eye (ISO 24157:2008 + Amd 1:2020); German version EN ISO 24157:2008 + A1:2020
  • DIN 58002:2001 Integrated optics - Near-field-measurement for single-mode optical chip components
  • DIN EN ISO 11380:1996-08 Optics and optical instruments - Ophthalmic optics - Formers (ISO 11380:1994); German version EN ISO 11380:1996
  • DIN EN ISO 14881:2005 Integrated optics - Interfaces - Parameters relevant to coupling properties (ISO 14881:2001); German version EN ISO 14881:2005
  • DIN EN 62149-3:2004 Fibre optic active components and devices - Performance standards - Part 3: 2,5 Gbit/s modulator-integrated laser diode transmitters (IEC 62149-3:2004); German version EN 62149-3:2004
  • DIN 19277:2015-12 Condition monitoring and diagnostics of machines - Thermography - General procedures (ISO 18434-1:2008, modified)
  • DIN EN ISO 11807-2:2005 Integrated optics - Vocabulary - Part 2: Terms used in classification (ISO 11807-2:2001); German version EN ISO 11807-2:2005
  • DIN EN ISO 11146-1:2021-11 Lasers and laser-related equipment - Test methods for laser beam widths, divergence angles and beam propagation ratios - Part 1: Stigmatic and simple astigmatic beams (ISO 11146-1:2021); German version EN ISO 11146-1:2021
  • DIN EN 14603:2005 Information technology - Alphanumeric glyph image set for optical character recognition OCR-B - Shapes and dimensions of the printed image; English version EN 14603:2004
  • DIN EN ISO 11807-1:2022-05 Integrated optics - Vocabulary - Part 1: Optical waveguide basic terms and symbols (ISO 11807-1:2021); German version EN ISO 11807-1:2021
  • DIN EN 61964:2000 Integrated circuits - Memory devices pin configurations (IEC 61964:1999); German version EN 61964:1999

ES-UNE, imaging collector

  • UNE-EN 17501:2022 Non-destructive testing - Thermographic testing - Active thermography with laser excitation
  • IEEE 3333.1.4-2022 IEEE Recommended Practice for the Quality Assessment of Light Field Imaging
  • UNE-EN 60747-5-3:2001 Discrete semiconductor devices and integrated circuits -- Part 5-3: Optoelectronic devices - Measuring methods. (Endorsed by AENOR in October of 2001.)
  • UNE-EN 60747-5-3:2001/A1:2002 Discrete semiconductor devices and integrated circuits -- Part 5-3: Optoelectronic devices - Measuring methods (Endorsed by AENOR in November of 2002.)
  • UNE-EN 190110:1994 BDS: DIGITAL MICROPROCESSOR INTEGRATED CIRCUITS. (Endorsed by AENOR in November of 1996.)
  • UNE-EN ISO 11146-1:2021 Lasers and laser-related equipment - Test methods for laser beam widths, divergence angles and beam propagation ratios - Part 1: Stigmatic and simple astigmatic beams (ISO 11146-1:2021) (Endorsed by Asociación Española de Normalización in September ...
  • UNE-EN ISO 11807-1:2021 Integrated optics - Vocabulary - Part 1: Optical waveguide basic terms and symbols (ISO 11807-1:2021) (Endorsed by Asociación Española de Normalización in December of 2021.)
  • UNE-EN 60747-5-2:2001 Discrete semiconductor devices and integrated circuits -- Part 5-2: Optoelectronic devices - Essential ratings and characteristics. (Endorsed by AENOR in October of 2001.)
  • UNE-EN 60747-5-2:2001/A1:2002 Discrete semiconductor devices and integrated circuits -- Part 5-2: Optoelectronic devices - Essential ratings and characteristics (Endorsed by AENOR in November of 2002.)

Association Francaise de Normalisation, imaging collector

  • NF EN 17501:2022 Essais non destructifs - Analyse thermographique - Thermographie active avec excitation laser
  • NF S10-043*NF ISO 9358:1998 Optics and optical instruments. Veiling glare of image-forming systems. Definitions and methods of measurement.
  • NF C96-005:1994 Discrete devices and integrated circuits. Part 5 : optoelectronic devices.
  • NF ISO 9358:1998 Optique et instruments d'optique - Lumière parasite diffuse des systèmes d'imagerie - Définitions et méthodes de mesure.
  • NF S10-045:1999 Optics and optical instruments - General optical test methods - Measurement of relative irradiance in the image field.
  • NF S10-051*NF ISO 15795:2002 Optics and optical instruments - Quality evaluation of optical systems - Assessing the image quality degradation due to chromatic aberrations
  • NF C96-005-1/A1*NF EN 60747-5-1/A1:2002 Discrete semiconductor devices and integrated circuits - Part 5-1 : optoelectronic devices - General
  • NF C96-005-1*NF EN 60747-5-1:2001 Discrete semiconductor devices and integrated circuits - Part 5-1 : optoelectronic devices - General
  • NF EN 60747-5-1/A1:2002 Dispositifs discrets à semiconducteurs et circuits intégrés - Partie 5-1 : dispositifs optoélectroniques - Généralités
  • NF EN 60747-5-1/A2:2002 Dispositifs discrets à semiconducteurs et circuits intégrés - Partie 5-1 : dispositifs optoélectroniques - Généralités
  • NF EN 60747-5-1:2001 Dispositifs discrets à semiconducteurs et circuits intégrés - Partie 5-1 : dispositifs optoélectroniques - Généralités
  • NF C96-042:1989 Semiconductor Devices Integrated circuits Part 2:Digital integrated circuits
  • NF C96-005-1/A2*NF EN 60747-5-1/A2:2002 Discrete semiconductor devices and integrated circuits - Partie 5-1 : optoelectronic devices - General
  • NF EN 50201:2002 Interfaces pour décodeur DVB intégré
  • NF C96-005-3*NF EN 60747-5-3:2001 Discrete semiconductor devices and integrated circuits - Part 5-3 : optoelectronic devices - Measuring methods
  • NF C96-005-3/A1*NF EN 60747-5-3/A1:2002 Discrete semiconductor devices and integrated circuits - Partie 5-3 : optoelectronic devices - Measuring methods
  • NF EN 60747-5-3:2001 Dispositifs discrets à semiconducteurs et circuits intégrés - Partie 5-3 : dispositifs optoélectroniques - Méthodes de mesure
  • NF EN 60747-5-3/A1:2002 Dispositifs discrets à semiconducteurs et circuits intégrés - Partie 5-3 : dispositifs optoélectroniques - Méthodes de mesure
  • NF ISO 18251-2:2023 Essais non destructifs - Thermographie infrarouge - Partie 2 : Méthode d'essai relative aux performances intégrées du système et de l'appareillage
  • NF EN 1837:2020 Sécurité des machines - Eclairage intégré aux machines
  • NF EN IEC 62878-1:2019 Techniques d'assemblage avec appareil(s) integré(s) - Partie 1 : spécification générique pour substrats avec appareil(s) intégré(s)
  • NF EN 14603:2005 Technologies de l'information - Jeu d'images de glyphe alphanumérique pour la reconnaissance optique de caractères ROC-B - Formes et cotes de l'image imprimée
  • NF ISO 18434-2:2019 Surveillance et diagnostic de l'état des systèmes de machines - Thermographie - Partie 2 : interprétation d'image et diagnostic
  • NF C93-884-3:2004 Fibre optic active components and devices - Performance standards - Part 3 : 2,5 Gbit/s modulator-integrated laser diode transmitters.
  • NF EN 61964:2000 Circuits intégrés - Configuration de broches de mémoires
  • NF EN 60747-5-2:2001 Dispositifs discrets à semiconducteurs et circuits intégrés - Partie 5-2 : dispositifs optoélectroniques - Valeurs limites et caractéristiques essentielles
  • NF EN 60747-5-2/A1:2003 Dispositifs discrets à semiconducteurs et circuits intégrés - Partie 5-2 : dispositifs optoélectroniques - Valeurs limites et caractéristiques essentielles
  • NF S10-048*NF ISO 19962:2019 Optics and photonics - Spectroscopic measurement methods for integrated scattering by plane parallel optical elements
  • NF S10-131:2005 Integrated optics - Interfaces - Parameters relevant to coupling properties.
  • NF S10-130-2:2005 Integrated optics - Vocabulary - Part 2 : terms used in classification.
  • NF EN ISO 14881:2021 Optique intégrée - Interfaces - Paramètres caractérisant les propriétés de couplage
  • NF Z62-013*NF EN 14603:2005 Information technology - Alphanumeric glyph image set for optical character recognition OCR-B - Shapes and dimensions of the printed image.
  • NF S10-130-1*NF EN ISO 11807-1:2021 Integrated optics - Vocabulary - Part 1 : optical waveguide basic terms and symbols
  • NF C96-005-2/A1*NF EN 60747-5-2/A1:2003 Discrete semiconductor devices and integrated circuits - Partie 5-2 : optoelectronic devices - Essential ratings and characteristics
  • NF C96-005-2*NF EN 60747-5-2:2001 Discrete semiconductor devices and integrated circuits - Part 5-2 : optoelectronic devices - Essential ratings and characteristics
  • NF C96-012*NF EN 61964:2000 Integrated circuits - Memory devices pin configurations
  • NF A82-043:1996 Electric resistance welding. Integrated transformers for welding guns.

Military Standard of the People's Republic of China-General Armament Department, imaging collector

  • GJB 9631-2019 Specifications for optical imaging sensors for manned spacecraft rendezvous and docking
  • GJB 4026A-2014 General specification for LiNbO<下标3> integrated optics devices
  • GJB 9888-2020 Lithium niobate integrated optical device test method
  • GJB 4026-2000 General specification for lithium niobate integrated optical devices
  • GJB 9726-2020 Specifications for spaceborne hyperspectral imagers
  • GJB 5546-2006 General specification for airborne optics imaging reconnaissance
  • GJB 7951-2012 Measuring methods for charge coupled imaging devices
  • GJB 5968-2007 General specincation for imaging charge coupled devices
  • GJB 5968A-2021 General specifications for charge-coupled imaging devices
  • GJB 10036-2021 Cloud and smoke adaptability assessment method for laser imaging system
  • GJB 10245-2022 Specifications for Staring Infrared Imagers for Airborne Missiles
  • GJB 4799-1997*GJBz 20432-1997 Inspection and acceptance rules for military infrared thermal imaging instruments
  • GJB/Z 42.4-1993 Military Microcircuit Series Spectrum Semiconductor Integrated Circuit Interfacer Integrated Circuit
  • GJB 2438/25-2021 Detailed specifications for hybrid integrated circuit WHZD6500M-11 microwave hybrid integrated voltage controlled oscillator
  • GJB 2438/23-2021 Hybrid integrated circuit WHZD950M1050M-10 type microwave hybrid integrated voltage controlled oscillator detailed specifications
  • GJB 2438/24-2021 Hybrid integrated circuit WHZD800M1100M-10 type microwave hybrid integrated voltage controlled oscillator detailed specifications
  • GJB 2438/28-2021 Hybrid integrated circuit WHZD2200M2600M-10 type microwave hybrid integrated voltage controlled oscillator detailed specifications
  • GJB 2438/21-2021 Hybrid integrated circuit WHZD8240M8600M-10 type microwave hybrid integrated voltage controlled oscillator detailed specifications

Society of Automotive Engineers (SAE), imaging collector

  • SAE ARP4967C-2023 Night Vision Imaging Systems (NVIS) Integrally Illuminated Information Panels
  • SAE J2661-2011 Optical Imaging Evaluation of Impact Damage Resistance Testing on Exterior Finishes
  • SAE J2661-2023 Optical Imaging Evaluation of Impact Damage Resistance Testing on Exterior Finishes

GB-REG, imaging collector

British Standards Institution (BSI), imaging collector

  • BS EN 17501:2022 Non-destructive testing. Thermographic testing. Active thermography with laser excitation
  • 20/30410182 DC BS EN 17501. Non-destructive testing. Thermographic testing. Active thermography with laser excitation
  • BS ISO 9358:1994 Optics and optical instruments. Veiling glare of image forming systems. Definitions and methods of measurement
  • BS ISO 13653:1997 Optics and optical instruments - General optical test methods - Measurement of relative irradiance in the image field
  • BS IEC 60747-5-1:1998 Discrete semiconductor devices and integrated circuits. Optoelectronic devices. General
  • BS EN 60747-5-1:1998 Discrete semiconductor devices and integrated circuits. Optoelectronic devices. General
  • BS EN 60747-5-1:2001 Discrete semiconductor devices and integrated circuits - Optoelectronic devices - General
  • BS IEC 60747-5-3:1998 Discrete semiconductor devices and integrated circuits. Optoelectronic devices. Measuring methods
  • BS EN 60747-5-3:1998 Discrete semiconductor devices and integrated circuits. Optoelectronic devices. Measuring methods
  • BS EN 60747-5-3:2001 Discrete semiconductor devices and integrated circuits - Optoelectronic devices - Measuring methods
  • BS IEC 60748-4:1997 Semiconductor devices. Integrated circuits. Interface integrated circuits
  • BS IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Digital integrated circuits
  • BS IEC 60748-2:1998 Semiconductor devices. Integrated circuits. Digital integrated circuits
  • BS ISO 18925:2013 Imaging materials. Optical disc media. Storage practice
  • BS IEC 60748-2-20:2008 Semiconductor devices - Integrated circuits - Digital integrated circuits - Family specification - Low voltage integrated circuits
  • PD IEC TS 63202-2:2021 Photovoltaic cells. Electroluminescence imaging of crystalline silicon solar cells
  • BS IEC 60748-2-11:1999 Semiconductor devices - Integrated circuits - Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory - Blank detail specification for single supply integrated
  • BS ISO 15529:2010 Optics and photonics. Optical transfer function. Principles of measurement of modulation transfer function (MTF) of sampled imaging systems
  • BS EN 60747-16-1:2002 Discrete semiconductor devices and integrated circuits - Microwave integrated circuits - Amplifiers
  • BS EN ISO 11807-2:2005 Integrated optics - Vocabulary - Terms used in classification
  • BS EN ISO 11807-2:2021 Integrated optics. Vocabulary. Terms used in classification
  • BS 6493-2.3:1987 Semiconductor devices. Integrated circuits. Recommendations for analogue integrated circuits
  • BS ISO 18938:2008 Imaging materials - Optical discs - Care and handling for extended storage
  • BS ISO 18938:2014 Imaging materials. Optical discs. Care and handling for extended storage
  • BS EN 60747-5-2:1998 Discrete semiconductor devices and integrated circuits. Optoelectronic devices. Essential ratings and characteristics
  • BS EN 60747-5-2:2001 Discrete semiconductor devices and integrated circuits - Optoelectronic devices - Essential ratings and characteristics
  • BS IEC 62679-3-3:2016 Electronic paper displays - Optical measuring methods for displays with integrated lighting units
  • BS EN 62149-3:2004 Fibre optic active components and devices - Performance standards - 2,5 Gbit/s modulator-integrated laser diode transmitters
  • BS 7012-1:1998 Light microscopes - Specification for the magnifying power of microscope imaging components
  • BS ISO 18943:2014 Imaging materials. Magnetic hard drives used for image storage. Care and handling
  • BS ISO 18434-2:2019 Condition monitoring and diagnostics of machine systems. Thermography - Image interpretation and diagnostics
  • BS EN ISO 11807-1:2005 Integrated optics - Vocabulary - Basic terms and symbols
  • BS IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Semicustom integrated circuits
  • BS IEC 60748-4-3:2006 Semiconductor devices. Integrated circuits - Interface integrated circuits. Dynamic criteria for analogue-digital converters (ADC)
  • BS EN 62148-11:2004 Fibre optic active components and devices - Package and interface standards - 14-pin modulator-integrated laser diode transmitters
  • BS EN ISO 24157:2008+A1:2020 Ophthalmic optics and instruments. Reporting aberrations of the human eye
  • BS EN IEC 62149-3:2020 Fibre optic active components and devices. Performance standards. Modulator-integrated laser diode transmitters for 40-Gbit/s fibre optic transmission systems
  • BS IEC 60748-4-3:2007 Semiconductor devices - Integrated circuits - Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
  • BS IEC 60748-1:2002 Semiconductor devices - Integrated circuits - General
  • BS 6493-2.1:1985 Semiconductor devices - Integrated circuits - General
  • BS EN 60747-16-1:2002+A1:2007 Semiconductor devices — Part 16-1: Microwave integrated circuits — Amplifiers
  • BS EN 62228-2:2017 Integrated circuits. EMC evaluation of transceivers. LIN transceivers
  • BS EN IEC 60747-16-6:2019 Semiconductor devices. Microwave integrated circuits. Frequency multipliers
  • BS EN 60747-16-1:2002+A2:2017 Semiconductor devices - Microwave integrated circuits. Amplifiers
  • BS EN 60747-16-3:2002+A2:2017 Semiconductor devices - Microwave integrated circuits. Frequency converters
  • BS EN 60747-16-5:2013+A1:2020 Semiconductor devices - Microwave integrated circuits. Oscillators
  • BS EN 61223-3-2:2008 Evaluation and routine testing in medical imaging departments -Part 3-2: Acceptance tests - Imaging performance of mammographic X-ray equipment
  • BS ISO 18929:2012 Imaging materials. Wet-processed silver-gelatin type black-and-white photographic reflection prints. Specifications for dark storage
  • BS EN ISO 11146-1:2021 Tracked Changes. Lasers and laser-related equipment. Test methods for laser beam widths, divergence angles and beam propagation ratios. Stigmatic and simple astigmatic beams
  • BS EN 61291-6-1:2009 Optical amplifiers. Interfaces. Command set
  • BS EN 61291-6-1:2008 Optical amplifiers - Interfaces - Command set
  • BS EN ISO 14881:2005 Integrated optics - Interfaces - Parameters relevant to coupling properties
  • PD IEC/TR 63072-1:2017 Photonic integrated circuits. Introduction and roadmap for standardization
  • BS ISO 18937:2014 Imaging materials. Photographic reflection prints. Methods for measuring indoor light stability
  • BS PD IEC TS 63140:2021 Photovoltaic (PV) modules. Partial shade endurance testing for monolithically integrated products
  • BS EN ISO 11807-1:2021 Tracked Changes. Integrated optics. Vocabulary. Optical waveguide basic terms and symbols
  • BS IEC 60748-2-12:2001 Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification for programmable logic devices (PLDs)
  • BS EN 62149-3:2014 Fibre optic active components and devices. Performance standards. Modulator-integrated laser diode transmitters for 2,5-Gbit/s to 40-Gbit/s fibre optic transmission systems
  • BS EN IEC 62228-6:2022 Integrated circuit. EMC evaluation of transceivers - PSI5 transceivers
  • BS EN IEC 62228-3:2019 Integrated circuits. EMC evaluation of transceivers - CAN transceivers

Professional Standard - Electron, imaging collector

  • SJ/T 11404-2009 General specifications for LiNbOintegrated optical devices
  • SJ 20869-2003 Measuring methods for LiNbO3 integrated optical guided-wave modulators
  • SJ 20868-2003 Measuring methods for charge coupled imaging device

Professional Standard - Public Safety Standards, imaging collector

  • GA/T 1195-2014 Spectral imaging methods by tunable filter in forensic science
  • GA/T 1775-2021 Forensic Science Thermoluminescence Imaging Technology Specifications for Displaying Fingerprints
  • GA/T 1202-2022 General technical requirements for traffic technology monitoring imaging supplementary light device
  • GA/T 1202-2014 General technical requirements for traffic technology monitoring imaging supplementary light device

KR-KS, imaging collector

  • KS B ISO 9358-2023 Optics and optical instruments — Veiling glare of image forming systems — Definitions and methods of measurement
  • KS A ISO 18925-2016 Imaging materials-Optical disc media-Storage practices
  • KS C IEC 60747-5-1-2020 Discrete semiconductor devices and integrated circuits —Part 5-1: Optoelectronic devices — General
  • KS B ISO 9345-2-2016 Optics and optical instruments-Microscopes:Imaging distances related to mechanical reference planes-Part 2:Infinity-corrected optical systems
  • KS C IEC 60748-5-2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
  • KS C IEC 60748-5-2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
  • KS C IEC 60747-5-3-2020 Discrete semiconductor devices and integrated circuits —Part 5-3: Optoelectronic devices — Measuring methods
  • KS C IEC 60748-2-20-2021 Semiconductor devices — Integrated circuits — Part 2-20: Digital integrated circuits — Family specification — Low voltage integrated circuits
  • KS B ISO 9345-1-2016 Optics and optical instruments Microscopes - Imaging distances related to mechanical reference planes - Part 1 Tube length 160 mm
  • KS C IEC 60748-20-2021 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
  • KS A ISO 12234-1-2016 Electronic still-picture imaging-Removable memory-Part 1:Basic removable-memory model
  • KS C IEC 60748-2-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
  • KS C IEC 60748-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
  • KS C IEC 60747-5-2-2020 Discrete semiconductor devices and integrated circuits —Part 5-2: Optoelectronic devices — Essential ratings and characteristics

Group Standards of the People's Republic of China, imaging collector

  • T/CIE 079-2020 Evaluation of Industrial High Reliability Integrated Circuits Part 14: Image Sensors
  • T/ZZB 1335-2019 Optical low pass filter for high-definition imaging
  • T/SCGS 313003-2023 Standards for image quality evaluation of near-infrared second-zone fluorescence imaging technology
  • T/CAIA YQ007-2021 General test method for photoelectric performance of electron multiplying charge coupled imaging device
  • T/YNBX 098-2023 Determination of rice seed vigor - Multispectral imaging method
  • T/NJAF 001-2020 Infrared thermal imaging method for rapid screening of body temperature in crowded areas
  • T/CFPA 027-2023 Infrared Thermography Heat Fire Detector
  • T/CADBM 61-2022 Integrated electrical controller for ceiling
  • T/ICMTIA 5.1-2020 ArF Dry photo resist for Integrated circuits
  • T/CPIA 0009-2019 Electroluminescence Imaging Method for Defect Detection of Crystalline Silicon Photovoltaic Modules
  • T/ICMTIA 5.3-2020 Lithography ArF Photo Resist of measurement for Intergraded circuits
  • T/ZZB 2866-2022 Variable frequency controller for integrated stove
  • T/ICMTIA 5.2-2020 ArF immersion photo resist for integrated circuits
  • T/QGCML 1273-2023 Image intensifier fluorescent screen vacuum test bench
  • T/CESA 1151-2021 Intelligent photovoltaic(PV) cloud platform—Scheme of system integration
  • T/SHMHZQ 018-2022 Technical specification for diaphragm coupling integrated explosion-proof optical fiber torque detection system
  • T/SZCX 003-2019 Gas-burning appliance for integration cooking appliances
  • T/CNHA 1061-2023 Quality Technical Requirements for Kitchen Appliances for Centralized Purchase and Similar Purposes integration (electromagnetism) cooking appliances
  • T/CSBME 047-2022 Specification for acquisition and post-processing of arterial spin labeling magnetic resonance cerebral perfusion imaging
  • T/AHEPI 0002-2023 Technical guide for hyperspectral targeted imaging remote sensing monitoring of trace gases
  • T/CIRA 37-2022
  • T/SZCX 001-2019 Electronic controller of integration cooking appliances
  • T/CASME 403-2023 Vco for hybrid integrated circuits

U.S. Air Force, imaging collector

US-RTCA, imaging collector

  • RTCA DO-275-2001 Minimum Operational Performance Standards for Integrated Night Vision Imaging System Equipment

国家市场监督管理总局、中国国家标准化管理委员会, imaging collector

  • GB/T 38935-2020 On-orbit radiometric characteristics assessment for optical imaging remote sensor—VIS-SWIR
  • GB/T 36301-2018 Pre-processing product levels for spaceborne hyperspectral imaging data
  • GB/T 40139-2021 Measuring method for surface areas of materials—Three dimensional area measurement base on hyperspectral imaging
  • GB/T 36614-2018 Integrated circuits—Memory devices pin configuration

Danish Standards Foundation, imaging collector

  • DS/ISO 18925:2013 Imaging materials - Optical disc media - Storage practices
  • DS/ISO 18918:2001 Imaging materials - Processed photographic plates - Storage practices
  • DS/EN 60747-5-1/A2:2002 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General
  • DS/EN 60747-5-1/A1:2002 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General
  • DS/EN 60747-5-1:2002 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General
  • DS/IEC 748-3+Amd.1:1993 Semiconductor devices - Integrated circuits - Part 3: analogue integrated circuits
  • DS/IEC 748-4+Amd.1:1993 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
  • DS/EN ISO 11380:1997 Optics and optical instruments - Ophthalmic optics - Formers
  • DS/EN 60747-5-3/A1:2002 Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
  • DS/EN 60747-5-3:2002 Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
  • DS/IEC 748-20:1990 Semiconductor devices. Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
  • DS/ISO 12234-1:2012 Electronic still-picture imaging - Removable memory - Part 1: Basic removable-memory model
  • DS/EN 62149-3:2004 Fibre optic active components and devices - Performance standards - Part 3: 2,5 Gbit/s modulator-integrated laser diode transmitters
  • DS/EN ISO 24157:2008 Ophthalmic optics and instruments - Reporting aberrations of the human eye
  • DS/EN IEC 62149-3:2021 Fibre optic active components and devices – Performance standards – Part 3: Modulator-integrated laser diode transmitters for 40-Gbit/s fibre optic transmission systems
  • DS/EN 14603:2006 Information technology - Alphanumeric glyph image set for optical character recognition OCR-B - Shapes and dimensions of the printed image
  • DS/ISO 11807-1:2021 Integrated optics – Vocabulary – Part 1: Optical waveguide basic terms and symbols
  • DS/IEC 748-2-6:1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Section six: Blank detail specification for microprocessor integrated circuits
  • DS/EN 60747-5-2/A1:2002 Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics
  • DS/EN 60747-5-2:2002 Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics

ANSI - American National Standards Institute, imaging collector

  • IT9.25-1998 Imaging Materials - Optical Disc Media - Storage (IS&T)
  • IT9.18-1996 Imaging Materials - Processed Photographic Plates - Storage Practices (IS&T)

RU-GOST R, imaging collector

  • GOST R IEC 61223-3-1-2001 Evaluation and routine testing in medical imaging departments. Part 3-1. Imaging performance of X-ray equipment for radiographic and radioscopic systems. Acceptance tests
  • GOST 29283-1992 Semiconductor devices. Discrete devices and integrated circuits. Part 5. Optoelectronic devices
  • GOST R ISO 4090-2006 Photography. Medical radiographic cassettes/screens/films and hard-copy imaging films. Dimensions and technical requirements
  • GOST R IEC 61675-2-2002 Radionuclide imaging devices. Characteristics and test conditions. Part 2. Single photon emission computed tomographs
  • GOST R IEC 61675-2-2006 Radionuclide imaging devices. Characteristics and test conditions. Part 2. Single photon emission computed tomographs
  • GOST R IEC 61223-2-10-2001 Evaluation and routine testing in medical imaging departments. Part 2-10. Constancy tests. X-ray equipment for mammography
  • GOST 29108-1991 Semiconductor devices. Integrated circuits. Part 3. Analog integrated circuits
  • GOST 29107-1991 Semiconductor devices. Integrated circuits. Part 2. Digital integrated circuits
  • GOST 29109-1991 Semiconductor devices. Integrated circuits. Part 4. Interface integrated circuits
  • GOST R IEC 60627-2005 Diagnostic X-ray imaging equipment. Characteristics of general purpose and mammographic anti-scatter grids
  • GOST R IEC/TO 61948-2-2008 Nuclear medicine instrumentation. Routine tests. Part 2. Scintillation cameras and single photon emission computed tomography imaging
  • GOST 24613.0-1981 Optoelectronic integrated microcircuits and opto-couples. General requirements at measuring of electrical parameters
  • GOST 24613.9-1983 Optoelectronic integrated microcircuits and optocouplers. Method for measuring switching times
  • GOST 24613.18-1977 Optoelectronic integrated microcircuits and optocouplers. Methods for measuring isolation resistance
  • GOST 21815.14-1986 Image intensifier and image converter tubes. Method of measuring the image drift
  • GOST 24613.1-1981 Optoelectronic integrated microcircuits and optocouplers. Method for measuring of input-to-output capacitance
  • GOST 24613.2-1981 Optoelectronic integrated microcircuits and opto-couples. Method for measuring leatage current
  • GOST 24613.3-1981 Optoelectronic integrated microcircuits and opto-couples. Method for measuring input voltage
  • GOST 24613.6-1981 Optoelectronic integrated microcircuits and optocouplers. Method for measuring of isolation voltage
  • GOST 24613.17-1977 Optoelectronic integrated microcircuits. Method for measuring output differential resistance of analogue signal commutators
  • GOST 24613.19-1977 Optoelectronic integrated microcircuits and optocouplers. Method for measuring current transfer ratio
  • GOST R ISO 18434-2-2021 Condition monitoring and diagnostics of machine systems. Thermography. Part 2. Image interpretation and diagnostics

Professional Standard - Post and Telecommunication, imaging collector

  • YD/T 2000.1-2014 Integrated optical path devices based on planar lightwave circuit.Part 1: Optical power splitter based on PLC technology
  • YD/T 2000.1-2009 Integrated optical path devices based on planar lightwave circuit.Part 1:Optical power splitter based on PLC technology
  • YD/T 2000.2-2009 Integrated optical path devices based on planar lightwave circuit.Part 2:DWDM filter based on AWG technology
  • YD/T 2799.5-2023
  • YD/T 2904.1-2015 Integrated tunable laser assembly.Part 1: Butterfly package assembly

North Atlantic Treaty Organization Standards Agency, imaging collector

IET - Institution of Engineering and Technology, imaging collector

Professional Standard - Machinery, imaging collector

  • JB/T 5453-2011 Non-destructive testing instruments.Industrial X-ray image intensifer imaging system

American Society for Testing and Materials (ASTM), imaging collector

  • ASTM D5767-95(2004) Standard Test Methods for Instrumental Measurement of Distinctness-of-Image Gloss of Coating Surfaces
  • ASTM F1443-93(2003) Standard Practice for Using 0.008-in. (0.203-mm) Aperture Reflectometers as Test Instruments for Measuring Visual Image Quality of Business Copy Images
  • ASTM E1260-03(2020) Standard Test Method for Determining Liquid Drop Size Characteristics in a Spray Using Optical Nonimaging Light-Scattering Instruments
  • ASTM E1260-03(2009) Standard Test Method for Determining Liquid Drop Size Characteristics in a Spray Using Optical Nonimaging Light-Scattering Instruments
  • ASTM F1443-93(2009) Standard Practice for Using 0.008-in. (0.203-mm) Aperture Reflectometers as Test Instruments for Measuring Visual Image Quality of Business Copy Images

ESDU - Engineering Sciences Data Unit, imaging collector

  • SPA-M10-2-2010 Apr.09: Probing into petroleum heath-exchanger deposits with spectroscopic imaging

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, imaging collector

  • GB/T 35437-2017 General specification for spaceborne opto-electronic tracking and imaging system
  • GB/T 33806-2017 Technical requirement of area fluorescent imaging microarray scanner

International Electrotechnical Commission (IEC), imaging collector

  • IEC 60747-5:1992 Semiconductor devices; discrete devices and integrated circuits; part 5: optoelectronic devices
  • IEC 60858:1986 Determination of the image distortion of electro-optical X-ray image intensifiers
  • IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
  • IEC 60748-3:1986 Semiconductor devices. Integrated circuits.. Part 3 : Analogue integrated circuits
  • IEC 60748-4:1987 Semiconductor devices - Intergrated circuits.. Part 4: Interface integrated circuits.
  • IEC 60747-5-1:1997/AMD2:2002 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices; General; Amendment 2
  • IEC 60747-5-1:1997+AMD1:2001+AMD2:2002 CSV Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General
  • IEC 60747-5-1:2002 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices; General
  • IEC 60748-2-20:2000 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits; Family specifications: Low voltage integrated circuits
  • IEC 60748-20:1988 Semiconductor devices - Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
  • IEC 60748-2-11:1999 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
  • IEC 60748-2-6:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section six: blank detail specification for microprocessor integrated circuits
  • IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
  • IEC 60748-2-20:2008 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
  • IEC 62149-3:2020 RLV Fibre optic active components and devices - Performance standards - Part 3: Modulator-integrated laser diode transmitters for 40-Gbit/s fibre optic transmission systems
  • IEC TS 63202-2:2021 Photovoltaic cells - Part 2: Electroluminescence imaging of crystalline silicon solar cells
  • IEC 60747-5-3:1997/AMD1:2002 Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
  • IEC 60747-5-3:1997+AMD1:2002 CSV Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
  • IEC 62149-3:2020 Fibre optic active components and devices - Performance standards - Part 3: Modulator-integrated laser diode transmitters for 40-Gbit/s fibre optic transmission systems
  • IEC 60748-3-1:1991 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; section 1: blank detail specification for monolithic integrated operational amplifiers
  • IEC 60748-2-10:1994 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits; section 10: Blank detail specification for integrated circuit dynamic read/write memories
  • IEC 60748-3:1986/AMD2:1994 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 2
  • IEC 60748-3:1986/AMD1:1991 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 1
  • IEC 60748-3/AMD2/COR1:1996 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 2
  • IEC 62149-3:2004 Fibre optic active components and devices - Performance standards - Part 3: 2,5 Gbit/s modulator-integrated laser diode transmitters
  • IEC 60747-5-1:1997/AMD1:2001 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices; General; Amendment 1
  • IEC 62679-3-3:2016 Electronic paper displays - Part 3-3: Optical measuring methods for displays with integrated lighting units
  • IEC 60748-20:1988/AMD1:1995 Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
  • IEC 60748-2/AMD1:1991 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; amendment 1
  • IEC 60748-4/AMD1:1991 Semiconductor devices; intergrated circuits; part 4: interface integrated circuits; amendment 1
  • IEC 62148-11:2003 Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin modulator-integrated laser diode transmitters

Association of German Mechanical Engineers, imaging collector

Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence, imaging collector

  • GJB 5984-2007 Specification for generation Ⅲ image intensiner assembly

Professional Standard - Military and Civilian Products, imaging collector

European Committee for Electrotechnical Standardization(CENELEC), imaging collector

  • HD 515 S1-1989 Determination of the Image Distortion of Electro-Optical X-Ray Image Intensifiers
  • EN 62148-11:2009 Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin active device modules
  • EN 61964:1999 Integrated Circuits - Memory Devices Pin Configurations

IN-BIS, imaging collector

Institute of Electrical and Electronics Engineers (IEEE), imaging collector

Professional Standard - Medicine, imaging collector

  • YY/T 1895-2023 Intravascular optical coherence tomography imaging device
  • YY/T 1418-2016 Ophthalmic optics and instruments.Reporting aberrations of the human eye

Standard Association of Australia (SAA), imaging collector

  • AS/NZS 4184.3.4:2002 Evaluation and routine testing in medical imaging departments - Acceptance tests - Imaging performance of dental X-ray equipment
  • AS/NZS 4184.3.3:1998 Evaluation and routine testing in medical imaging departments - Acceptance tests - Imaging performance of X-ray equipment for digital subtraction angiography (DSA)
  • IEC 62149-3:2023 Fibre optic active components and devices — Performance standards — Part 3: Modulator-integrated laser diode transmitters for 40-Gbit/s fibre optic transmission systems

Guangdong Provincial Standard of the People's Republic of China, imaging collector

Japanese Industrial Standards Committee (JISC), imaging collector

  • JIS Z 4721:2000 Medical X-ray image intensifiers
  • JIS R 3421:1991 Textile finished glass fabrics for bag filter
  • JIS X 6319-1:2005 Specification of implementation for integrated circuit(s) cards -- Part 1: Integrated circuit(s) cards with contacts
  • JIS X 6319-1:2010 Specification of implementation for integrated circuit cards -- Part 1: Integrated circuit cards with contacts
  • JIS C 5953-3:2019 Fiber optic active components and devices -- Performance standards -- Part 3: Modulator-integrated laser diode transmitters for 40 Gbit/s fiber optic transmission systems

Taiwan Provincial Standard of the People's Republic of China, imaging collector

  • CNS 13197-1993 Determination of the Image Distortion of Electro - Optical X - Ray Image Intensifiers
  • CNS 12365-1988 Alphanumeric Character Sets for Optical Recognition - Part II : Character Set OCR-B-Shapes and Dimensions of the Printed Image

Electronic Components, Assemblies and Materials Association, imaging collector

Shandong Provincial Standard of the People's Republic of China, imaging collector

  • DB37/T 2888-2016 Moderate Resolution Imaging Spectrometer (MODIS) Remote Sensing Image Wheat Growth Monitoring Technical Regulations

Professional Standard - Energy, imaging collector

  • NB/T 11081-2023 Photovoltaic Module Infrared Thermal Imaging (TIS) Inspection Technical Specifications
  • NB/T 10433-2020 Specifications for the collection and archiving of audio and video files for photovoltaic power generation construction projects

RO-ASRO, imaging collector

  • SR CEI 748-3+A1-1991 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

PL-PKN, imaging collector

  • PN T01303-03-1991 Semicondutor devices. Integrated circuits. Analogue integrated circuits. Measuring methods
  • PN T01303-03-A1-1991 Semiconductor devices Integrated circuits Analogue integrated circuits Measuring methods Amendment 1

ECIA - Electronic Components Industry Association, imaging collector

  • CB16-1999 Integrated Passive Device (IPD) Definitions

CENELEC - European Committee for Electrotechnical Standardization, imaging collector

  • EN 62149-3:2004 Fibre optic active components and devices Performance standards Part 3: 2@5 Gbit/s modulator-integrated laser diode transmitters

American National Standards Institute (ANSI), imaging collector

  • ANSI/ASTM E1260:1995 Test Method for Determining Liquid Drop Size Characteristics in a Spray Using Optical Non-Imaging Light-Scattering Instruments
  • ANSI/INCITS/ISO 1073-1:1976 Alphanumeric Character Sets for Optical Recognition - Part 1: Character Set OCR-A - Shapes and Dimensions of the Printed Image
  • ANSI/INCITS/ISO 1073-2:1976 Alphanumeric Character Sets for Optical Recognition - Part 2: Character Set OCR-B - Shapes and Dimensions of the Printed Image
  • ANSI/INCITS/ISO/IEC 1073-2:1976 Alphanumeric Character Sets for Optical Recognition - Part 2: Character Set OCR-B - Shapes and Dimensions of the Printed Image

Compressed Gas Association (U.S.), imaging collector

International Telecommunication Union (ITU), imaging collector

  • ITU-R BT.1664-2003 Representation of various image aspect ratios into the image of large screen digital imagery applications that use a 16:9 raster
  • ITU-R BT.1664 FRENCH-2003 Representation of various image aspect ratios into the image of large screen digital imagery applications that use a 16:9 raster
  • ITU-R BT.1664 SPANISH-2003 Representation of various image aspect ratios into the image of large screen digital imagery applications that use a 16:9 raster

Lithuanian Standards Office , imaging collector

  • LST EN ISO 11380:2000 Optics and optical instruments - Ophthalmic optics - Formers (ISO 11380:1994)
  • LST EN 14603-2005 Information technology - Alphanumeric glyph image set for optical character recognition OCR-B - Shapes and dimensions of the printed image

IT-UNI, imaging collector

International Commission on Illumination (CIE), imaging collector

  • CIE X036-2010 Proceedings of the CIE Expert Symposium on Spectral and Imaging Methods for Photometry and Radiometry

European Committee for Standardization (CEN), imaging collector

  • PD CEN/TR 16791:2017 Quantifying irradiance for eye-mediated non-imageforming effects of light in humans
  • CEN/TR 16791:2017 Quantifying irradiance for eye-mediated non-image-forming effects of light in humans
  • EN 62148-11:2003 Fibre optic active components and devices — Package and interface standards — Part 11: 14-pin modulator-integrated laser diode transmitters
  • EN ISO 11807-2:2021 Integrated optics - Vocabulary - Part 2: Terms used in classification (ISO 11807-2:2021)
  • EN ISO 14881:2021 Integrated optics - Interfaces - Parameters relevant to coupling properties (ISO 14881:2021)
  • EN 14603:2004 Information technology - Alphanumeric glyph image set for optical character recognition OCR-B - Shapes and dimensions of the printed image

National Metrological Technical Specifications of the People's Republic of China, imaging collector

  • JJF 2044-2023 Calibration Specification for Single Photon Emission Computed Tomography System(SPECT)

IEEE - The Institute of Electrical and Electronics Engineers@ Inc., imaging collector

  • IEEE 538-1976 Low-voltage ac integrally fused power circuit breakers

Aeronautical Radio Inc., imaging collector

CEN - European Committee for Standardization, imaging collector

ES-AENOR, imaging collector

Professional Standard - Aviation, imaging collector

  • HB 8428-2014 Inspecting method for infrared flash thermography of composite materials for aerospace

Society of Motion Picture and Television Engineers (SMPTE), imaging collector

  • SMPTE RP 133-1991 Specifications for Medical Diagnostic Imaging Test Pattern for Television Monitors and Hard-Copy Recording Cameras

Institute of Interconnecting and Packaging Electronic Circuits (IPC), imaging collector





Copyright ©2007-2023 ANTPEDIA, All Rights Reserved