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Shear Strength Measurement Method
Shear Strength Measurement Method, Total:8 items.
In the international standard classification, Shear Strength Measurement Method involves: Semiconductor devices, Electromechanical components for electronic and telecommunications equipment.
International Electrotechnical Commission (IEC), Shear Strength Measurement Method
- IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
American Society for Testing and Materials (ASTM), Shear Strength Measurement Method
- ASTM E229-97 Standard Test Method for Shear Strength and Shear Modulus of Structural Adhesives (Withdrawn 2003)
British Standards Institution (BSI), Shear Strength Measurement Method
- BS EN 62047-25:2016 Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
Association Francaise de Normalisation, Shear Strength Measurement Method
- NF C96-050-25*NF EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
European Committee for Electrotechnical Standardization（CENELEC）, Shear Strength Measurement Method
- EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
ES-UNE, Shear Strength Measurement Method
- UNE-EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January ...
German Institute for Standardization, Shear Strength Measurement Method
- DIN EN 62047-25:2017-04 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
- DIN EN 62047-25:2017 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016