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Mechanical and climatic test methods for semiconductor devices

Mechanical and climatic test methods for semiconductor devices, Total:432 items.

In the international standard classification, Mechanical and climatic test methods for semiconductor devices involves: Semiconductor devices, Acoustics and acoustic measurements, Protection against fire, Mechanical structures for electronic equipment.

Professional Standard - Electron, Mechanical and climatic test methods for semiconductor devices

SJ/Z 9016-1987 Semiconductor devices--Mechanical and climatic test methods

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Mechanical and climatic test methods for semiconductor devices

GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices
GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General
GB/T 4937.2-2006 Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure
GB/T 4937.3-2012 Semiconductor devices.Mechanical and climatic tests methods.Part 3:External visual examination
GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
GB/T 4937.4-2012v Semiconductor Device Mechanical and Climatic Test Methods Part 4: Highly Accelerated Steady State Damp Heat Test (HAST)
GB/T 4937.4-2012 Semiconductor devices.Mechanical and climatic test methods.Part 4:Damp heat,steady state,highly accelerated stress test(HAST)
GB/T 4937.32-2023 Mechanical and climatic test methods for semiconductor devices Part 32: Flammability of plastic encapsulated devices (externally induced)
GB/T 4937.31-2023 Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced)
GB/T 4937.27-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 27: Electrostatic Discharge (ESD) Susceptibility Test Machine Model (MM)
GB/T 4937.26-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM)

International Electrotechnical Commission (IEC), Mechanical and climatic test methods for semiconductor devices

IEC 60749:1984 Semiconductor devices. Mechanical and climatic test methods
IEC 60749:2002 Semiconductor devices - Mechanical and climatic test methods
IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2
IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
IEC 60749-8:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-2:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60749-21:2004 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-10:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-3:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-13:2002 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
IEC 60749-34:2005 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-13:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-34:2004 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
IEC 60749-12:2017 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
IEC 60749-22:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-6:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-19:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
IEC 60749-9:2002 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
IEC 60749-23:2004/AMD1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60749-9:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
IEC 60749-12:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
IEC 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60749-23:2004+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60749-19:2003+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
IEC 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
IEC 60749-18:2002 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
IEC 60749-18:2019 RLV Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
IEC 60749-24:2005 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
IEC 60749-23:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (Edition 1.0; Replaces IEC PAS 62336:2002)
IEC 60749-33:2005 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
IEC 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (Edition 1.0; Replaces IEC PAS 62172:2000)
IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
IEC 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC 60749-15:2020 RLV Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-26:2003 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing; Human body model (HBM)
IEC 60749-27:2003 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing; Machine model (MM)
IEC 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-32:2002/AMD1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-32:2002+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method
IEC 60749-11:2002/COR2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method; Corrigendum 2
IEC 60749-11:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method
IEC 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
IEC 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
IEC 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-32:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
IEC 60749-37:2022 RLV Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC 60749-26:2006 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-27:2006 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-27:2012 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-32:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-31:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60749-27:2006+AMD1:2012 CSV Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60749-41:2020 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
IEC 60749-7/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
IEC 60749-27:2006/AMD1:2012 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60749-20:2002 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-20/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-30:2005+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60749-30:2020 RLV Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60749-7:2002 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
IEC 60749-7:2011 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
IEC 60749-28:2017 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
IEC 60749-28:2022 RLV Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
IEC 60749-28:2022 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
IEC 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-20:2020 RLV Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-30:2005/AMD1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60749-20-1:2019 RLV Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering
IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Korean Agency for Technology and Standards (KATS), Mechanical and climatic test methods for semiconductor devices

KS C IEC 60749:2004 Semiconductor devices－Mechanical and climate test methods
KS C IEC 60749-2004(2020) Semiconductor devices－Mechanical and climate test methods
KS C IEC 60749-1:2006 Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-8:2006 Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-8-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-1-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-1-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-8-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-2:2004 Semiconductor devices－Mechanical and climatic test methods－Part 2：Low air pressure
KS C IEC 60749-21:2005 Semiconductor devices－Mechanical and climatic test methods－ Part 21：Solderability
KS C IEC 60749-10:2004 Semiconductor devices－Mechanical and climatic test methods－Part 10：Mechanical shock
KS C IEC 60749-10:2020 Semiconductor devices — Mechanical and climatic test methods — Part 10: Mechanical shock
KS C IEC 60749-3:2002 Discrete semiconductor devices－Mechanical and climatic test methods－Part 3：External visual examination
KS C IEC 60749-13:2002 Semiconductor devices-Mechanical and climatic test methods-Part 13:Salt atmosphere
KS C IEC 60749-22:2004 Semiconductor devices-Mechanical and climatic test methods-Part 22:Bond strength
KS C IEC 60749-17:2006 Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation
KS C IEC 60749-17:2021 Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
KS C IEC 60749-17-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation
KS C IEC 60749-12:2020 Semiconductor devices — Mechanical and climatic test methods — Part 12: Vibration, variable frequency
KS C IEC 60749-34-2017(2022) Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
KS C IEC 60749-6:2004 Semiconductor devices-Mechanical and climatic test methods-Part 6:Storage at high temperature
KS C IEC 60749-9:2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking
KS C IEC 60749-12:2004 Semiconductor devices-Mechanical and climatictest methods-Part 12:Vibration, variable frequency
KS C IEC 60749-23:2006 Semiconductor devices－Mechanical and climatic test methods－Part 23：High temperature operating life
KS C IEC 60749-9:2003 Semiconductor devices-Mechanical and climatic test methods-Part 9:Permanence of marking
KS C IEC 60749-23:2021 Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
KS C IEC 60749-3:2021 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
KS C IEC 60749-23-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 23：High temperature operating life
KS C IEC 60749-19:2005 Semiconductor devices－Mechanical and climatic test methods－Part 19：Die shear strength
KS C IEC 60749-42:2016 Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage
KS C IEC 60749-42-2016(2021) Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage
KS C IEC 60749-18:2006 Semiconductor devices-Mechanical and climatic test methods-Part 18:Ionizing radiation(total dose)
KS C IEC 60749-18:2021 Semiconductor devices — Mechanical and climatic test methods — Part 18: Ionizing radiation(total dose)
KS C IEC 60749-18-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 18：Ionizing radiation(total dose)
KS C IEC 60749-24-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 24：Accelerated moisture resistance－Unbiased HAST
KS C IEC 60749-24-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 24：Accelerated moisture resistance－Unbiased HAST
KS C IEC 60749-24:2006 Semiconductor devices-Mechanical and climatic test methods-Part 24:Accelerated moisture resistance-Unbiased HAST
KS C IEC 60749-16:2006 Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)
KS C IEC 60749-16-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)
KS C IEC 60749-16-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)
KS C IEC 60749-4:2003 Semiconductor devices－Mechanical and climatic test methods－Part 4：Damp heat, steady state, highly accelerated stress test(HAST)
KS C IEC 60749-14-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)
KS C IEC 60749-14-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)
KS C IEC 60749-31-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 31：Flammability of plastic-encapsulated devices(internally induced)
KS C IEC 60749-32:2021 Semiconductor devices — Mechanical and climatic test methods — Part 32: Flammability of plastic-encapsulated devices(externally induced)
KS C IEC 60749-11:2002 Semiconductor devices－Mechanical and climatic test methods－Part 11：Rapid change of temperature－Two－fluid－bath method
KS C IEC 60749-14:2006 Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)
KS C IEC 60749-31:2006 Semiconductor devices-Mechanical and climatic test methods-Part 31:Flammability of plastic-encapsulated devices(internally induced)
KS C IEC 60749-32:2006 Semiconductor devices－Mechanical and climatic test methods－Part 32：Flammability of plastic-encapsulated devices(externally induced)
KS C IEC 60749-32-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 32：Flammability of plastic-encapsulated devices(externally induced)
KS C IEC 60749-31-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 31：Flammability of plastic-encapsulated devices(internally induced)
KS C IEC 60749-7:2004 Semiconductor devices－Mechanical and climatic test methods－Part 7：Internal moisture content measurement and the analysis of other residual gases
KS C IEC 60749-20:2005 Semiconductor devices－Mechanical and climatic test methods－ Part 20：Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
KS C IEC 60749-39-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39:2006 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

British Standards Institution (BSI), Mechanical and climatic test methods for semiconductor devices

BS EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - General
BS EN 60749-8:2003 Semiconductor devices. Mechanical and climatic test methods. Sealing
BS EN 60749-29:2004 Semiconductor devices - Mechanical and climatic test methods - Latch-up test
BS EN 60749-29:2003 Semiconductor devices - Mechanical and climatic test methods - Part 29:Latch-up test
BS EN 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - External visual examination
BS EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Bond strength
BS EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Acceleration, steady state
BS EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Neutron irradiation
BS EN 60749-34:2004 Semiconductor devices - Mechanical and climatic test methods - Power cycling
BS EN 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Solderability
BS EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Temperature cycling
BS EN 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Storage at high temperature
BS EN 60749-9:2002 Semiconductor devices - Mechanical and climatic test methods - Permanence of marking
BS EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Die shear strength
BS EN 60749-19:2003+A1:2010 Semiconductor devices. Mechanical and climatic test methods. Die shear strength
BS EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - High temperature operating life
BS EN IEC 60749-12:2018 Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency
BS EN 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Robustness of terminations (lead integrity)
BS EN 60749-23:2004+A1:2011 Semiconductor devices. Mechanical and climatic test methods. High temperature operating life
BS EN 60749-42:2014 Semiconductor devices. Mechanical and climatic test methods. Temperature and humidity storage
BS EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods - Ionizing radiation (total dose)
BS EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Particle impact noise detection (PIND)
BS EN 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Accelerated moisture resistance - Unbiased HAST
BS EN 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Accelerated moisture resistance - Unbiased autoclave
BS EN 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Steady-state temperature humidity bias life test
BS EN 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components
BS EN 60749-15:2011 Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
BS EN 60749-15:2003 Semiconductor devices - Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices
BS EN 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Damp heat, steady state, highly accelerated stress test (HAST)
BS EN 60749-15:2010 Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
BS EN 60749-31:2003 Semiconductor devices - Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (internally induced)
BS EN 60749-32:2003 Semiconductor devices - Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (externally induced)
BS EN 60749-32:2003+A1:2010 Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (externally induced)
BS EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
BS EN 60749-27:2006 Semiconductor devices - Mechanical and climatic test methods - Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
BS EN 60749-27:2006+A1:2012 Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
BS EN 60749-26:2006 Semiconductor devices - Mechanical and climatic test methods - Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
BS EN 60749-26:2014 Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
BS EN 60749-7:2002 Semiconductor devices - Mechanical and climatic test methods - Internal moisture content measurement and the analysis of other residual gases
BS EN 60749-44:2016 Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
BS EN 60749-20:2010 Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
BS EN 60749-20:2003 Semiconductor devices - Mechanical and climatic test methods - Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
BS EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
BS EN 60749-28:2017 Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). Device level
BS EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS EN 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
BS EN 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1:Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

国家市场监督管理总局、中国国家标准化管理委员会, Mechanical and climatic test methods for semiconductor devices

GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity）
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

German Institute for Standardization, Mechanical and climatic test methods for semiconductor devices

DIN EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
DIN EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003
DIN EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2002); German version EN 60749-13:2002
DIN EN 60749-2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002
DIN EN 60749-10:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock (IEC 60749-10:2002); German version EN 60749-10:2002
DIN EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection (IEC 60749-3:2002); German version EN 60749-3:2002
DIN EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003
DIN EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 60749-17:2003); German version EN 60749-17:2003
DIN EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state (IEC 60749-36:2003); German version EN 60749-36:2003
DIN EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
DIN EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2002); German version EN 60749-6:2003
DIN EN 60749-12:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2002); German version EN 60749-12:2002
DIN EN 60749-9:2003 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2002); German version EN 60749-9:2002
DIN EN 60749-14:2004 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003
DIN EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2002); German version EN 60749-18:2003
DIN EN 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2004); German version EN 60749-24:2004
DIN EN 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33:2004); German version EN 60749-33:2004
DIN EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
DIN EN 60749-11:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method (IEC 60749-11:2002); German version EN 60749-11:2002
DIN EN 60749-4:2003 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2002); German version EN 60749-4:2002
DIN EN 60749-4:2017-11 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017); German version EN 60749-4:2017 / Note: DIN EN 60749-4 (2003-04) remains valid alongside this stand...
DIN EN 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2003); German version EN 60749-5:2003
DIN EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008); German version EN 60749-38:2008
DIN EN 60749-35:2007 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006
DIN EN 60749-11:2003-04 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method (IEC 60749-11:2002); German version EN 60749-11:2002 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid along...
DIN EN 60749-26:2007 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2006); German version EN 60749-26:2006
DIN EN 60749-31:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31:2002 + Corr. 1:2003); German version EN 60749-31:2003
DIN EN 60749-7:2012 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 60749-7:2011); German version EN 60749-7:2011
DIN EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2010); German version EN 60749-34:2010
DIN EN 60749-7:2012-02 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 60749-7:2011); German version EN 60749-7:2011 / Note: DIN EN 60749-7 (2003-04) remains valid alon...
DIN EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006
DIN EN 60749-23:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011
DIN EN 60749-19:2011 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010
DIN EN 60749-40:2012 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011); German version EN 60749-40:2011
DIN EN 60749-26:2014 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2013); German version EN 60749-26:2014
DIN EN 60749-44:2017 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
DIN EN 60749-15:2011 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010); German version EN 60749-15:2010 + AC:2011
DIN EN 60749-27:2013 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012

Association Francaise de Normalisation, Mechanical and climatic test methods for semiconductor devices

NF C96-022-8*NF EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8 : sealing
NF C96-022-13*NF EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13 : salt atmosphere
NF C96-022-21:2005 Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability.
NF C96-022-21*NF EN 60749-21:2012 Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability
NF C96-022-29*NF EN 60749-29:2012 Semiconductor devices - Mechanical and climatic test methods - Part 29 : latch-up test
NF C96-022-34:2005 Semiconducteur devices - Mechanical and climatic test methods - Part 34 : power cycling.
NF C96-022-25*NF EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25 : temperature cycling.
NF C96-022-34*NF EN 60749-34:2011 Semiconducteur devices - Mechanical and climatic test methods - Part 34 : power cycling
NF C96-022-12*NF EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12 : vibration, variable frequency
NF C96-022-6*NF EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature
NF EN 60749-36:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 36 : accélération constante
NF C96-022-23*NF EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life.
NF C96-022-23/A1*NF EN 60749-23/A1:2012 Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life.
NF C96-022-9*NF EN 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9 : permanence of marking
NF C96-022-42*NF EN 60749-42:2015 Semiconductor devices - Mechanical and climatic test methods - Part 42 : temperature humidity storage
NF C96-022-3*NF EN 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3 : external visual examination
NF C96-022-24*NF EN 60749-24:2005 Semiconductor devices - Mechanical and climatic test methods - Part 24 : accelerated moisture resistance - Unbiased HAST
NF EN IEC 60749-18:2019 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 18 : rayonnements ionisants (dose totale)
NF C96-022-33*NF EN 60749-33:2005 Semiconductor devices - Mechanical and climatic test methods - Part 33 : accelerated moisture resistance - unbiased autoclave
NF EN 60749-11:2002 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 11 : variations rapides de température - Méthode des deux bains
NF C96-022-14*NF EN 60749-14:2004 Semiconductor devices - Mechanical and climatic test methods - Part 14 : robustness of terminations (lead integrity)
NF C96-022-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5 : steady-state temperature humidity bias life test.
NF C96-022-5*NF EN 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5 : steady-state temperature humidity bias life test
NF EN 60749-4:2017 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 4 : essai continu fortement acceléré de contrainte de chaleur humide (HAST)
NF C96-022-40*NF EN 60749-40:2012 Semiconductor devices - Mechanical and climatic test methods - Part 40 : board level drop test method using a strain gauge
NF C96-022-32*NF EN 60749-32:2003 Semiconductor devices - Mechanical and climatic test methods - Part 32 : flammability of plastic-encapsulated devices (externally induced).
NF C96-022-32/A1*NF EN 60749-32/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 32 : flammability of plastic-encapsulated devices (externally induced)
NF C96-022-27/A1*NF EN 60749-27/A1:2013 Semiconductor devices - Mechanical and climatic test methods - Part 27 : electrostatic discharge (ESD) sensivity testing - Machine model (MM)
NF EN 60749-5:2017 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 5 : essai continu de durée de vie sous température et humidité avec polarisation
NF EN 60749-7:2012 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 7 : mesure de la teneur en humidité interne et analyse des autres gaz résiduels
NF C96-022-30*NF EN 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30 : preconditioning of non-hermetic surface mount devices prior to reliability testing.
NF C96-022-39*NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Danish Standards Foundation, Mechanical and climatic test methods for semiconductor devices

DS/EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
DS/EN 60749-8+Corr.2:2004 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
DS/EN 60749-2/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
DS/EN 60749-13/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
DS/EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
DS/EN 60749-10/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
DS/EN 60749-10:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
DS/EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
DS/EN 60749-22+Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strenght
DS/EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test method - Part 3: External visual examination
DS/EN 60749-6/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
DS/EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
DS/EN 60749-12/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
DS/EN 60749-12:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
DS/EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
DS/EN 60749-23/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
DS/EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
DS/EN 60749-3/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
DS/EN 60749-9/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
DS/EN 60749-9:2003 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
DS/EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
DS/EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND)
DS/EN 60749-11/Corr.2:2004 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
DS/EN 60749-11/Corr.1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
DS/EN 60749-11:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
DS/EN 60749-15/AC:2011 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
DS/EN 60749-15:2011 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
DS/EN 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
DS/EN 60749-31+Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
DS/EN 60749-32/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
DS/EN 60749-32+Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
DS/EN 60749-35:2007 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
DS/EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
DS/EN 60749-7:2011 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
DS/EN 60749-20:2010 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
DS/EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

AENOR, Mechanical and climatic test methods for semiconductor devices

UNE-EN 60749-8:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
UNE-EN 60749-1:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
UNE-EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 13: Salt atmosphere.
UNE-EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 17: Neutron irradiation
UNE-EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
UNE-EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
UNE-EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling
UNE-EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature.
UNE-EN 60749-36:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state
UNE-EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-23:2005 Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
UNE-EN 60749-23:2005/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
UNE-EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 18: Ionizing radiation (total dose)
UNE-EN 60749-24:2005 Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST
UNE-EN 60749-15:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
UNE-EN 60749-11:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
UNE-EN 60749-33:2005 Semiconductor devices - Mechanical and climatic test methods -- Part 33: Accelerated moisture resistance - Unbiased autoclave
UNE-EN 60749-32:2004/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
UNE-EN 60749-31:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
UNE-EN 60749-32:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)

European Committee for Electrotechnical Standardization（CENELEC）, Mechanical and climatic test methods for semiconductor devices

EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
EN 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
EN 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration@ variable frequency
EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
EN 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
EN 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
EN IEC 60749-18:2019 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods Part 22: Bond strength
EN 60749-36:2003 Semiconductor devices Mechanical and climatic test methods Part 36: Acceleration, steady state
EN 60749-17:2003 Semiconductor devices Mechanical and climatic test methods Part 17: Neutron irradiation
EN 60749-25:2003 Semiconductor devices Mechanical and climatic test methods Part 25: Temperature cycling
EN 60749-10:2002 Semiconductor Devices - Mechanical and Climatic Test Methods Part 10: Mechanical Shock
EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods Part 8: Sealing
EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods Part 23: High temperature operating life (Incorporates Amendment A1: 2011)
EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods Part 18: Ionizing radiation (total dose)
EN IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
EN 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
EN 60749-24:2004 Semiconductor devices Mechanical and climatic test methods Part 24: Accelerated moisture resistance Unbiased HAST
EN 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
EN 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
EN 60749-33:2004 Semiconductor devices Mechanical and climatic test methods Part 33: Accelerated moisture resistance Unbiased autoclave
EN 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
EN 60749-16:2003 Semiconductor devices Mechanical and climatic test methods Part 16: Particle impact noise detection (PIND)
EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
EN 60749-35:2006 Semiconductor devices Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components
EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods Part 1: General
EN 60749-7:2011 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
EN 60749-5:2003 Semiconductor devices Mechanical and climatic test methods Part 5: Steady-state temperature humidity bias life test
EN 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity)
EN 60749-2:2002 Semiconductor Devices Mechanical and Climatic Test Methods Part 2: Low Air Pressure
EN 60749-27:2006 Semiconductor devices - Mechanical and climatic test methods Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (Incorporates Amendment A1: 2012)
EN 60749-32:2003 Semiconductor devices - Mechanical and climatic test methods Part 32: Flammability of plastic-encapsulated devices (externally induced) (Incorporates Amendment A1: 2010)
EN 60749-31:2003 Semiconductor devices - Mechanical and climatic test methods Part 31: Flammability of plastic-encapsulated devices (internally induced)
EN 60749-12:2002 Semiconductor Devices Mechanical and Climatic Test Methods Part 12: Vibration, Variable Frequency
EN 60749-3:2002 Semiconductor Devices Mechanical and Climatic Test Methods Part 3: External Visual Examination
EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods Part 19: Die shear strength (Incorporating Corrigendum June 2003; Incorporates Amendment A1: 2010)
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN IEC 60749-20:2020 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60749-13:2002 Semiconductor Devices Mechanical and Climatic Test Methods Part 13: Salt Atmosphere
EN 60749-6:2002 Semiconductor Devices Mechanical and Climatic Test Methods Part 6: Storage at High Temperature
EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-9:2002 Semiconductor Devices - Mechanical and Climatic Test Methods Part 9: Permanence of Marking
EN 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (Incorporates Amendment A1: 2011)
EN 60749-4:2002 Semiconductor Devices Mechanical and Climatic Test Methods Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (HAST)
EN 60749-11:2002 Semiconductor Devices Mechanical and Climatic Test Methods Part 11: Rapid Change of Temperature Two-Fluid-Bath Method

CENELEC - European Committee for Electrotechnical Standardization, Mechanical and climatic test methods for semiconductor devices

EN 60749-21:2005 Semiconductor devices Mechanical and climatic test methods Part 21: Solderability
EN IEC 60749-17:2019 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
EN 60749-7:2002 Semiconductor Devices - Mechanical and Climatic Test Methods Part 7: Internal Moisture Content Measurement and the Analysis of Other Residual Gases
EN 60749-20:2003 Semiconductor devices - Mechanical and climatic test methods Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

KR-KS, Mechanical and climatic test methods for semiconductor devices

KS C IEC 60749-10-2020 Semiconductor devices — Mechanical and climatic test methods — Part 10: Mechanical shock
KS C IEC 60749-17-2021 Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
KS C IEC 60749-34-2017 Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
KS C IEC 60749-12-2020 Semiconductor devices — Mechanical and climatic test methods — Part 12: Vibration, variable frequency
KS C IEC 60749-9-2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking
KS C IEC 60749-23-2021 Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
KS C IEC 60749-3-2021 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
KS C IEC 60749-42-2016 Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage
KS C IEC 60749-18-2021 Semiconductor devices — Mechanical and climatic test methods — Part 18: Ionizing radiation(total dose)
KS C IEC 60749-32-2021 Semiconductor devices — Mechanical and climatic test methods — Part 32: Flammability of plastic-encapsulated devices(externally induced)

PH-BPS, Mechanical and climatic test methods for semiconductor devices

PNS IEC 60749-17:2021 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
PNS IEC 60749-42:2021 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
PNS IEC 60749-43:2021 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
PNS IEC 60749-41:2021 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
PNS IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
PNS IEC 60749-30:2021 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
PNS IEC 60749-28:2021 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

PL-PKN, Mechanical and climatic test methods for semiconductor devices

PN T01101-1987 Semiconductor devices Mechanical and climatic test methods [Translation of Publication IEC 749 (1984)]
PN-EN IEC 60749-15-2021-04 E Semiconductor devices--Mechanical and climatic test methods--Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
PN-EN IEC 60749-41-2021-04 E Semiconductor devices -- Mechanical and climatic test methods -- Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020)
PN-EN IEC 60749-20-2021-06 E Semiconductor devices -- Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020)

Lithuanian Standards Office , Mechanical and climatic test methods for semiconductor devices

LST EN 60749-33-2004 Semiconductor devices. Mechanical and climatic test methods - Part 33: Accelerated moisture resistance. Unbiased autoclave (IEC 60749-33:2004)
LST EN 60749-32-2004/A1-2011 Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2002/A1:2010)
LST EN 60749-7-2011 Semiconductor devices - Mechanical and climatic test methods -- Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 60749-7:2011)