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Mechanical and climatic test methods for semiconductor devices Part V

Mechanical and climatic test methods for semiconductor devices Part V, Total:499 items.

In the international standard classification, Mechanical and climatic test methods for semiconductor devices Part V involves: Semiconductor devices, Protection against fire, Mechanical structures for electronic equipment, Acoustics and acoustic measurements.

Professional Standard - Electron, Mechanical and climatic test methods for semiconductor devices Part V

SJ/Z 9016-1987 Semiconductor devices--Mechanical and climatic test methods

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Mechanical and climatic test methods for semiconductor devices Part V

GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices
GB/T 4937.2-2006 Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure
GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General
GB/T 4937.3-2012 Semiconductor devices.Mechanical and climatic tests methods.Part 3:External visual examination
GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
GB/T 4937.4-2012v Semiconductor Device Mechanical and Climatic Test Methods Part 4: Highly Accelerated Steady State Damp Heat Test (HAST)
GB/T 4937.4-2012 Semiconductor devices.Mechanical and climatic test methods.Part 4:Damp heat,steady state,highly accelerated stress test(HAST)
GB/T 4937.32-2023 Mechanical and climatic test methods for semiconductor devices Part 32: Flammability of plastic encapsulated devices (externally induced)
GB/T 4937.31-2023 Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced)
GB/T 4937.27-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 27: Electrostatic Discharge (ESD) Susceptibility Test Machine Model (MM)
GB/T 4937.26-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM)

International Electrotechnical Commission (IEC), Mechanical and climatic test methods for semiconductor devices Part V

IEC 60749:1984 Semiconductor devices. Mechanical and climatic test methods
IEC 60749:2002 Semiconductor devices - Mechanical and climatic test methods
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-10:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-2:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
IEC 60749-8:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
IEC 60749-21:2004 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-3:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2
IEC 60749-13:2002 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
IEC 60749-34:2005 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-13:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-34:2004 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
IEC 60749-12:2017 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
IEC 60749-22:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-6:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-19:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
IEC 60749-9:2002 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
IEC 60749-23:2004/AMD1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60749-9:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
IEC 60749-12:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
IEC 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60749-23:2004+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60749-19:2003+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
IEC 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
IEC 60749-18:2002 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
IEC 60749-18:2019 RLV Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
IEC 60749-33:2005 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
IEC 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (Edition 1.0; Replaces IEC PAS 62172:2000)
IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-24:2005 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
IEC 60749-23:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (Edition 1.0; Replaces IEC PAS 62336:2002)
IEC 60749-32:2002/AMD1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-32:2002+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
IEC 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
IEC 60749-26:2003 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing; Human body model (HBM)
IEC 60749-27:2003 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing; Machine model (MM)
IEC 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
IEC 60749-15:2020 RLV Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-18:2019 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
IEC 60749-41:2020 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
IEC 60749-37:2022 RLV Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-32:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-26:2006 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-27:2006 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60749-32:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-31:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60749-27:2012 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60749-27:2006/AMD1:2012 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60749-7/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method
IEC 60749-11:2002/COR2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method; Corrigendum 2
IEC 60749-11:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method
IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-7:2002 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
IEC 60749-7:2011 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

Korean Agency for Technology and Standards (KATS), Mechanical and climatic test methods for semiconductor devices Part V

KS C IEC 60749:2004 Semiconductor devices－Mechanical and climate test methods
KS C IEC 60749-2004(2020) Semiconductor devices－Mechanical and climate test methods
KS C IEC 60749-10:2004 Semiconductor devices－Mechanical and climatic test methods－Part 10：Mechanical shock
KS C IEC 60749-10:2020 Semiconductor devices — Mechanical and climatic test methods — Part 10: Mechanical shock
KS C IEC 60749-2:2004 Semiconductor devices－Mechanical and climatic test methods－Part 2：Low air pressure
KS C IEC 60749-1:2006 Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-8:2006 Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-8-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-1-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-1-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-8-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-21:2005 Semiconductor devices－Mechanical and climatic test methods－ Part 21：Solderability
KS C IEC 60749-3:2002 Discrete semiconductor devices－Mechanical and climatic test methods－Part 3：External visual examination
KS C IEC 60749-13:2002 Semiconductor devices-Mechanical and climatic test methods-Part 13:Salt atmosphere
KS C IEC 60749-22:2004 Semiconductor devices-Mechanical and climatic test methods-Part 22:Bond strength
KS C IEC 60749-17:2006 Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation
KS C IEC 60749-17:2021 Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
KS C IEC 60749-17-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation
KS C IEC 60749-12:2020 Semiconductor devices — Mechanical and climatic test methods — Part 12: Vibration, variable frequency
KS C IEC 60749-34-2017(2022) Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
KS C IEC 60749-2:2020 Semiconductor devices — Mechanical and climatic test methods — Part 2: Low air pressure
KS C IEC 60749-13:2020 Semiconductor devices — Mechanical and climatic test methods — Part 13: Salt atmosphere
KS C IEC 60749-19:2005 Semiconductor devices－Mechanical and climatic test methods－Part 19：Die shear strength
KS C IEC 60749-6:2004 Semiconductor devices-Mechanical and climatic test methods-Part 6:Storage at high temperature
KS C IEC 60749-9:2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking
KS C IEC 60749-3:2021 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
KS C IEC 60749-21:2020 Semiconductor devices — Mechanical and climatic test methods — Part 21: Solderability
KS C IEC 60749-24-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 24：Accelerated moisture resistance－Unbiased HAST
KS C IEC 60749-24-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 24：Accelerated moisture resistance－Unbiased HAST
KS C IEC 60749-12:2004 Semiconductor devices-Mechanical and climatictest methods-Part 12:Vibration, variable frequency
KS C IEC 60749-23:2006 Semiconductor devices－Mechanical and climatic test methods－Part 23：High temperature operating life
KS C IEC 60749-9:2003 Semiconductor devices-Mechanical and climatic test methods-Part 9:Permanence of marking
KS C IEC 60749-23:2021 Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
KS C IEC 60749-23-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 23：High temperature operating life
KS C IEC 60749-42:2016 Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage
KS C IEC 60749-42-2016(2021) Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage
KS C IEC 60749-6:2020 Semiconductor devices — Mechanical and climatic test methods — Part 6: Storage at high temperature
KS C IEC 60749-22:2020 Semiconductor devices — Mechanical and climatic test methods — Part 22: Bond strength
KS C IEC 60749-18:2006 Semiconductor devices-Mechanical and climatic test methods-Part 18:Ionizing radiation(total dose)
KS C IEC 60749-18:2021 Semiconductor devices — Mechanical and climatic test methods — Part 18: Ionizing radiation(total dose)
KS C IEC 60749-18-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 18：Ionizing radiation(total dose)
KS C IEC 60749-3:2019 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
KS C IEC 60749-24:2006 Semiconductor devices-Mechanical and climatic test methods-Part 24:Accelerated moisture resistance-Unbiased HAST
KS C IEC 60749-32:2021 Semiconductor devices — Mechanical and climatic test methods — Part 32: Flammability of plastic-encapsulated devices(externally induced)
KS C IEC 60749-39-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-4:2003 Semiconductor devices－Mechanical and climatic test methods－Part 4：Damp heat, steady state, highly accelerated stress test(HAST)
KS C IEC 60749-19:2020 Semiconductor devices — Mechanical and climatic test methods — Part 19: Die shear strength
KS C IEC 60749-16:2006 Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)
KS C IEC 60749-16-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)
KS C IEC 60749-16-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)
KS C IEC 60749-39:2006 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-31-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 31：Flammability of plastic-encapsulated devices(internally induced)
KS C IEC 60749-31:2006 Semiconductor devices-Mechanical and climatic test methods-Part 31:Flammability of plastic-encapsulated devices(internally induced)
KS C IEC 60749-32:2006 Semiconductor devices－Mechanical and climatic test methods－Part 32：Flammability of plastic-encapsulated devices(externally induced)
KS C IEC 60749-32-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 32：Flammability of plastic-encapsulated devices(externally induced)
KS C IEC 60749-31-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 31：Flammability of plastic-encapsulated devices(internally induced)
KS C IEC 60749-14-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)
KS C IEC 60749-14-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)
KS C IEC 60749-11:2020 Semiconductor devices — Mechanical and climatic test methods —Part 11: Rapid change of temperature — Two-fluid-bath method
KS C IEC 60749-7:2004 Semiconductor devices－Mechanical and climatic test methods－Part 7：Internal moisture content measurement and the analysis of other residual gases
KS C IEC 60749-11:2002 Semiconductor devices－Mechanical and climatic test methods－Part 11：Rapid change of temperature－Two－fluid－bath method

Danish Standards Foundation, Mechanical and climatic test methods for semiconductor devices Part V

DS/EN 60749-10/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
DS/EN 60749-10:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
DS/EN 60749-2/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
DS/EN 60749-13/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
DS/EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
DS/EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
DS/EN 60749-8+Corr.2:2004 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
DS/EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
DS/EN 60749-22+Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strenght
DS/EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test method - Part 3: External visual examination
DS/EN 60749-6/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
DS/EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
DS/EN 60749-12/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
DS/EN 60749-12:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
DS/EN 60749-2:2003 Semiconductor Devices - Mechanical and climatic test methods - Part 2: Low air pressure
DS/EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
DS/EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
DS/EN 60749-3/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
DS/EN 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
DS/EN 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
DS/EN 60749-23/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
DS/EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
DS/EN 60749-9/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
DS/EN 60749-9:2003 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
DS/EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
DS/EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
DS/IEC 749:1986 Semiconductor devices. Mechanical and climatic test methods
DS/EN 60749-11/Corr.2:2004 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
DS/EN 60749-11/Corr.1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
DS/EN 60749-11:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
DS/EN 60749-19/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
DS/EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND)
DS/EN 60749-15/AC:2011 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
DS/EN 60749-15:2011 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
DS/EN 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
DS/EN 60749-31+Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
DS/EN 60749-32/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
DS/EN 60749-32+Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
DS/EN 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
DS/EN 60749-7:2011 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
DS/EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

KR-KS, Mechanical and climatic test methods for semiconductor devices Part V

KS C IEC 60749-10-2020 Semiconductor devices — Mechanical and climatic test methods — Part 10: Mechanical shock
KS C IEC 60749-17-2021 Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
KS C IEC 60749-34-2017 Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
KS C IEC 60749-12-2020 Semiconductor devices — Mechanical and climatic test methods — Part 12: Vibration, variable frequency
KS C IEC 60749-2-2020 Semiconductor devices — Mechanical and climatic test methods — Part 2: Low air pressure
KS C IEC 60749-13-2020 Semiconductor devices — Mechanical and climatic test methods — Part 13: Salt atmosphere
KS C IEC 60749-9-2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking
KS C IEC 60749-3-2021 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
KS C IEC 60749-21-2020 Semiconductor devices — Mechanical and climatic test methods — Part 21: Solderability
KS C IEC 60749-23-2021 Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
KS C IEC 60749-42-2016 Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage
KS C IEC 60749-22-2020 Semiconductor devices — Mechanical and climatic test methods — Part 22: Bond strength
KS C IEC 60749-6-2020 Semiconductor devices — Mechanical and climatic test methods — Part 6: Storage at high temperature
KS C IEC 60749-18-2021 Semiconductor devices — Mechanical and climatic test methods — Part 18: Ionizing radiation(total dose)
KS C IEC 60749-3-2019 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
KS C IEC 60749-32-2021 Semiconductor devices — Mechanical and climatic test methods — Part 32: Flammability of plastic-encapsulated devices(externally induced)
KS C IEC 60749-19-2020 Semiconductor devices — Mechanical and climatic test methods — Part 19: Die shear strength
KS C IEC 60749-11-2020 Semiconductor devices — Mechanical and climatic test methods —Part 11: Rapid change of temperature — Two-fluid-bath method

German Institute for Standardization, Mechanical and climatic test methods for semiconductor devices Part V

DIN EN 60749-10:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock (IEC 60749-10:2002); German version EN 60749-10:2002
DIN EN 60749-2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002
DIN EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
DIN EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003
DIN EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2002); German version EN 60749-13:2002
DIN EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection (IEC 60749-3:2002); German version EN 60749-3:2002
DIN EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003
DIN EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 60749-17:2003); German version EN 60749-17:2003
DIN EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state (IEC 60749-36:2003); German version EN 60749-36:2003
DIN EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
DIN EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2002); German version EN 60749-6:2003
DIN EN 60749-12:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2002); German version EN 60749-12:2002
DIN EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008); German version EN 60749-38:2008
DIN EN IEC 60749-13:2018-10 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2018); German version EN IEC 60749-13:2018 / Note: DIN EN 60749-13 (2003-04) remains valid alongside this standard until 2021-03-22.
DIN EN 60749-8:2003-12 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standa...
DIN EN 60749-9:2003 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2002); German version EN 60749-9:2002
DIN EN 60749-21:2012-01 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011 / Note: DIN EN 60749-21 (2005-06) remains valid alongside this standard until 2014-05-12.
DIN EN 60749-29:2012-01 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 60749-29:2011); German version EN 60749-29:2011 / Note: DIN EN 60749-29 (2004-07) remains valid alongside this standard until 2014-05-12.
DIN EN 60749-14:2004 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003
DIN EN 60749-34:2011-05 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2010); German version EN 60749-34:2010 / Note: DIN EN 60749-34 (2004-10) remains valid alongside this standard until 2013-12-01.
DIN EN 60749-25:2004-04 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2006-0...
DIN EN 60749-27:2013-04 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012 / Note: DIN EN 60749-27 (2007-01) re...
DIN EN 60749-6:2017-11 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017 / Note: DIN EN 60749-6 (2003-04) remains valid alongside this standard until 2020-04-07.
DIN EN 60749-22:2003-12 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard unti...
DIN EN IEC 60749-12:2018-07 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017); German version EN IEC 60749-12:2018 / Note: DIN EN 60749-12 (2003-04) remains valid alongside this standard until 2021-01-17.
DIN EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2002); German version EN 60749-18:2003
DIN EN 60749-10:2003-04 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock (IEC 60749-10:2002); German version EN 60749-10:2002 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2005-07-01.
DIN EN 60749-36:2003-12 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state (IEC 60749-36:2003); German version EN 60749-36:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until...
DIN EN 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33:2004); German version EN 60749-33:2004
DIN EN 60749-3:2018-01 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017); German version EN 60749-3:2017 / Note: DIN EN 60749-3 (2003-04) remains valid alongside this standard until 2020-04-07.
DIN EN 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2004); German version EN 60749-24:2004
DIN EN IEC 60749-10:2023-06 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (IEC 60749-10:2022); German version EN IEC 60749-10:2022 / Note: Date of issue 2023-05-19*Intended as replacement for DIN EN 60749-10 (200...
DIN EN 60749-2:2003-04 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2005-07-01.
DIN EN 60749-4:2003 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2002); German version EN 60749-4:2002
DIN EN 60749-4:2017-11 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017); German version EN 60749-4:2017 / Note: DIN EN 60749-4 (2003-04) remains valid alongside this stand...
DIN EN 60749-14:2004-07 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside th...
DIN EN 60749-19:2011-01 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 / Note: DIN EN 60749-19 (2003-10) remains valid alongside this standard until 2013-09-01.
DIN EN 60749-9:2017-11 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017); German version EN 60749-9:2017 / Note: DIN EN 60749-9 (2003-04) remains valid alongside this standard until 2020-04-07.
DIN EN 60749-23:2011-07 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011 / Note: DIN EN 60749-23 (2004-10) remains valid alongside this standard unt...
DIN EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
DIN EN 60749-11:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method (IEC 60749-11:2002); German version EN 60749-11:2002
DIN EN 60749-44:2017-04 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
DIN EN 60749-42:2015-05 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (IEC 60749-42:2014); German version EN 60749-42:2014
DIN EN 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2003); German version EN 60749-5:2003
DIN EN 60749-38:2008-10 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008); German version EN 60749-38:2008
DIN EN IEC 60749-18:2020-02 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2019); German version EN IEC 60749-18:2019 / Note: DIN EN 60749-18 (2003-09) remains valid alongside this standard until 2022-05-15.
DIN EN 60749-35:2007 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006
DIN EN 60749-31:2003-12 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31:2002 + Corr. 1:2003); German version EN 60749-31:2003 / Note: Under certain conditions, DIN EN 60749...
DIN EN 60749-32:2011-01 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2002 + Cor. :2003 + A1:2010); German version EN 60749-32:2003 + Cor. :2003 + A1:2010 / Note: DIN EN ...
DIN EN 60749-7:2012 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 60749-7:2011); German version EN 60749-7:2011
DIN EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006
DIN EN 60749-26:2007 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2006); German version EN 60749-26:2006
DIN EN 60749-24:2004-09 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2004); German version EN 60749-24:2004
DIN EN 60749-31:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31:2002 + Corr. 1:2003); German version EN 60749-31:2003
DIN EN 60749-7:2012-02 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 60749-7:2011); German version EN 60749-7:2011 / Note: DIN EN 60749-7 (2003-04) remains valid alon...
DIN EN 60749-1:2003-12 Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003 / Note: DIN EN 60749 (2002-09) remains valid alongside this standard until 2005-10-01.
DIN EN 60749-16:2003-09 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
DIN EN IEC 60749-15:2022-05 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020 / Note: DIN EN 60749-15 (2011-06) remains valid alongs...

European Committee for Electrotechnical Standardization（CENELEC）, Mechanical and climatic test methods for semiconductor devices Part V

EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
EN 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
EN 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration@ variable frequency
EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
EN 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
EN 60749-10:2002 Semiconductor Devices - Mechanical and Climatic Test Methods Part 10: Mechanical Shock
EN 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
EN 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
EN IEC 60749-18:2019 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods Part 22: Bond strength
EN 60749-36:2003 Semiconductor devices Mechanical and climatic test methods Part 36: Acceleration, steady state
EN 60749-17:2003 Semiconductor devices Mechanical and climatic test methods Part 17: Neutron irradiation
EN 60749-25:2003 Semiconductor devices Mechanical and climatic test methods Part 25: Temperature cycling
EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
EN 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
EN IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
EN 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-35:2006 Semiconductor devices Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components
EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods Part 8: Sealing
EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods Part 23: High temperature operating life (Incorporates Amendment A1: 2011)
EN 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
EN 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
EN 60749-7:2011 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods Part 18: Ionizing radiation (total dose)
EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-33:2004 Semiconductor devices Mechanical and climatic test methods Part 33: Accelerated moisture resistance Unbiased autoclave
EN 60749-24:2004 Semiconductor devices Mechanical and climatic test methods Part 24: Accelerated moisture resistance Unbiased HAST

AENOR, Mechanical and climatic test methods for semiconductor devices Part V

UNE-EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 13: Salt atmosphere.
UNE-EN 60749-8:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
UNE-EN 60749-1:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
UNE-EN 60749-10:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 10: Mechanical shock.
UNE-EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 17: Neutron irradiation
UNE-EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
UNE-EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
UNE-EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling
UNE-EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature.
UNE-EN 60749-2:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
UNE-EN 60749-36:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state
UNE-EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-23:2005 Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
UNE-EN 60749-23:2005/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
UNE-EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-12:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 12: Vibration, variable frequency.
UNE-EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 18: Ionizing radiation (total dose)
UNE-EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 3: External visual examination.
UNE-EN 60749-24:2005 Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST
UNE-EN 60749-9:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 9: Permanence of marking.
UNE-EN 60749-15:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
UNE-EN 60749-11:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
UNE-EN 60749-32:2004/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
UNE-EN 60749-31:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
UNE-EN 60749-32:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
UNE-EN 60749-33:2005 Semiconductor devices - Mechanical and climatic test methods -- Part 33: Accelerated moisture resistance - Unbiased autoclave
UNE-EN 60749-16:2003 Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)

Association Francaise de Normalisation, Mechanical and climatic test methods for semiconductor devices Part V

NF C96-022-13*NF EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13 : salt atmosphere
NF C96-022-8*NF EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8 : sealing
NF C96-022-29*NF EN 60749-29:2012 Semiconductor devices - Mechanical and climatic test methods - Part 29 : latch-up test
NF C96-022-21:2005 Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability.
NF C96-022-21*NF EN 60749-21:2012 Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability
NF C96-022-34:2005 Semiconducteur devices - Mechanical and climatic test methods - Part 34 : power cycling.
NF C96-022-25*NF EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25 : temperature cycling.
NF C96-022-34*NF EN 60749-34:2011 Semiconducteur devices - Mechanical and climatic test methods - Part 34 : power cycling
NF C96-022-12*NF EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12 : vibration, variable frequency
NF C96-022-6*NF EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature
NF EN 60749-2:2002 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 2 : basse pression atmosphérique
NF EN 60749-8:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 8 : étanchéité
NF EN 60749-1:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 1 : généralités
NF EN IEC 60749-10:2022 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 10 : Chocs mécaniques - Dispositif et sous-ensemble
NF EN 60749-36:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 36 : accélération constante
NF C96-022-3*NF EN 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3 : external visual examination
NF EN IEC 60749-13:2018 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 13 : atmosphère saline
NF EN 60749-21:2012 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 21 : brasabilité
NF EN 60749-29:2012 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 29 : essai de verrouillage
NF C96-022-23*NF EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life.
NF C96-022-23/A1*NF EN 60749-23/A1:2012 Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life.
NF C96-022-9*NF EN 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9 : permanence of marking
NF C96-022-42*NF EN 60749-42:2015 Semiconductor devices - Mechanical and climatic test methods - Part 42 : temperature humidity storage
NF EN 60749-6:2017 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 6 : stockage à haute température
NF EN 60749-25:2003 Dispositifs de semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 25 : cycles de température
NF EN 60749-34:2011 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 34 : cycles en puissance
NF EN IEC 60749-17:2019 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 17 : irradiation aux neutrons
NF C96-022-10*NF EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10 : mechanical shock
NF EN 60749-38:2008 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 38 : méthode d'essai des erreurs logicielles pour les dispositifs à semiconducteurs avec mémoire
NF C96-022-24*NF EN 60749-24:2005 Semiconductor devices - Mechanical and climatic test methods - Part 24 : accelerated moisture resistance - Unbiased HAST
NF EN IEC 60749-18:2019 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 18 : rayonnements ionisants (dose totale)
NF C96-022-2*NF EN 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2 : low air pressure
NF C96-022-1*NF EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1 : general
NF EN 60749-44:2016 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 44 : méthode d'essai des effets d'un événement isolé (SEE) irradié par un faisceau de neutrons pour des dispositifs à semiconducteurs
NF C96-022-33*NF EN 60749-33:2005 Semiconductor devices - Mechanical and climatic test methods - Part 33 : accelerated moisture resistance - unbiased autoclave
NF EN 60749-3:2017 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3 : examen visuel externe
NF EN 60749-11:2002 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 11 : variations rapides de température - Méthode des deux bains
NF C96-009:1989 Electronic Components Semiconductor devices Mechanical and climatic test methods
NF EN 60749-9:2017 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 9 : permanence du marquage
NF EN IEC 60749-12:2018 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 12 : vibrations, fréquences variables
NF EN 60749-19/A1:2011 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 19 : résistance de la pastille au cisaillement
NF EN 60749-19:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 19 : résistance de la pastille au cisaillement
NF C96-022-44*NF EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44 : neutron beam irradiated single event effect (SEE) test method for semiconductor devices
NF EN 60749-42:2015 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 42 : stockage température et d'humidité
NF C96-022-40*NF EN 60749-40:2012 Semiconductor devices - Mechanical and climatic test methods - Part 40 : board level drop test method using a strain gauge
NF C96-022-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5 : steady-state temperature humidity bias life test.
NF C96-022-5*NF EN 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5 : steady-state temperature humidity bias life test
NF EN 60749-4:2017 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 4 : essai continu fortement acceléré de contrainte de chaleur humide (HAST)
NF C96-022-13:2002 Semiconductor devices - Mechanical and climatic test methods - Part 13 : salt atmosphere.
NF C96-022-19*NF EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength
NF C96-022-17*NF EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17 : neutron irradiation.
NF C96-022-22*NF EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22 : bond strength.
NF C96-022-36*NF EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36 : acceleration steady state
NF C96-022-14*NF EN 60749-14:2004 Semiconductor devices - Mechanical and climatic test methods - Part 14 : robustness of terminations (lead integrity)
NF C96-022-32*NF EN 60749-32:2003 Semiconductor devices - Mechanical and climatic test methods - Part 32 : flammability of plastic-encapsulated devices (externally induced).
NF C96-022-32/A1*NF EN 60749-32/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 32 : flammability of plastic-encapsulated devices (externally induced)
NF EN 60749-22:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 22 : robustesse des contacts soudés
NF EN 60749-23:2004 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 23 : durée de vie en fonctionnement à haute température
NF EN 60749-23/A1:2012 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 23 : durée de vie en fonctionnement à haute température
NF C96-022-27/A1*NF EN 60749-27/A1:2013 Semiconductor devices - Mechanical and climatic test methods - Part 27 : electrostatic discharge (ESD) sensivity testing - Machine model (MM)
NF C96-022-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature.
NF C96-022-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3 : external visual examination.
NF C96-022-39*NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C96-022-38*NF EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38 : soft error test method for semiconductor devices with memory.
NF EN 60749-24:2005 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 24 : résistance à l'humidité accélérée - HAST sans polarisation
NF EN 60749-16:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 16 : détection de bruit d'impact de particules (PIND)
NF C96-022-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12 : vibration, variable frequency.
NF C96-022-9:2002 Semiconductor devices - Mechanical and climatic test methods - Part 9 : permamence of marking.
NF EN IEC 60749-15:2020 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 15 : résistance à la température de brasage pour dispositifs par trous traversants
NF EN 60749-7:2012 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 7 : mesure de la teneur en humidité interne et analyse des autres gaz résiduels

国家市场监督管理总局、中国国家标准化管理委员会, Mechanical and climatic test methods for semiconductor devices Part V

GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity）

British Standards Institution (BSI), Mechanical and climatic test methods for semiconductor devices Part V

BS EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - General
BS EN 60749-8:2003 Semiconductor devices. Mechanical and climatic test methods. Sealing
BS EN 60749-29:2004 Semiconductor devices - Mechanical and climatic test methods - Latch-up test
BS EN 60749-29:2003 Semiconductor devices - Mechanical and climatic test methods - Part 29:Latch-up test
BS EN 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - External visual examination
BS EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Bond strength
BS EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Acceleration, steady state
BS EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Neutron irradiation
BS EN 60749-34:2004 Semiconductor devices - Mechanical and climatic test methods - Power cycling
BS EN 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Solderability
BS EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Temperature cycling
BS EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
BS EN 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Storage at high temperature
BS EN 60749-9:2002 Semiconductor devices - Mechanical and climatic test methods - Permanence of marking
BS EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Die shear strength
BS EN 60749-19:2003+A1:2010 Semiconductor devices. Mechanical and climatic test methods. Die shear strength
BS EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - High temperature operating life
BS EN IEC 60749-12:2018 Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency
BS EN 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Robustness of terminations (lead integrity)
BS EN 60749-23:2004+A1:2011 Semiconductor devices. Mechanical and climatic test methods. High temperature operating life
BS EN 60749-42:2014 Semiconductor devices. Mechanical and climatic test methods. Temperature and humidity storage
BS EN 60749-6:2017 Semiconductor devices. Mechanical and climatic test methods - Storage at high temperature
BS EN 60749-3:2017 Semiconductor devices. Mechanical and climatic test methods - External visual examination
BS EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods - Ionizing radiation (total dose)
BS EN 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components
21/30435579 DC BS EN 60749-10. Semiconductor devices. Mechanical and climatic test methods. Part 10. Mechanical shock. Device and subassembly
BS EN 60749-9:2017 Semiconductor devices. Mechanical and climatic test methods - Permanence of marking
BS EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS EN 60749-44:2016 Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
BS EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Particle impact noise detection (PIND)
BS EN 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Accelerated moisture resistance - Unbiased HAST
BS EN 60749-31:2003 Semiconductor devices - Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (internally induced)
BS EN 60749-32:2003 Semiconductor devices - Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (externally induced)
BS EN 60749-32:2003+A1:2010 Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (externally induced)
BS EN 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Steady-state temperature humidity bias life test
BS EN 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Accelerated moisture resistance - Unbiased autoclave
BS EN 60749-7:2002 Semiconductor devices - Mechanical and climatic test methods - Internal moisture content measurement and the analysis of other residual gases

CENELEC - European Committee for Electrotechnical Standardization, Mechanical and climatic test methods for semiconductor devices Part V

EN 60749-21:2005 Semiconductor devices Mechanical and climatic test methods Part 21: Solderability
EN IEC 60749-17:2019 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
EN 60749-29:2003 Semiconductor devices Mechanical and climatic test methods Part 29: Latch-up test
EN 60749-34:2004 Semiconductor devices Mechanical and climatic test methods Part 34: Power Cycling
EN 60749-7:2002 Semiconductor Devices - Mechanical and Climatic Test Methods Part 7: Internal Moisture Content Measurement and the Analysis of Other Residual Gases
EN 60749-15:2003 Semiconductor devices Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices

PH-BPS, Mechanical and climatic test methods for semiconductor devices Part V

PNS IEC 60749-17:2021 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
PNS IEC 60749-42:2021 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
PNS IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
PNS IEC 60749-43:2021 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
PNS IEC 60749-41:2021 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices

ES-UNE, Mechanical and climatic test methods for semiconductor devices Part V

UNE-EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (Endorsed by Asociación Española de Normalización in May of 2018.)
UNE-EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly (Endorsed by Asociación Española de Normalización in July of 2022.)
UNE-EN 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)
UNE-EN 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (Endorsed by AENOR in November of 2011.)
UNE-EN IEC 60749-17:2019 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (Endorsed by Asociación Española de Normalización in June of 2019.)
UNE-EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (Endorsed by Asociación Española de Normalización in April of 2018.)
UNE-EN 60749-38:2008 Semiconductor devices- Mechanical and climatic test methods- Part 38: Soft error test method for semiconductor devices with memory (Endorsed by AENOR in September of 2008.)
UNE-EN 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (Endorsed by Asociación Española de Normalización in July of 2017.)
UNE-EN 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (Endorsed by Asociación Española de Normalización in July of 2017.)
UNE-EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
UNE-EN 300386 V1.5.1:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
UNE-EN 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (Endorsed by AENOR in November of 2014.)
UNE-EN IEC 60749-18:2019 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (Endorsed by Asociación Española de Normalización in July of 2019.)
UNE-EN IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (Endorsed by Asociación Española de Normalización in November of 2020.)

Lithuanian Standards Office , Mechanical and climatic test methods for semiconductor devices Part V

LST EN 60749-10-2003 Semiconductor devices. Mechanical and climatic test methods. Part 10: Mechanical shock (IEC 60749-10:2002)
LST EN 60749-2-2003 Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure (IEC 60749-2:2002)
LST EN 60749-13-2003 Semiconductor devices. Mechanical and climatic test methods. Part 13: Salt atmosphere (IEC 60749-13:2002)
LST EN 60749-1-2003 Semiconductor devices. Mechanical and climatic test methods. Part 1: General(IEC 60749-1:2002)
LST EN 60749-29-2011 Semiconductor devices - Mechanical and climatic test methods -- Part 29: Latch-up test (IEC 60749-29:2011)
LST EN 60749-38-2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008)
LST EN 60749-21-2011 Semiconductor devices - Mechanical and climatic test methods -- Part 21: Solderability (IEC 60749-21:2011)
LST EN 60749-17-2003 Semiconductor devices. Mechanical and climatic test methods. Part 17: Neutron irradiation (IEC 60749-17:2003)
LST EN 60749-6-2003 Semiconductor devices. Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2002)
LST EN 60749-12-2003 Semiconductor devices. Mechanical and climatic test methods. Part 12: Vibrations, variable frequency (IEC 60749-12:2002)
LST EN 60749-25-2004 Semiconductor devices. Mechanical and climatic test methods. Part 25: Temperature cycling (IEC 60749-25:2003)
LST EN 60749-22-2004 Semiconductor devices. Mechanical and climatic test methods. Part 22: Bond strength (IEC 60749-22:2002)
LST EN 60749-34-2011 Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling (IEC 60749-34:2010)
LST EN 60749-36-2003 Semiconductor devices. Mechanical and climatic test methods. Part 36: Acceleration, steady state (IEC 60749-36:2003)
LST EN 60749-8-2004 Semiconductor devices. Mechanical and climatic test methods. Part 8: Sealing (IEC 60749-8:2002 + corrigendum 2003)
LST EN 60749-3-2003 Semiconductor devices. Mechanical and climatic test methods. Part 3: External visual examination (IEC 60749-3:2002)

PL-PKN, Mechanical and climatic test methods for semiconductor devices Part V

PN T01101-1987 Semiconductor devices Mechanical and climatic test methods [Translation of Publication IEC 749 (1984)]