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How Chip Select
How Chip Select, Total:14 items.
In the international standard classification, How Chip Select involves: Pipeline components and pipelines.
API - American Petroleum Institute, How Chip Select
- API 753-1972 How to Install and Validate Employee SelectiOn Techniques (Second Edition)
ISA - International Society of Automation, How Chip Select
- ISA MES GUD EXEC-2009 MES Guide for Executives - Why and How to Select@ Implement@ and Maintain a Manufacturing Execution System
German Institute for Standardization, How Chip Select
- DIN EN 16602-60-12:2014-12 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs); English version EN 16602-60-12:2014
ES-UNE, How Chip Select
- UNE-EN 16602-60-12:2014 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs) (Endorsed by AENOR in November of 2014.)
IPC - Association Connecting Electronics Industries, How Chip Select
- IPC J-STD-030 CD-2005 Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
Institute of Interconnecting and Packaging Electronic Circuits (IPC), How Chip Select
- IPC J-STD-030-2005 JOINT INDUSTRY STANDARD Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
Association Francaise de Normalisation, How Chip Select
European Telecommunications Standards Institute (ETSI), How Chip Select
- ETSI TR 125 945-2004 Universal Mobile Telecommunications System (UMTS); RF requirements for low chip rate TDD option 3GPP TR 25.945 Version 5.1.0 Release 5
- ETSI TR 125 945-2007 Universal Mobile Telecommunications System (UMTS); RF requirements for low chip rate TDD option
- ETSI TR 125 945-2002 Universal Mobile Telecommunications System (UMTS); RF Requirements for Low Chip Rate TDD Option 3GPP TR 25.945 Version 5.0.0 Release 5
- ETSI TR 125 945-2001 Universal Mobile Telecommunications System (UMTS); RF Requirements for Low Chip Rate TDD Option 3GPP TR 25.945 Version 4.1.1 Release 4
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, How Chip Select
- JEDEC JESD82-29-2009 Definition of the SSTE32882 Registering Clock Driver with Parity and Quad Chip Selects for DDR3 RDIMM Applications
- JEDEC JESD82-29A-2010 Definition of the SSTE32882 Registering Clock Driver with Parity and Quad Chip Selects for DDR3/DDR3L/DDR3U RDIMM 1.5 V/1.35 V/1.25 V Applications
US-CFR-file, How Chip Select
- CFR 13-127.303-2013 Business Credit and Assistance. Part127:Women-owned small business federal contract program. Section127.303:How will SBA select and identify approved certifiers?