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Microelectronic device test methods and procedures

Microelectronic device test methods and procedures, Total:107 items.

In the international standard classification, Microelectronic device test methods and procedures involves: Semiconductor devices, Electromechanical components for electronic and telecommunications equipment, Components for electrical equipment, Transformers. Reactors, Mechanical structures for electronic equipment, Integrated circuits. Microelectronics, Electronic components in general, Electrical accessories, Insulation, Electronic component assemblies, Protection against fire.

Military Standard of the People's Republic of China-General Armament Department, Microelectronic device test methods and procedures

GJB 548B-2005 Test methods and procedures for microelectronic device
GJB 548A-1996 Microelectronic device test methods and procedures
GJB 548C-2021 Microelectronic device test methods and procedures
GJB 548-1988 Microelectronic device test methods and procedures

Group Standards of the People's Republic of China, Microelectronic device test methods and procedures

T/CIE 119-2021 Atmospheric neutron single event effect test methods and procedures for semiconductor devices
T/CIE 116-2021 Electronic Components Fault Tree Analysis Method and Program

RO-ASRO, Microelectronic device test methods and procedures

STAS 8393/17-1-1970 Basic environmental testing procedures for electronic components and electronic equipment DROP AND TOPPLE Testing methods

Association Francaise de Normalisation, Microelectronic device test methods and procedures

NF C20-400:1982 Test Methods Basic Enviromental Testing Procedures Guide for application of environmental tests to electronic components
NF C93-400:1985 Electronic components. Connecting devices. Basic testing procedures and measuring methods.
NF C93-007*NF EN IEC 61007:2020 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures
NF C93-400:1988 Electronic Components Connecting devices Basic testing procedures and measuring methods List of tests
NF C93-400-11-1*NF EN 60512-11-1:1999 Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Part 11 : climatic tests. Section 1 : test 11a. Climatic sequence.
NF C93-400-23-3:2001 Electromechanical components for elctronic equipment - Basic testing procedures and measuring methods - Part 23-3 : test 23c : shielding effectiveness of connectors and accessories.
NF C93-400-14-7*NF EN 60512-14-7:1998 Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. . Part 14 : sealing tests. Section 7 : test 14g : impacting water.
NF C93-400-11-8*NF EN 60512-11-8:1999 Eletromechanical components for electronic equipment. Basic testing procedures and measuring methods. Part 11 : climatic tests. section 8 : test 11h : sand and dust.
NF C93-400-20-2*NF EN 60512-20-2:2001 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2 : test 20b - Flammability tests - Fireproofness.

British Standards Institution (BSI), Microelectronic device test methods and procedures

BS EN 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components
BS EN 60512-1:2001 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - General
BS EN 60512-11-3:2002 Connectors for electronic equipment - Tests and measurements - Climatic tests - Test 11c - Damp heat, steady state
BS 9450:1975 Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures): generic data and methods of test
BS CECC 00009:1982 Harmonized system of quality assessment for electronic components - Basic specification: basic testing procedures and measuring methods for electromechanical components
BS EN 60512-23-3:2001 Connectors for electronic equipment - Tests and measurements - Test 23c - Shielding effectiveness of connectors and accessories
BS EN 160200-2:1998 Harmonized system of quality assessment for electronic components - Sectional specification - Microwave modular electronic units of assessed quality - Index of test methods

European Committee for Electrotechnical Standardization（CENELEC）, Microelectronic device test methods and procedures

EN IEC 61007:2020 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures
EN 62047-15:2015 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
EN 60749-35:2006 Semiconductor devices Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components
EN 160200-2:1997 Sectional Specification: Microwave Modular Electronic Units of Assessed Quality Part 2: Index of Test Methods

Danish Standards Foundation, Microelectronic device test methods and procedures

DS/EN 61007:1998 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures
DS/EN IEC 61007:2021 Transformers and inductors for use in electronic and telecommunication equipment – Measuring methods and test procedures
DS/IEC 512-7:1990 Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Part 7: Mechanical operating tests and sealing tests
DS/IEC 512-7:1995 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests
DS/IEC 512-5:1996 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests

International Electrotechnical Commission (IEC), Microelectronic device test methods and procedures

IEC 61007:1994 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures
IEC 62047-15:2015 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
IEC 60512-9:1992 Electromechanical components for electronic equipment; basic testing procedures and measuring methods; part 9: miscellaneous tests
IEC 61007:2020/COR1:2021 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures; Corrigendum 1
IEC 60512-11-1:1995 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests - Section 1: Test 11a: Climatic sequence
IEC PAS 62162:2000 Filed-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components
IEC 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
IEC 60512-8:1993 Electromechanical components for electronic equipment; basic testing procedures and measuring methods; part 8: connector tests (mechanical) and mechanical tests on contacts and terminations
IEC 60512-7:1993 Electromechanical components for electronic equipment; basic testing procedures and measuring methods; part 7: mechanical operating tests and sealing tests
IEC 60512-23-3:2000/COR1:2003 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories
IEC 60512-20-2:2000 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2: Test 20b - Flammability tests - Fireproofness
IEC 60512-14-7:1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 14: Sealing tests - Section 7: Test 14g: Impacting water
IEC 60512-23-3:2000 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories
IEC 60512-19-3:1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 19: Chemical resistance tests - Section 3: Test 19c: Fluid resistance

German Institute for Standardization, Microelectronic device test methods and procedures

DIN EN 61007:1998 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures (IEC 61007:1994, modified); German version EN 61007:1997
DIN EN 60512-11-8:1999-07 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests; Section 8: Test 11h: Sand and dust (IEC 60512-11-8:1995); German version EN 60512-11-8:1999 / Note: Applies in conjunction...
DIN EN 60749-35:2007 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006
DIN EN 60512-20-2:2001 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2: Test: 20b: Flammability tests; Fireproofness (IEC 60512-20-2:2000); German version EN 60512-20-2:2000
DIN EN 60512-23-3:2001 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories (IEC 60512-23-3:2000); German version EN 60512-23-3:2001

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Microelectronic device test methods and procedures

GB/T 8554-1998 Transformers and inductors for use in electronic and telecommunication equipment. Measuring methods and test procedures

Korean Agency for Technology and Standards (KATS), Microelectronic device test methods and procedures

KS C IEC PAS 62162-2002(2022) Field－induced charged－device model test method for electrostatic discharge withstand thresholds of microelectronic components
KS C IEC 60512-9-2003(2008) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 9：Miscellaneous tests
KS C IEC 60512-8:2004 Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 8:Conenctor tests(mechanical) and mechanical tests on contacts and terminations
KS C IEC 60512-8:2014 Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 8：Conenctor tests(mechanical) and mechanical tests on contacts and terminations
KS C IEC 60512-4-2002(2013) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 4：Dynamic stress tests
KS C IEC 60512-3-2002(2013) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 3：Current－carrying capacity tests
KS C IEC 60512-11-1-2002(2013) Electromechanical components for electronic equipment－Basic testing procedure and measuring methods－Part 11：Climate tests－Section 1：Test 11a－Climatic sequence
KS C IEC PAS 62162:2002 Field－induced charged－device model test method for electrostatic discharge withstand thresholds of microelectronic components
KS C IEC 60512-23-3-2004(2009) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 23－3：Test 23c：Shielding effectiveness of connectors and accessories
KS C IEC 60512-6-2004(2009) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 6：Climatic tests and soldering tests
KS C IEC 60512-11-1:2002 Electromechanical components for electronic equipment-Basic testing procedure and measuring methods-Part 11:Climate tests-Section 1:Test 11a-Climatic sequence
KS C IEC 60512-11-1:2014 Electromechanical components for electronic equipment－Basic testing procedure and measuring methods－Part 11：Climate tests－Section 1：Test 11a－Climatic sequence
KS C IEC 60512-6:2004 Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 6:Climatic tests and soldering tests
KS C IEC 60512-6:2014 Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 6：Climatic tests and soldering tests
KS C IEC 60512-20-2:2004 Electromechanical components for electronic equipment-Basic testing procedures and measuring methods- Part 20-2:Test 20b-Flammability tests-Fireproofness
KS C IEC 60512-7:2004 Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 7:Mechanical operating tests and sealing tests
KS C IEC 60512-7:2014 Electromechanical components for electronic equipment — Basic testing procedures and measuring methods — Part 7: Mechanical operating tests and sealing tests
KS C IEC 60512-20-2:2014 Electromechanical components for electronic equipment-Basic testing procedures and measuring methods- Part 20-2:Test 20b-Flammability tests-Fireproofness
KS C IEC 60512-9:2003 Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 9:Miscellaneous tests
KS C IEC 60512-9:2014 Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 9：Miscellaneous tests
KS C IEC 60512-8-2004(2009) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 8：Conenctor tests(mechanical) and mechanical tests on contacts and terminations
KS C IEC 60512-20-2-2004(2009) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－ Part 20－2：Test 20b－Flammability tests－Fireproofness
KS C IEC 60512-11-8-2004(2009) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 11：Climatic tests－Section 8：Test 11h－Sand and dust
KS C IEC 60512-19-3:2004 Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 19:Chemical resistance tests-Section 3:Test 19c-Fluid resistance
KS C IEC 60512-19-3:2014 Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 19：Chemical resistance tests－Section 3：Test 19c－Fluid resistance
KS C IEC 60512-11-14:2004 Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 11:Climatic tests-Section 14:Test 11p-Flowing single gas corrosion test
KS C IEC 60512-11-14:2014 Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 11：Climatic tests－Section 14：Test 11p－Flowing single gas corrosion test
KS C IEC 60512-11-8:2004 Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 11:Climatic tests-Section 8:Test 11h-Sand and dust
KS C IEC 60512-23-3:2004 Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 23-3:Test 23c:Shielding effectiveness of connectors and accessories
KS C IEC 60512-23-3:2014 Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 23－3：Test 23c：Shielding effectiveness of connectors and accessories
KS C IEC 60512-5-2004(2009) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 5：Impact tests(free components), static load tests(fixed components), endurance tests and over
KS C IEC 60512-19-3-2004(2009) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 19：Chemical resistance tests－Section 3：Test 19c－Fluid resistance
KS C IEC 60512-6-5-2002(2013) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 6：Dynamic stress tests－Section 5：Test 6e：Random vibration
KS C IEC 60512-1-3-2002(2013) Electromechanical components for electronic equipment－Basic testing procedures and measuring methods－Part 1：General examination－Section 3：Test 1c－Electrical engagement length

ES-AENOR, Microelectronic device test methods and procedures

PL-PKN, Microelectronic device test methods and procedures

PN T05128-1988 Electromechanical components tor electronic e?uipment; basie testing procedures and measuring methods Connector tests (mechanical) and mechanical tests on contacts and terminations
PN-EN IEC 61007-2021-04 E Transformers and inductors for use in electronic and telecommunication equipment -- Measuring methods and test procedures (IEC 61007:2020)
PN T05127-1987 Electromechanical components for electronic e?uipment; basie testing procedures and measuring methods Mechanical operating tests and sealing tests
PN-EN IEC 61007-2021-04/AC-2021-08 E Transformers and inductors for use in electronic and telecommunication equipment -- Measuring methods and test procedures (IEC 61007:2020/COR1:2021)
PN T05125-1987 Electromechanical components for electronic e?uipment; basie testing procedures and measuring methods Impact tests (free components) static load tests (fixed components), endurance tests and overload tests

American Society for Testing and Materials (ASTM), Microelectronic device test methods and procedures

ASTM F542-07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
ASTM F459-06 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

AT-OVE/ON, Microelectronic device test methods and procedures

OVE EN IEC 61007:2021 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures (german version)

TR-TSE, Microelectronic device test methods and procedures

TS 2089-1975 BASIC ENVIRONMENTAL TESTING PROCEDURES FOR ELECTRONIC COMPONENTS AND ELECTRONIC EQUIPMENT TEST Ca:DAMP HEAT (STEADY STATE)

American National Standards Institute （ANSI), Microelectronic device test methods and procedures

ANSI/IEEE 1783:2009 Guide for Test Methods and Procedures to Evaluate the Electrical Performance of Insulators in Freezing Conditions

IN-BIS, Microelectronic device test methods and procedures

AENOR, Microelectronic device test methods and procedures

UNE-IEC 60512-7:2005 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests
UNE-IEC 60512-5:2005 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests

Japanese Industrial Standards Committee (JISC), Microelectronic device test methods and procedures

JIS C 5402-20-2:2005 Electromechanical components for electronic equipment -- Basic testing procedures and measuring methods -- Part 20-2: Test 20b -- Flammability tests -- Fireproofness
JIS C 5402-23-3:2005 Electromechanical components for electronic equipment -- Basic testing procedures and measuring methods -- Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories