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chamber slide
chamber slide, Total:43 items.
In the international standard classification, chamber slide involves: Optical equipment, Glass, Equipment for the chemical industry, Surface treatment and coating, Switchgear and controlgear, Telecommunications in general, Electrical accessories, Electronic components in general, Microbiology, Applications of information technology, Integrated circuits. Microelectronics, Powder metallurgy, Materials for aerospace construction.
SE-SIS, chamber slide
工业和信息化部, chamber slide
IN-BIS, chamber slide
TR-TSE, chamber slide
American Society for Testing and Materials (ASTM), chamber slide
- ASTM E211-82(2005) Standard Specification for Cover Glasses and Glass Slides for Use in Microscopy
- ASTM E211-82(2010) Standard Specification for Cover Glasses and Glass Slides for Use in Microscopy
- ASTM E211-82(2022) Standard Specification for Cover Glasses and Glass Slides for Use in Microscopy
Professional Standard - Machinery, chamber slide
Japanese Industrial Standards Committee (JISC), chamber slide
Military Standards (MIL-STD), chamber slide
GOSTR, chamber slide
Professional Standard - Chemical Industry, chamber slide
Society of Automotive Engineers (SAE), chamber slide
- SAE AS5832-2013 ASSEMBLED COUPLING COMPONENTS, THREADLESS-FLEXIBLE, FIXED CAVITY, CURRENT CARRYING, SELF BONDING
- SAE AS5831-2013 ASSEMBLED COUPLING, THREADLESS-FLEXIBLE, FIXED CAVITY, CURRENT CARRYING, SELF BONDING, ENVELOPE DIMENSIONS
- SAE AS7511B-2020 ASSEMBLED COUPLING ENVELOPE, THREADLESS - FLEXIBLE, FIXED CAVITY, CURRENT CARRYING, SELF BONDING, ENVELOPE DIMENSIONS
BELST, chamber slide
- STB 1751-2007 Covering floor and sidewalk. Method of the determination of the slid
Military Standard of the People's Republic of China-General Armament Department, chamber slide
- GJB 4159-2001 General Specification for Ceramic Chip Carrier Sockets
Electronic Components, Assemblies and Materials Association, chamber slide
- ECA 540ACAA-1991 Detail Specification for Chip Carrier (PCC) Family 1.27 mm (.050 Inch) Leadspacing
- ECA 540GAAA-1993 Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment
Professional Standard - Electron, chamber slide
- SJ 20928-2005 Datail specification for ceramic leadless chip carrier
机械电子工业部, chamber slide
German Institute for Standardization, chamber slide
- DIN 58942-3:2003 Medical microbiology - Culture media - Part 3: Dip slides for microbiological urine analysis
SAE - SAE International, chamber slide
- SAE AS7511-2017 ASSEMBLED COUPLING ENVELOPE@ THREADLESS - FLEXIBLE@ FIXED CAVITY@ CURRENT CARRYING@ SELF BONDING@ ENVELOPE DIMENSIONS
- SAE AS7511A-2018 ASSEMBLED COUPLING ENVELOPE, THREADLESS - FLEXIBLE, FIXED CAVITY, CURRENT CARRYING, SELF BONDING, ENVELOPE DIMENSIONS
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, chamber slide
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, chamber slide
- GB/T 16525-1996 Specification of leadframes for plastic leaded chip carrier packages
International Organization for Standardization (ISO), chamber slide
- ISO 8037-2:1997/cor 1:2002 Optics and optical instruments - Microscopes; Slides - Part 2: Quality of material, standards of finish and mode of packaging; Technical Corrigendum 1
British Standards Institution (BSI), chamber slide
- BS ISO 8255-2:2013 Microscopes. Cover glasses. Quality of materials, standards of finish and mode of packaging